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Intel Xeon Scalable Processors Accelerate Big Data Computing in Alibaba Cloud

lun, 14/10/2019 - 16:00

What’s New: Intel and Alibaba Cloud, the data intelligence backbone of Alibaba Group, jointly announced the two companies have optimized big data performance and decision support within the Alibaba Cloud based on Intel® Xeon® Scalable processors. Through their close collaboration, Alibaba Cloud published the industry’s first 100,000 scale factor on Alibaba Cloud MaxCompute cluster running on Intel Xeon Scalable processors, demonstrating Alibaba Cloud’s ability to deliver high-performance, cost-effective cloud services.

“This achievement is a clear example of Intel delivering on its promise to provide customers with what they need to drive innovations in the industry. Our close partnership enables us to deliver Alibaba Cloud MaxCompute the ability to quickly and seamlessly process large amounts of data to deliver actionable insights. We look forward to more such breakthroughs based on Intel’s data-centric product portfolio and optimized solutions.”
–Jason Grebe, Intel corporate vice president and general manager of the Cloud Platforms and Technology Group.

Why It Matters: Alibaba Cloud is the first cloud service provider to release benchmark results on 100TB data; previous records were on 10TB and 30TB data performances. Benchmark results released by the Transaction Processing Performance Council (TPC) are an important reference standard enabling customers to choose the best software and hardware platforms. TPC benchmarks comprehensively measure system performance through the most commonly used big data application scenarios.

  • On the TPCx-BigBench benchmark tests, Alibaba Cloud MaxCompute reached 25,641 BBQpm (Big Bench Query-per-minute) with price/performance ratio of up to $224.49/BBQpm. TPCx-BB measures the performance of hardware and software components of Hadoop-based big data systems.
  • On TPC-DS benchmark tests, Alibaba Cloud’s Elastic MapReduce (EMR) reached 14,861,137 QphDS (queries per hour) and a price/performance ratio of up to $0.18/QphDS.

What Alibaba Says: “Alibaba Cloud has been investing in Big Data analytic technology for about 10 years, and we’re very excited to see our core products, MaxCompute and PAI, represented so well in the international big data performance benchmark, TPCx-BigBench,” said Yangqing Jia, VP of Alibaba Group and President and Senior Fellow of Data Platform, Alibaba Cloud Intelligence. “One of the keys to this achievement is the close collaboration between Alibaba and Intel, which allowed both sides to give full attention to the technology and ecosystem advantages to make this happen. Together, we will continue to deepen innovation and cooperation, to make leading products and technologies, to create more value for the industry, and to drive the development of the digital economy.”

More context: TPCx-BB Advanced Sort Result List | TPC-DS Advanced Sort Result List

More Customer Stories: Intel Customer Spotlight on | Customer Stories on Intel Newsroom

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Media Alert: Intel Customer Spotlight: Live Discussion with Siemens Healthineers

mer, 09/10/2019 - 19:35

On Friday, Oct. 18, 2019, Intel will host a live discussion and Q&A with Siemens Healthineers, a global healthcare market leader in diagnostic imaging that benefits an estimated 5 million patients globally every day.

This is the latest in Intel’s Spotlight Series, which features Intel customers who are transforming their businesses across artificial intelligence (AI), the internet of things (IoT) and other data-centric technologies.

During the Spotlight event, Siemens Healthineers’ Peter Shen, vice president, Business Development, Digital Health, will talk about the company’s current efforts and future vision in driving technology innovation in the healthcare industry, across the continuum of clinical, partner ecosystem and patient experience. The conversation will also dive into one of today’s hot topics of conversation in the health IT field: the role of AI and deep learning in improving personalized medicine and identifying disease pathways, ultimately leading to standard of care delivery – an ambitious goal and win-win for both providers and payers.

Furthermore, Shen will discuss the rapidly-evolving needs in level of performance and privacy that providers expect – and why that requires computing flexibility from the edge to the cloud. He’ll also share what to expect next from Siemens Healthineers’ partnership with Intel.

WHAT: Intel Customer Spotlight Series: Siemens Healthineers

WHEN: 11:15 a.m. PDT, Friday, Oct. 18, 2019

FORMAT: At 11:15 a.m. PDT, moderator Tim Crawford, host of the “CIO in the Know” podcast, will interview Peter Shen for 25 minutes, followed by 15 minutes of open Q&A.

RSVP: Free registration

More Customer Stories: Intel Customer Spotlight on | Customer Stories on Intel Newsroom

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Lenovo and Intel Extend HPC and AI Collaboration with the Flatiron Institute

mer, 09/10/2019 - 17:00
Lenovo and Intel power this reconstruction of the visual system of a tiny wasp, which required 500GB of RAM. (Credit: Flatiron Institute/CCB, Janelia Farm/HHMI, Micro Insect Lab/Moscow State University)
» Click for full image

What’s New: Lenovo and Intel today discussed how their joint technology collaboration to accelerate the convergence of high-performance computing (HPC) and artificial intelligence (AI) is helping scientists at the Flatiron Institute solve scientific challenges in entirely new ways. The mission of the Flatiron Institute in New York City is to advance the frontiers of research in mathematics and the basic sciences.

» Read “Lenovo and Intel Power Galaxy Formation Science and Genomic Research at the Flatiron Institute” on Lenovo’s website

“Breakthrough research, like the amazing work being done at the Flatiron Institute, requires breakthrough technology. Through our close partnership with Lenovo, we are able to deliver these leading technologies, including the only CPU with both AI and HPC acceleration built in, to help Flatiron work to solve some of the world’s most complex issues with faster time to insights.”
–Trish Damkroger, Intel vice president and general manager of its Extreme Computing Organization

Why It’s Important: Flatiron Institute researchers are pursuing advances in biological sciences, astrophysics, quantum physics and computational mathematics. Yet, before the large-scale computing clusters, they were limited in their scientific progress by system constraints that imposed practical limitations in the speed and scope of their system-based research.

“Cosmological simulations like galaxy formation and black hole creation require hundreds of thousands of cores connected to each other to run. Science should dominate our researchers’ time, not computation,” said Dr. Ian Fisk, Scientific Computing Core co-director at the Flatiron Institute.

What Intel and Lenovo Deliver: Lenovo and Intel partnered with the Flatiron Institute to dramatically improve and expand its HPC and AI capabilities, so technologies no longer limit its researchers. Research at the Flatiron Institute is conducted with the help of Lenovo ThinkSystem SD530 Dense Rack servers with Lenovo Neptune™ Thermal Transfer Module (TTM) technology running leading-edge Intel® Xeon® Platinum 8268 processors, part of the 2nd Gen Intel Xeon Scalable family featuring Intel® Deep Learning Boost technology.

Lenovo’s View: “We see high-performance computing and artificial intelligence as the keys to unlocking an entirely new era of untapped potential for customers,” said Scott Tease, general manager for HPC and AI at Lenovo’s Data Center Group. “Seeing some of the greatest minds rely upon our technology to discover answers for some of humanity’s most pressing questions is rewarding. But pushing the boundaries of HPC and AI capabilities even further so more people can benefit is what drives us.”

More Context: Lenovo and Intel Power Galaxy Formation Science and Genomic Research at the Flatiron InstituteData Center News at Intel

More Customer Stories: Intel Customer Spotlight on | Customer Stories on Intel Newsroom

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Intel, Lockheed Martin Collaborate with Systems Providers to Advance Security for Critical Workloads

mar, 08/10/2019 - 14:00

What’s New: Today at the Intel Federal Summit 2019 in Washington, D.C., Intel announced that it has collaborated with industry leaders including Hewlett Packard Enterprise (HPE), Mercury Systems and Supermicro (SMCI) as they ready solutions for market based on the Intel® Select Solutions for Hardened Security with Lockheed Martin. The solutions are built on a foundation of 2nd Generation Intel® Xeon® Scalable processors and provide protection across the entire computing stack, from hardware to software, including hypervisors, operating systems and applications.

“The devastation of cybercrime has rallied the smartest minds within the tech industry to find a new way to architect technology to protect an organization’s most critical data. Our work with Lockheed Martin is being used in production to secure the most sensitive workloads and marks the next level of hardware-based security that is essential for the future of cloud computing at scale, joining a rich set of solutions in the Intel portfolio.”
–William Giard, chief technology officer, Digital Transformation & Scale Solutions, Data Center Group at Intel

Why It Matters: Security remains the number one consideration in how enterprise and government entities evaluate their cloud workloads. Intel is working with industry leaders in the ecosystem like HPE, Mercury Systems and Supermicro to improve the security posture for enterprise and government customers. Infrastructure modernization has not been easy to address in conventional virtual machine (VM) environments due to security, performance, determinism, complexity and cost requirements.

What It Does: The Intel Select Solutions for Hardened Security with Lockheed Martin reference design helps protect high-value data at runtime through a hardened full-stack security solution. Isolation techniques create advanced runtime security domains within a trusted virtualization environment that are resistant to unauthorized modifications and help to mitigate information leakage outside of each isolated runtime security domain.

The Details: The Intel Select Solutions for Hardened Security with Lockheed Martin reference design represents a combination of Intel and Lockheed Martin technologies developed to improve security beginning when the system is powered on, through boot, BIOS load and runtime of applications in a VM environment. It delivers hardware-enforced firewalling that helps separate sensitive data from untrusted workloads, providing cross-domain protection against leakage, modification and privilege escalation. Partitioning and isolation of shared resources (such as cache, cores, memory and devices) in the virtualized environment support confidentiality, integrity and availability, with consistent application performance. Customer benefits include:

  • Boot protections and a chain of trust verify and maintain system integrity from power-on through the launching of critical applications.
  • User controls and security choices to isolate and protect virtualized workloads. Provides segmentation of shared resources such as cores, cache, memory, and devices.
  • More consistent and deterministic performance with isolated VMs through the segmentation and ideal allocation of compute resources.
  • Modernized infrastructure by consolidating multiple, complex and dedicated legacy servers into a simplified and partitioned solution with advanced performance, new security protections and QoS features. Minimizes time, cost and complexity of evaluating and integrating hardware and software.

More Context: Intel Security News

The post Intel, Lockheed Martin Collaborate with Systems Providers to Advance Security for Critical Workloads appeared first on Intel Newsroom.

Intel Enables AI Acceleration and Brings New Pricing to Intel Xeon W and X-Series Processors

lun, 07/10/2019 - 14:00


  • Intel announces the newest generation of Intel® Xeon® W-2200 and X-series platforms, targeting availability in November.
  • With both platforms, Intel continues to trailblaze with artificial intelligence (AI) in computing, enabling AI acceleration with Intel® Deep Learning Boost in high-end desktop (HEDT) PCs and mainstream workstations for the first time.
  • Intel introduces new pricing for Xeon, X-series and select Intel® Core™ processors, continuing its charter to deliver more value and accessibility to customers end-to-end across its portfolio of leadership products.

SANTA CLARA, Calif., Oct. 7, 2019 – Intel today unveiled its latest lineup of Intel Xeon W and X-series processors, which puts new classes of computing performance and AI acceleration into the hands of professional creators and PC enthusiasts. Custom-designed to address the diverse needs of these growing audiences, the new Xeon W-2200 and X-series processors are targeted to be available starting November, along with a new pricing structure that represents an easier step up for creators and enthusiasts from Intel Core S-series mainstream products.

Intel is the only company that delivers a full portfolio of products precision-tuned to handle the sustained compute-intensive workloads used by professional creators and enthusiasts every day. The new Xeon W-2200 and X-series processors take this to the next level, as the first high-end desktop PC and mainstream workstations to feature AI acceleration with the integration of Intel Deep Learning Boost. This offers an AI inference boost of 2.2 times1 more compared with the prior generation. Additionally, this new lineup features Intel® Turbo Boost Max Technology 3.0, which has been further enhanced to help software, such as for simulation and modeling, run as fast as possible by identifying and prioritizing the fastest available cores.

“The professional and enthusiast communities require product engineering that caters to their specific mission-critical needs and keeps them on the cutting edge of technology advancements. This means the best hardware and software optimizations, but also looking at how we can infuse things like AI acceleration,” said Frank Soqui, Intel vice president and general manager of Desktop, Workstation and Channel Group. “No matter if you are a data scientist, cinema creator or freelancer, Intel Xeon W and X-series offer power and flexibility of choice, enabling you to keep working creatively and competitively across even the most intensive workloads.”

» Download all images (ZIP, 51 MB)

The Ultimate Professional Creator Platform

For professional creators, the Intel Xeon W-2200 platform is the ultimate option. These eight new processors (W-2295, W-2275, W-2265, W-2255, W-2245, W-2235, W-2225 and W-2223) deliver outstanding performance and expanded platform capabilities for data science, visual effects, 3D rendering, complex 3D CAD, AI development and edge deployments. They can be used in configurable form-factors – from small desktop to towers – as well as include built-in platform security features and reliability, such as ECC support and Intel vPro™, which creative professionals demand. For example, the 3D architectural rendering process on Autodesk Revit with V-Ray accelerates up to 10 percent faster2 compared with the previous generation and up to 2 times faster compared with a 3-year-old workstation3.

New Xeon W prices range from $294 to $1,333, enabling Intel to build the platform and partners to grow their workstation product options.

For additional product details, visit the Intel Xeon W-2200 product brief.

Bridging the Enthusiast and the Creator

For freelancers, prosumers and desktop enthusiasts who may not need commercial-grade features, Intel Core X-series processors provide the performance with the added flexibility of overclocking4 capabilities. These four new processors (i9-10980XE, i9-10940X, i9-10920X and i9-10900X) are especially suited for advanced workflows that vary in need for photo/video editing, game development and 3D animation. Additionally, they deliver enthusiast-ready enhanced features, like Intel Performance Maximizer that makes it easy to dynamically and reliably custom-tune the unlocked processors based on the X-series’ individual performance DNA.

New X-series prices range from $590 to $979. With the creator segment’s need for more computing-intensive and specific workloads, the new pricing enables X-series to be more accessible to the creators looking for even more compute-intensive workloads than Intel’s mainstream desktop processors.

For additional product details, visit the Intel X-series product brief.

Additional Pricing Refinements

In addition to Intel Xeon W and X-series, Intel is also introducing new pricing to its Intel Core S-series processors without integrated graphics. Intel is committing to these processors in its long-term roadmap, which has given Intel the opportunity to reset where it fits in the portfolio and pricing. The new prices are effective starting today, with the 9th Gen Intel Core desktop processors currently in market.

SKU Tables

» Click for full table (PDF, 119 KB)

» Click for full table (PDF, 127 KB)

Performance results are based on testing as of the date set forth in the configurations and may not reflect all publicly available security updates. See configuration disclosure for details. No product or component can be absolutely secure.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark* and MobileMark*, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information about performance and benchmark results, visit

Intel is a sponsor and member of the BenchmarkXPRT Development Community, and was the major developer of the XPRT family of benchmarks. Principled Technologies is the publisher of the XPRT family of benchmarks. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases.

Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No product or component can be absolutely secure. Check with your system manufacturer or retailer or learn more at

1As measured by AI inference throughput using AIXPRT Community Preview 2 with Int8 precision on ResNet-50 comparing Intel® Xeon® W-2295 vs. Intel® Xeon® W-2195

2 As measured by Autodesk Revit* 3D architectural model rendering workload comparing Intel® Xeon® W-2295 vs. Intel® Xeon® W-2195

3 As measured by Autodesk Revit* 3D architectural model rendering workload comparing Intel® Xeon® W-2295 vs. Intel® Xeon® E5-1680 v4

4Altering clock frequency or voltage may damage or reduce the useful life of the processor and other system components, and may reduce system stability and performance.  Product warranties may not apply if the processor is operated beyond its specifications.  Check with the manufacturers of system and components for additional details. 

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Manufacturing Day: Reinforcing Our Responsibility to Sustainability

ven, 04/10/2019 - 17:00

By Ann Kelleher

Manufacturing Day started seven years ago to inspire more young people to become the manufacturers and innovators of the future. On behalf of Intel, I am happy to join the National Association of Manufacturers in celebration of manufacturing. At Intel, we have long believed that to truly be a leader in manufacturing, we must also advance environmental sustainability and corporate responsibility. For more than two decades, our sustainability practices have enabled us to be more efficient, reduce costs and produce innovative products that create significant value for our customers, investors, employees and community stakeholders.

Our long history of mindful manufacturing started with our co-founder Gordon Moore, who said: “We need to continually improve our manufacturing process, thereby reducing our burden on the environment and becoming an asset to the communities in which we live and work.”

More: Global Manufacturing at Intel | Intel’s Fab 42 in Arizona (Video) | Intel’s Masking Operation (Video)

Put simply: Everything we do today needs to harness the power of manufacturing to make a better tomorrow for everyone.

We’ve learned through the past few decades that long-term investing in sustainability spurs innovation that drives down cost and increases savings. For example, our sustainable water management efforts and partnerships with local watersheds have enabled us to save 64 billion gallons of water since 1998, which is enough water to fill nearly 100,000 Olympic-size swimming pools. Today, we return about 80% of water used in our operations to our communities, and we are on track to meet our goal to restore 100% by 2025.

Since 2008, we have been among the largest voluntary corporate purchasers of green power in the U.S. More than two-thirds of our global power and 100% of our U.S. and EU operations use green power sources. Recently, the EPA recognized us as a corporate leader for using more than 3.8 billion kWh of green power annually from on-site projects, utility programs and Green-e® certified renewable energy certificates. By proactively investing in energy efficiency projects, we’ve saved hundreds of millions of dollars on utility bills while significantly reducing our impact on the environment.

Sustainable building practices also produce long-term savings while benefiting the environment. We have achieved Leadership in Energy and Environmental Design (LEED) certification standards for all new buildings since 2012. Currently, more than 17.4 million square feet of space in 48 buildings have been LEED-certified, roughly the size of 300 football fields.

Our focus on sustainability doesn’t stop with the design and construction of our factories and buildings. Since 2008, we have recycled more than 75% of the total waste generated in our operations, and over the past three years, we’ve increased direct reuse and recovery of our manufacturing waste by 275%. We work to reduce the waste we generate – from metal plating to cafeteria leftovers – while increasing the amount reused, recovered and recycled. In 2018, we reached our goal of recycling 90% of our non-hazardous waste while continuing our efforts toward achieving zero hazardous waste to landfills by 2020.

We also partner with our suppliers to reduce environmental impact. Recently, we collaborated with a supplier to develop an innovative way to replace single-use plastic foam-based packaging with an alternative that can be recycled multiple times. During 2018, this new packaging solution reduced significant amounts of carbon dioxide by eliminating nearly 53,000 pounds of dry ice, 5,300 pounds of pallets and 4,000 pounds of cardboard from shipments of materials to Intel.

The safety and well-being of our employees is also critical to responsible manufacturing. We have a long history of advancing a strong safety culture across our operations, through a range of safety programs, awareness campaigns and training resources, all of which extend beyond our own operations. We have robust programs to educate and engage suppliers that support our global manufacturing operations to drive responsible and sustainable practices throughout the supply chain. Just this week, we were recognized in Ethical Corp.’s Responsible Business Awards for our leadership in supply chain responsibility.

We’re proud to be recognized among the most sustainable companies on the planet, including being named as a sustainability “All Star” by Fortune and as one of the World’s Most Reputable Companies for Corporate Responsibility by Forbes.

However, recognition is not what drives us. As a company, Intel is committed to building technology and products that touch the lives of our customers while leaving a positive impact in the many communities around the world we call home. A key part of this impact is our support of young people in our communities through STEM and mentoring activities that will enable them to become the next generation of engineers and innovators in sustainable manufacturing.

It is this generation who will join us to help build the innovative manufacturing practices of the future and inspire us in ways we haven’t yet imagined.

Ann Kelleher is senior vice president and general manager of Manufacturing and Operations at Intel Corporation.

Photo: Intel’s Ronler Acres campus in Hillsboro, Oregon, is surrounded by both natural and man-made wetlands, which help control floodwater, filter storm water, and provide a natural habitat for plants and animals. (Credit: Walden Kirsch/Intel Corporation)
» Click for full image

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With Hopes of Helping Paralyzed Patients Regain Movement, Intel and Brown University Deploy AI

jeu, 03/10/2019 - 14:00

What’s New: Brown University is exploring concepts with Intel technology for an Intelligent Spine Interface project that aims to use artificial intelligence (AI) technology to restore movement and bladder control for patients paralyzed by severe spinal cord injuries.

“As a Ph.D. student at Brown, I investigated how to interface the brain with machines as an application. Now at Intel, we’re combining our AI expertise with Brown University’s cutting-edge medical research to help solve a critical medical problem: how to reconnect the brain and spine after a major spinal injury.“
–Naveen Rao, Intel corporate vice president and general manager of the AI Products Group

How It Will Work: During the two-year program, researchers will record motor and sensory signals from the spinal cord and use artificial neural networks to learn how to stimulate the post-injury site to communicate motor commands. Surgeons at Rhode Island Hospital near Brown University will implant electrode arrays on both ends of a patient’s injury site, creating an intelligent bypass to eventually allow the severed nerves to communicate in real time. Researchers are considering Intel AI open source software such as nGraph and Intel AI accelerator hardware to meet the real-time requirements of this application.

“A spinal cord injury is devastating, and little is known about how remaining circuits around the injury may be leveraged to support rehabilitation and restoration of lost function. Listening for the first time to the spinal circuits around the injury and then taking action in real time with Intel’s combined AI hardware and software solutions will uncover new knowledge about the spinal cord and accelerate innovation toward new therapies,” said David Borton, assistant professor of engineering, Brown University.

Why It Matters: The human body is unable to regenerate severed nerve fibers. In the case of a severe spinal injury, the brain’s electrical commands will no longer reach the muscles, which can lead to paralysis. The National Spinal Cord Injury Statistical Center estimates there are 291,000 people with spinal cord injuries living in the United States, with more than 17,000 new cases each year. Over 30 percent of those spinal cord injuries result in complete tetraplegia or paraplegia.

More Context: Intel AI for Social Good | Artificial Intelligence at Intel

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Microsoft Unveils First Lakefield Device and New Surface Lineup with 10th Gen Intel Core

mer, 02/10/2019 - 17:00

What’s New: Today, at a launch event in New York City, Microsoft previewed the Surface Neo, a category-defining device co-engineered with Intel. The dual-screen device will be powered by Intel’s unique processor, code-named “Lakefield,” that features an industry-first architecture combining a hybrid CPU with Intel’s Foveros 3D packaging technology. It offers device-makers more flexibility to innovate on design, form factor and experience.

“The innovation we’ve achieved with Lakefield gives our industry partners the ability to deliver on new experiences, and Microsoft’s Neo is trailblazing a new category of devices. Intel is committed to pushing the boundaries of computing by delivering key technology innovations for partners across the ecosystem.”
–Gregory Bryant, Intel executive vice president and general manager of the Client Computing Group

» Click for full infographic

Why It’s Important: Surface Neo is the culmination of deep engineering collaboration between Intel and Microsoft to drive innovation in new form factors, such as dual-screen devices. It exemplifies the companies’ shared vision of advancing the PC industry by delivering remarkable new usages and experiences without compromising on performance, design and the full Windows experience.

Leveraging Intel’s latest 10nm process and Foveros advanced packaging technology, Lakefield achieves a dramatic reduction in package area – a miniscule 12x12x1 mm – that is necessary for pushing the limits of form factor design. Its hybrid CPU architecture combines power efficient “Tremont” cores with a performance scalable “Sunny Cove” core to deliver computing performance and next-generation graphics at low power for long battery life. Lakefield is symbolic of the strategic shift in Intel’s design and engineering model that underpins the company’s future product roadmaps: enabling workload-optimized PC platforms through the right mix of leadership performance, architectures, manufacturing technologies and intellectual properties.

What Else is New: In addition, Microsoft announced new Surface devices based on 10th Gen Intel® Core™ processors: the Surface Pro 7 and the Surface Laptop 3. The new Surface devices bring the intelligent performance, rich and immersive Intel® Iris® Plus graphics experience and best-in-class connectivity1 of 10th Gen Intel Core to consumers and businesses in beautiful premium designs.

What They Offer: The new Surface devices are based on 10th Gen Intel Core processors code-named “Ice Lake” for improved performance and graphics over previous generation Surface devices. Available for pre-order today in select markets.

  • Surface Pro 7 is an ultralight 2 in 1 that offers laptop-to-tablet versatility with a 12.3″ touchscreen. 10th Gen Intel Core processors enable performance, connectivity and entertainment while remaining ultra-slim and light at just 1.70 pounds.
  • Surface Laptop 3 delivers style and speed in 13.5” and 15” touchscreen display options, as well as new colors and finishes. Breeze through professional-grade software and essential apps with 10th Gen Intel Core processors and up to 32GB RAM and 1TB of storage.

More Context: Lakefield Press Kit  |  10th Gen Intel Core Press Kit  |  Intel Architecture Day Fact Sheet

The Small Print:

1Best in Class Wi-Fi 6: Intel® Wi-Fi 6 (Gig+) products support optional 160 MHz channels, enabling the fastest possible theoretical maximum speeds (2402 Mbps) for typical 2×2 802.11 AX PC Wi-Fi products.   Premium Intel® Wi-Fi 6 (Gig+) products enable 2-4X faster maximum theoretical speeds compared standard 2×2 (1201 Mbps) or 1×1 (600 Mbps) 802.11 AX PC Wi-Fi products, which only support the mandatory requirement of 80 MHz channels.

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Intel Appoints Sharon L. Heck as Corporate Treasurer

mar, 01/10/2019 - 17:00

SANTA CLARA, Calif., Oct. 1, 2019 – Intel Corporation today announced that its board of directors has appointed a new corporate treasurer. Sharon L. Heck was promoted to corporate vice president, treasurer and chief tax officer, reporting to Intel CFO George Davis. Heck replaces Intel Corporate Vice President Ravi Jacob, who is retiring after 35 years with the company — including 14 years as treasurer.

“Sharon will continue to lead Intel’s global tax team, in addition to now leading our exceptional treasury team, which is Ravi Jacob’s lasting legacy at Intel,” Davis said. “We are thankful for Ravi’s many years of service, and very pleased to recognize Sharon’s proven leadership ability and breadth of experience with this expanded role.”

Heck joined Intel in 2018 as vice president of finance and director of global tax, after serving in a leadership role at PwC’s U.S. Tax Practice. Prior to PwC, Heck served as Berkshire Hathaway Inc.’s vice president of tax and corporate secretary. She is based in Santa Clara, Calif.

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Karen Walker Joins Intel as Senior Vice President and Chief Marketing Officer

lun, 30/09/2019 - 19:00

Karen Walker, a veteran of more than 20 years of global technology industry marketing, will join Intel as senior vice president and chief marketing officer (CMO), effective Oct. 23. Walker will oversee Intel’s global marketing group and be responsible for building and strengthening Intel’s brand, supporting growth strategies, cultivating opportunities in new and existing markets, and increasing demand for Intel’s products and solutions globally.

“Karen is a truly world-class CMO,” said Bob Swan, Intel’s CEO. “She has deep experience with many of our most valued customers and a keen understanding of what it will take to play an even larger role in their success. We are excited to have Karen on our leadership team.”

Walker joins Intel from Cisco, where she was chief marketing officer since 2015. In that role, she helped lead the company’s evolution to a hybrid business model selling hardware, software, services and software as a service (SaaS) solutions. At Cisco she transformed the marketing function, helping to increase the company’s brand value.

“Intel is an iconic company at a pivotal moment as it transforms to power a world of new possibilities and expanded market opportunities. It is one of the most globally recognized brands with a strong story to tell. I look forward to joining a great team and building the future of technology together,” Walker said.

Before Cisco, Walker also worked at Hewlett-Packard, where she held both business and consumer leadership positions.

Walker serves as a board member of Eli Lilly, Spark Social and the Association of National Advertisers (ANA). She is a graduate of Loughborough University in England. She was awarded an honorary doctorate of business administration from the University of Sunderland in 2018.

Walker will report to Michelle Johnston Holthaus, executive vice president and general manager of Intel’s Sales, Marketing and Communications Group.

The post Karen Walker Joins Intel as Senior Vice President and Chief Marketing Officer appeared first on Intel Newsroom.

Intel Accelerates Data-Centric Technology with Memory and Storage Innovation

jeu, 26/09/2019 - 03:00

» Download “Intel Memory/Storage Day in South Korea (Keynote Replay)”

What’s New: Today at a gathering of global influencers in Seoul, South Korea, Intel outlined a series of new technology milestones and highlighted its ongoing investment and commitment to advance memory and storage in the data-centric computing era. This includes providing customers with unique Intel® Optane™ technology and Intel® 3D NAND solutions for cloud, artificial intelligence and network edge applications.

“The world is generating data at an accelerating rate, and businesses are increasingly becoming overwhelmed with how to efficiently process it. Harvesting value from all this data will be critical in separating the winners from losers. It will require cutting-edge innovation in the memory-and-storage hierarchy, which is what we are driving at Intel.”
–Rob Crooke, Intel senior vice president and general manager of the Non-Volatile Memory Solutions Group

What Intel Announced: Among the milestones discussed at the event were Intel’s plans to operate a new Optane technology development line at its facilities in Rio Rancho, New Mexico; the announcement of the second-generation of Intel Optane DC Persistent Memory, code-named “Barlow Pass,” scheduled for release in 2020 with Intel’s next-generation Intel® Xeon® Scalable processor; and Intel’s industry-first demonstration of 144-layer QLC (Quad Level Cell) NAND for data center SSDs (solid-state drives), which are also expected in 2020.

Rob Crooke, Intel senior vice president and general manager of Non-Volatile Memory Solutions Group, shares Intel’s vision and strategy in Memory and Storage to global press at the Intel Memory/Storage day on Thursday, Sept. 26, 2019, in Seoul, South Korea. (Credit: Intel Corporation)
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Why It Matters: Massive amounts of data being generated by machines generally require real-time analysis to make that data valuable. This need has exposed gaps in the memory storage hierarchy: DRAM isn’t large enough, and SSDs aren’t fast enough. The gap is where Intel Optane DC Persistent Memory shines. And if even bigger data sets are needed, Intel Optane technology connected through storage interfaces fills the gap.

Additionally, hard disk drives increasingly aren’t fast enough for data-centric computing – that’s where the combination of Intel Optane technology plus QLC NAND comes into play. In sum, Intel Optane is a unique combination of materials, structure and performance that other current memory and storage technologies cannot match.

How Customers Leverage Intel Memory and Storage: Multiple customers are leveraging Intel memory and storage solutions, including Microsoft, which is making significant changes to its client operating system to support the many new capabilities and features that Intel Optane persistent memory delivers, such as fast boot and game loading.

Intel also demonstrated its next-generation Intel Optane technology single-port SSD for key enterprise customers, with product availability expected in 2020.

Event Presentations:

More Context: Intel Storage and Memory News | Intel Optane DC Persistent Memory Improves Search, Reduces Costs in Baidu’s Feed Stream Services | Intel Optane Technology and Intel QLC NAND Technology Come Together in Single Drive | Intel Announces Broadest Product Portfolio for Moving, Storing and Processing Data | Driving the New Memory and Storage Frontier in 2019 | Faster Access to More Data (Technical Marketing Brief) | Memory and Storage Technical Series (

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Intel and Alibaba Cloud Sign Strategic MoU Regarding Innovative Technologies in Preparation for the Olympic Games Tokyo 2020 and the Olympic Winter Games Beijing 2022

mer, 25/09/2019 - 08:35

What’s New: At the Apsara Conference 2019, Intel and Alibaba Cloud signed a strategic memorandum of understand (MoU). They announced the organizations would work closely on technology solutions in a variety of areas, including 3D Athlete Tracking (3DAT) for the Olympic Games Tokyo 2020, as well as 360 8K virtual reality (VR), 3D digital twinning and cloud broadcasting for both the Olympic Games Tokyo 2020 and the Olympic Winter Games Beijing 2022. Intel supports these innovation areas through high-performance processors and artificial intelligence (AI) technology platforms. Alibaba Cloud brings its cloud infrastructure and services expertise to the MoU.

“The Olympic motto – Faster, Higher, Stronger – is highly in line with Intel’s innovation DNA. As a worldwide TOP Olympic Partner, Intel is committed to help bringing innovative technologies including AI, 5G and VR into Olympic Games and demonstrating how technology changes the future of Olympic Games and is relevant to consumers and businesses beyond the Games. Intel and Alibaba Cloud are long-term partners and have a common vision of translating technology into amazing experiences that excite athletes, spectators, broadcasters, media, stadium operators, hosting countries and the International Olympic Committee, enabling a more innovative Olympic Games experience.”
–Rick Echevarria, general manager of Intel’s Olympics Program

What Else is Included: In addition to these key technology areas, Intel and Alibaba Cloud will also work closely on other areas that translate leading technologies into better immersive viewing experiences and a more efficient and flexible Olympics broadcasting model; that support smarter athlete training  and smart broadcasting experiences; and that serve the Olympics movement and enable a more innovative Olympic Games experience.

What is the History: Intel has been working closely for many months with Alibaba Cloud on 3DAT for the Olympic Games Tokyo 2020 and other solution areas  for the Olympic Winter Games Beijing 2022, including 360 8K VR, 3D cloud twinning and cloud broadcasting. With this MoU, both parties are signalling their focus to  commercialize and scale these solutions together. The Olympic Games Tokyo 2020 and the Olympic Winter Games Beijing 2022 will be global platforms to fully demonstrate the outcome of this cooperation.

What Alibaba Says: “The Olympic Games are a grand global sports event and the best platform to demonstrate technological innovations in the area of cloud services and infrastructure,” said Selina Yuan, president of Alibaba Cloud Intelligence International. “As Worldwide Olympic Partners, Intel and Alibaba Group are complementary to each other, not only in Olympic sponsorship categories, but also in total innovation development for the Olympic Games and related usage cases.”

What Technology Will This Collaboration Deliver: The strategic MoU involves one technology solution for the Olympic Games Tokyo 2020: 3DAT; and three areas for the Olympic Winter Games Beijing 2022: 360 8K VR, 3D digital twinning and cloud broadcasting. All solutions are based on Alibaba Cloud’s new ECS instance powered by Intel’s 5G and AI technologies, 2nd generation Intel Xeon Scalable processors that power Intel’s scalable transcoding technology, as well as cloud services like ApsaraVideo Live, NAS/OSS, VPC and SAG.

  • The 360 8K VR is an industry leading end-to-end immersive broadcasting solution that provides immersive 360-degree VR video experiences to audiences with 8K definition quality. An efficient application in the 5G environment, the solution eliminates dizziness for VR headset users and increases the bandwidth efficiency by more than 5 times.
  • The 3D digital twinning solution based on 3D digital twinning modeling combines information about smart stadium applications like real-world internet of things (IoT) with a digital twinning virtual world, providing VR-based smart management methods to sports event managers and stadium operators and leveraging 3D digital twinning model and cloud rendering technology to develop track simulation, camera deployment simulation, seat viewing angle simulation, in-stadium navigation service and others, and making it possible for athletes, broadcasters, spectators, venue owners to access 3D twinning-based services through 5G.
  • The cloud broadcasting solution will accelerate the digital transformation of traditional TV broadcasting. The solution moves as much labor-based production efforts into the cloud for processing, improving the efficiency of broadcasting while reducing the cost, but also increasing the broadcasting market size and enabling content creation innovation.
  • The 3D Athlete Tracking solution for the Olympic Games Tokyo 2020 adopts deep learning algorithms and analyzes and extracts data and forms of athletes in training or competition in real time with standard cameras for the development of training or broadcasting applications. Based on athletes’ real-time performance data and forms in training, coaches can timely optimize training methods for each athlete. In broadcasting, athletes’ performance data and form can be timely overlapped on broadcasting images for unprecedented smart-viewing experiences.

What is the Significance: Since becoming a Worldwide Olympic Partner in 2017, Intel is committed to promoting the transformation of the Olympic Games and related experiences by working with partners to develop and deploy innovative technologies. The MoU with Alibaba Cloud will drive the use of many leading innovation technologies at the Olympics and offer new Olympic Games experiences to spectators, athletes and all participants.

More Context: Olympic Games Tokyo 2020 (Press Kit)

The Small Print:

Intel (NASDAQ: INTC) expands the boundaries of technology to make the most amazing experiences possible. In June 2017, Intel joined ‘The Olympic Partner’ (TOP) worldwide sponsorship program to bring its leading technology to enhance the Olympic Games through 2024. Beginning with the Olympic Winter Games in PyeongChang 2018, Intel focuses primarily on infusing its 5G platforms, VR, 3D and 360-degree content development platforms, artificial intelligence platforms and drones, along with other computing solutions to enhance the Olympic Games. Intel will also work across the Olympic Movement and with other Olympic partners to integrate technology into many facets of the Olympic Games. Information about Intel and the work of its more than 100,000 employees can be found at and

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Intel Launches Immersive Highlights with Manchester City Giving Sports Fans New Perspectives

jeu, 19/09/2019 - 18:00

What’s New: Intel Sports expands the power of Intel® True View, the leading immersive media technology in sports, with the introduction of immersive highlights launching with English Premier League Champions Manchester City on Sept. 20. Building on the partnership they started in 2019, Manchester City and Intel have collaborated to bring this interactive experience to fans worldwide for the first time.

“Intel’s pursuit of next-generation immersive media experiences continues with the launch of immersive highlights, marking another step forward in re-imagining the sports experience for fans. Intel and Manchester City share a common goal of leveraging technology to deliver amazing experiences to fans, and we’re thrilled to extend our partnership with the Premier League champions with a new technology launch that will create new ways to tell the story of sports.”
– James Carwana, Intel vice president and general manager of Intel Sports

Why It Matters: Technology creates incredible opportunities for the sporting world, along with new challenges caused by exponential increases in data processing to support the tech. Intel’s computing backbone enables new and immersive user experiences like immersive highlights, enabling sports fans to relive the greatest moments of a match from any angle, right in the palms of their hands.

“The way which our fans consume the sport they love is constantly changing,” said Nuria Tarre, chief marketing officer of City Football Group. “We always want to find new and exciting ways of engaging our global and growing fan base, whether through new technology, great content or fun and engaging platforms. This next step in our relationship with Intel True View combines all three to bring our fans even closer to the action. We are proud to be the first team in the world to hand fans control of how they view immersive highlights. It is another example of how we continue to apply an innovative mindset to connecting with our fans and running our organization in a dynamic and sustainable way.”

Immersive highlights will deliver a completely new view of Manchester City and Etihad Stadium by:

  • Giving fans control over what they want to see from key positions on the pitch, providing more freedom, choice and personalization while watching highlights enabled by Intel True View.
  • Putting fans in the middle of the action to see what it’s like to be on the pitch and better understand key choices and match strategy.

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How It Works: Immersive highlights are captured with Intel True View volumetric video and published to a mobile app where fans can select a player and take control by spinning and shifting the perspective for a complete 360-degree, volumetric vantage point. Fans interact with a video highlight by selecting a single player’s perspective and then swiping or moving the mobile device to view the key moment through the player’s eyes.

Intel True View uses a series of strategically positioned cameras that capture volumetric (pixels with volume) data to create unique 360-degree and 3D game action highlights. Etihad Stadium is equipped with dozens of 5K ultra-high-definition cameras, as well as on-premises Intel servers powered with Intel® Core™ and Intel® Xeon® processors to crunch up to 1 terabyte of data for each 30-second clip.

Where to See It: With immersive highlights, Manchester City fans are gaining exclusive access to a new level of choice and control with their viewing experience. Immersive highlights will be available on the official Manchester City app available for iOS and Android devices: Apple App Store | Google Play Store

More Context: Through partnerships with leading sports organizations like Manchester City, Intel is driving the next wave of powerful technologies that will transform the sports experience for the next generation of fans. For information, visit Intel Sports’ page.

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Intel Ships Stratix 10 DX FPGAs; VMware Among Early Partners

jeu, 19/09/2019 - 15:00

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What’s New: Intel today announced shipments of new Intel® Stratix® 10 DX field programmable gate arrays (FPGA). The new FPGAs are designed to support Intel® Ultra Path Interconnect (Intel® UPI), PCI-Express (PCIe) Gen4 x16 and a new controller for Intel® Optane™ technology to provide flexible, high-performance acceleration. VMware is one of many early access program participants.

“Intel Stratix 10 DX FPGAs are the first FPGAs designed to combine key features that dramatically boost acceleration of workloads in the cloud and enterprise when used with Intel’s portfolio of data center solutions. No other FPGA currently offers this combination of features for server designs based on future select Intel® Xeon® Scalable processors.”
– David Moore, Intel vice president and general manager, FPGA and Power Products, Network and Custom Logic Group

What It Does: Stratix 10 DX FPGAs with the new interfaces1 include the option to support select Intel Optane DC persistent memory dual in-line memory modules (DIMMs). They dramatically increase bandwidth and provide coherent memory expansion and hardware acceleration for upcoming select Intel Xeon Scalable processors.

Why It’s Important: Data center customers increasingly use hardware accelerators, like FPGAs, when more computational speed is required from server systems running networking and cloud-based applications such as artificial intelligence training/inferencing or database-related workloads. The effective performance of hardware accelerators depends heavily on the communications bandwidth and latency between one or more server CPUs, available system memory and any attached accelerator (GPU, FPGA, application-specific standard products, etc.).

By diverting certain tasks to accelerators, more CPU cores become available to work on other higher priority workloads, increasing data center operator efficiency. Intel’s FPGA-based accelerators provide hardware-assisted performance combined with the flexibility to adapt to multiple workloads.

“VMware and Intel have a long history of developing and delivering innovative solutions to the industry. As part of this continued partnership, VMware is collaborating with Intel to develop coherent FPGA and CPU acceleration solutions. Our mutual customers demand high-performing, easy-to-use and reliable infrastructure, both on-premises and in the cloud. Intel is a great partner to us in helping deliver this,” said Krish Prasad, senior vice president and general manager, Cloud Platform Business Unit at VMware.

The Details: When compared with previous FPGA variants, Intel believes that Intel Stratix 10 DX FPGAs will provide new capabilities and interface features including:

  • The UPI interface in combination with future select Intel Xeon Scalable processors will deliver 37% lower latency2 and improve overall system performance via coherent data movement and a theoretical peak transfer rate of 28 GB/second3. Memory coherent FPGA interfaces are part of Intel’s roadmap as we move toward Compute Express Link availability in 2021.
  • PCI-SIG compliant Gen4 x16 interface delivers a theoretical peak data bandwidth of 32 GB/second. Both data center and non-data center applications will realize about two times more throughput4.
  • Memory controller supports up to eight Intel Optane DC persistent memory modules per FPGA (up to 4 TB of non-volatile memory).
  • Other existing Stratix 10 FPGA features include 100 GB/second Ethernet, HBM2 memory stacks and a quad-core ARM Cortex-A53 processor subsystem with peripherals.

More Context: Intel Stratix 10 FPGA website | More FPGA News

The Small Print:

Legal Notices and Disclaimers:Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No product or component can be absolutely secure. Check with your system manufacturer or retailer or learn more at

Results have been estimated or simulated using internal Intel analysis, architecture simulation and modeling, and provided to you for informational purposes. Any differences in your system hardware, software or configuration may affect your actual performance. For more complete information, visit Intel does not control or audit third-party benchmark data or the websites referenced in this document. You should visit the referenced website and confirm whether referenced data are accurate.

1 UPI R&D now, PCIe Gen4 for general use as well as aligned to a future Intel Xeon Scalable Processor.

2 Based on internal Intel estimates for worst case roundtrip latency between the Intel Stratix 10 DX device and future select Intel Xeon Scalable Processor (UPI vs. PCIe read transaction).

3 Based on internal Intel estimates per UPI specification at 11.2 GT/s.

4 PCI-SIG peak theoretical performance PCIe Gen3. vs. PCIe Gen4.

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Intel Promotes Two Corporate Officers

mar, 17/09/2019 - 17:00

SANTA CLARA, Calif., Sept. 17, 2019 – Intel Corporation today announced it has promoted two corporate officers.

“These promotions recognize two strong leaders who have taken a larger role in our organization and in ensuring the success of our customers,” said Intel CEO Bob Swan. “They are role models for the Intel values and the culture evolution at the center of our transformation strategy.”

Gregory Bryant was promoted to executive vice president and will now report directly to the CEO. He is the general manager of the Client Computing Group, Intel’s largest and most profitable business dedicated to client computing solutions. Bryant’s responsibilities include all aspects of running and growing the business: strategy, financial performance and product development for the full portfolio of Intel technologies, processors, chipsets and connectivity solutions designed to enable exceptional personal computing experiences. Bryant joined Intel in 1992 and is based in Hillsboro, Oregon. Michelle Johnston Holthaus was promoted to executive vice president. Holthaus is the general manager of Intel’s Sales, Marketing and Communications Group, reporting to the CEO. She is responsible for global sales and revenue at Intel and leads the company’s efforts to foster innovative sales, marketing and communications approaches that broaden Intel’s business opportunities and enhance customer relationships worldwide. She has developed deep and trusted partnerships with Intel customers and ecosystems partners over many years. Holthaus joined Intel in 1996 and is based in Santa Clara.

“I am proud to have these two excellent leaders partnering with me and the rest of the leadership team to drive growth and success for our customers and our great company,” Swan said.

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Oracle and Intel Collaborate on Optane DC Persistent Memory Performance Breakthroughs in Next-Generation Oracle Exadata X8M

mar, 17/09/2019 - 00:14

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ORACLE OPENWORLD, San Francisco, Sept. 16, 2019 – Intel Corporation and Oracle today announced that Oracle is incorporating the high-performance capabilities of Intel® Optane™ DC persistent memory into its next-generation Exadata platform, Oracle Exadata X8M. Exadata powers Oracle Autonomous Database, Oracle Cloud Applications and the high-performance database infrastructure at most of the world’s leading banks, telecoms and retailers.

Built using industry-standard 2nd generation Intel® Xeon® Scalable processors, Intel Optane DC persistent memory and 100 gigabit RoCE networking, Oracle Exadata X8M is designed to support today’s demanding Online Transaction Processing (OLTP), analytics and mixed workload database requirements, as well as database consolidation and in-database machine learning. This first-of-its-kind integration is designed to provide customers with superior performance for latency-sensitive activities such as high-frequency stock trading, internet of things (IoT) data processing, real-time fraud and intrusion detection, financial trading and applications requiring real-time human interactions.

More: Intel’s Software Optimizations Showcased at Oracle OpenWorld (Lisa Spelman Blog) | Data Center News | Storage and Memory News

“At Intel we’re focused on delivering a platform foundation to enable customers to unleash the value from data. The integration of Intel’s 2nd generation Xeon Scalable processors and Optane DC persistent memory across Oracle’s Exadata X8M products is an extension of our long-term partnership to deliver breakthrough solutions for enterprises across the globe,” said Navin Shenoy, executive vice president and general manager, Data Center Group at Intel. “By enabling faster analytics and enhanced response times, our customers are experiencing what’s possible with Optane DC persistent memory.”

“Our collaboration with Intel sets a new industry standard for supporting databases with the highest performance and availability,” said Juan Loaiza, executive vice president, Mission-Critical Database Technologies at Oracle. “Oracle and Intel have integrated cutting-edge persistent memory technologies into the leading enterprise database machine to deliver real-time access to the most mission-critical data. This transcends the boundaries of conventional shared storage systems and servers that simply cannot keep pace with this level of innovation.”

Intel Optane DC persistent memory is a groundbreaking innovation in the memory-storage hierarchy that combines near-DRAM performance with the data persistence of storage. Enabled on 2nd generation Intel Xeon Scalable processors, Optane DC persistent memory enables greater total memory capacity per platform and much faster, byte-addressable access to persistent data than even the best-in-class SSD.

Exadata X8M’s implementation of Intel Optane DC persistent memory is unique in the industry, since Exadata uses sophisticated remote direct memory access (RDMA) technology to enable the database to directly access persistent memory deployed in smart shared storage servers, bypassing the entire OS, network, and IO software stack. This reduces IO latency in Exadata X8M tenfold compared with the previous Exadata release.

Exadata: 10th Anniversary of Collaboration with Intel

Exadata X8M represents more than 10 years of continuous innovations and deep engineering. Exadata today runs many of the world’s mission-critical applications, including four out of five of the biggest banks, telecoms and retailers. Over 77 percent of the Fortune Global 100 run Exadata. Exadata is the foundation for Oracle Autonomous Database, which uses machine learning to provide a self-driving, self-securing and self-repairing database service that delivers a much more reliable system with outstanding security that makes organizations and developers more productive.

Oracle provides choice and deployment flexibility, enabling customers to use Exadata anywhere – in Oracle Cloud, as the core of Oracle’s unique Gen 2 Exadata Cloud at customer service and on-premises.

Additional Resources

More Customer Stories: Intel Customer Spotlight on | Customer Stories on Intel Newsroom

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Intel Drives Visual Cloud Innovation at IBC2019

ven, 13/09/2019 - 17:09

360-Degree Photo: Lynn Comp, Intel vice president of the Data Center Group, speaks Friday, Sept. 13, 2019 at the first “Visual Cloud Conference” at IBC2019 in Amsterdam. (Credit: Intel Corporation)

Lynn Comp, Intel vice president of the Data Center Group and general manager of the Visual Cloud Division of the Network Platforms Group, addressed the growing market for rich, intelligent visual experiences by bringing together leaders across cloud, network, edge and enterprise at the first “Visual Cloud Conference” at IBC2019 in Amsterdam. As demands for more sophisticated video processing and distribution increase, Intel is accelerating innovation by investing in scalable architectures. It is enabling intelligent visual experiences from the cloud for remote media consumption and delivering the majority of visual cloud services on Intel® Xeon® Scalable processors, with powerful and flexible open source software featuring scalable transcode, analytics and more.

Lynn Comp, vice president of the Data Center Group and general manager of the Visual Cloud Division of the Network Platforms Group at Intel, leads a discussion at the first “Visual Cloud Conference” at IBC2019 on Friday, Sept. 13, 2019 in Amsterdam. Panel members include (from left) Comp; Will Law, chief architect and media cloud engineer at Akamai; Remi Beaudouin, chief strategy officer at Ateme; Phillip Miller, vice president of product management at Chaos Group; Alex Giladi, distinguished architect at Comcast; Lionel Adam, vice president of sales and business development at Gamestream. (Credit: Intel Corporation)
» Click for full imageIntel continues to provide industry-leading technologies to meet the new requirements of enabling acceleration of services innovation globally through best-in-class hardware and software solutions focused on the full potential for delivery optimization. Joining Intel’s diverse, world-class processors are two PCIe card accelerators specifically designed for visual cloud workloads: the Visual Cloud Accelerators Card-Analytics (VCAC-A), optimized for the highest density video analytics acceleration for use in network edge servers, and the Visual Cloud Accelerator Card-Render (VCAC-R), optimized for cloud gaming, graphics, virtual reality (VR) and virtual desktops. Additionally, to accelerate innovation in visual cloud services, Intel continues to invest in open source projects such as the Open Visual Cloud, providing software toolkits and functionality to better address the evolving requirements of media. Also available soon is the new Intel® Select Solutions for Media Analytics powered by Intel Xeon processors and Intel® QuickAssist Technology for software-enabled security, authentication and compression.

Visit the Intel Peer Network page for additional information on the Visual Cloud Conference livestreamed in 8K, 360-degree virtual reality.

More: All Intel Images

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Intel Declares Quarterly Cash Dividend

ven, 13/09/2019 - 14:00

SANTA CLARA, Calif., Sept. 13, 2019 – Intel Corporation today announced that its board of directors has declared a quarterly dividend of $0.315 per share ($1.26 per share on an annual basis) on the company’s common stock. The dividend will be payable on Dec. 1, 2019, to stockholders of record on Nov. 7, 2019.

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Intel Technology Propels Olympic Games Tokyo 2020 into the Future

mer, 11/09/2019 - 08:01
Intel and partners announce technology collaborations for the Olympic Games Tokyo 2020 in areas including artificial intelligence and immersive experiences. (Credit: International Olympic Committee)
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TOKYO, Sept. 11, 2019 — Today, Intel announced that it is partnering with the International Olympic Committee (IOC), the Tokyo Organizing Committee of the Olympic Games (Tokyo 2020) and a broad array of partners to drive the future of the Olympic Games Tokyo 2020 with groundbreaking technology. Intel’s successful collaboration with the PyeongChang 2018 Olympic Games has fueled its drive to raise the bar again in 2020 for how technology will innovate the Olympics.

Press Kit: Olympic Games Tokyo 2020

The Olympic Games provides an opportunity for Intel, as a technology leader, to demonstrate core technologies that enable innovative new experiences for athletes, Games attendees and Olympic fans around the world, leverage the power of computing and accelerate the impact of connection.

“Intel is focused on delivering world-class technology integrations at the Tokyo 2020 Olympic Games to improve the experience for athletes, attendees, viewers and Games staff while also demonstrating how technology can transform businesses. We are excited to make the first of a series of announcements about our role in the Tokyo 2020 Olympic Games,” said Rick Echevarria, general manager of Intel’s Olympics Program. “The Winter Games in PyeongChang represented our first collaboration with the IOC and we look forward to extending and deepening that relationship in the years ahead.”

From innovations that draw on 5G platforms to artificial intelligence (AI) solutions to immersive media to esports, Intel will showcase technology in three focus areas at the Olympic Games Tokyo 2020:  Compute, Connect and Experience.

Compute: Intel is connecting fans and athletes like never before, and enabling new Olympic experiences with technologies involving 3D Athlete Tracking (3DAT) and utilizing the power of virtual reality (VR) to train venue managers.

3DAT: 3D Athlete Tracking is a first-of-its-kind computer vision solution using artificial intelligence to enhance the viewing experience for Olympic fans with near real-time insights and overlay visualizations during athletic events. Developed by Intel and hosted on Intel-based data centers in Alibaba’s cloud infrastructure, 3DAT, in partnership with Olympic Broadcast Services (OBS), uses four pan-tilt mounted, highly mobile cameras to capture the form and motion of athletes, then apply pose estimation algorithms, optimized for Intel® Xeon® processors, to analyze the biomechanics of athletes’ movements. The system transforms that data into broadcast overlay visualizations available during replays of the 100M and other sprinting events.

VR Training: The IOC and Intel are collaborating to define and implement solutions that combine the experience of the IOC and the technical expertise of TOP partner Intel to support the organizing committee becoming operationally ready. VR training will be utilized to create an immersive learning experience for key managers at competition venues. Intel’s VR training system improves training effectiveness with a more realistic experience for those learning with more accurate/objective feedback. Powered by Intel Xeon and Intel® Core™ processors, VR can lower costs and increase training efficiency. The training will also include building digital versions sometimes known as “digital twinning” that can open several opportunities to unleash the power of data for training, planning, simulation and more.

“After a very successful PyeongChang 2018, we’re excited to partner with Intel once again to bring the next era of technology to Olympic Games Tokyo 2020,” said Timo Lumme, managing director of the IOC Television and Marketing Services. “Our extended collaboration with Intel allows us to provide the best experiences and technology to all Olympic fans who attend our events and those viewing in from around the world.”

Connect: Intel is committed to making Tokyo 2020 the most innovative Olympics in history through 5G technologies and infrastructure platforms that are paving the way to develop gigabit connectivity, new mobility solutions, more immersive viewership experiences, cutting-edge smart city applications and advanced broadcasting services.

The Most Trusted Network Technology: Cisco is the local official partner for networking equipment, playing a key role in delivering a connected and secure Olympic Games Tokyo 2020. Intel’s innovative technology like the Intel Xeon processor, SoC and SSD provide the foundation for Cisco to build the secure, reliable and flexible network to support the Olympic Games operations in executing mission-critical networks on the largest stages in the world, connecting 42 competition venues including the Olympics Stadium and non-competition venues such as the athletes’ village, TOCOG headquarters, broadcasting set-ups, hotels and many more.

Experience: Together with partners, Intel is creating Olympic experiences that are more immersive than ever, including NEC facial recognition, and even using Intel AI solutions with the Tokyo Organizing Committee to create the theme song for Tokyo 2020, and an esports event leading up to the Olympic Games Tokyo 2020.

NeoFace: NEC Facial Recognition provides a large-scale facial recognition system “NeoFace” for the Olympic and Paralympic Games in Tokyo. Powered by the Intel Core i5 processor, the facial recognition technology will be used to identify over 300,000 people at the games, including athletes, volunteers, media and other staff for entry points of venues and accommodations. Benefits include helping prevent risks related to identification fraud and reducing long wait times for ID checks.

Intel® True VR: Intel powered the largest scale virtual reality event to date with the Olympic Winter Games PyeongChang 2018 and the first-ever live virtual reality broadcast of the Olympic Games using Intel True VR. Fans can expect an even better immersive experience at the Tokyo 2020 Olympic Games, allowing them to deeply engage in the sports they love to see once every four years. Intel True VR will be deployed in a range of sports and venues for the Tokyo 2020 Olympic Games and content will be distributed by rights-holding broadcasters, including the opening and closing ceremonies, track & field, gymnastics, boxing and beach volleyball.

#2020BeatThe official Tokyo 2020 beat was created from a range of 1,000 different sound samples reflecting the themes of “sports,” “Japanese culture,” “daily lives” and “nature;” five different rhythms were compiled from these using Intel artificial intelligence solutions. This cheerful beat is formed by two parts: call (base rhythm) and response (response rhythm). Audiences will hear the call part and follow the response part to clap their hands. Working with Tokyo Organizing Committee, venues including live theater sites will support athletes to maximize their performance by creating excitement with #2020Beat.

“We’re excited to be partnering with Intel to make Tokyo 2020 the most innovative Olympics in history,” said Masaaki Komiya, vice director general of the Tokyo Organizing Committee of the Olympic Games (TOCOG). “Working together with Olympic partners like Intel will be how the Olympic Games is ushered into the new age of technology and innovation.”

Esports: Intel announced the Intel World Open esports tournament will take place ahead of the Tokyo 2020 Olympic Games, which builds on the first esports experience delivered at Intel® Extreme Masters PyeongChang. The Intel World Open will feature Capcom’s “Street Fighter V” and Psyonix’s “Rocket League,” and kick off with online qualifiers in early 2020 where any player at any level can compete for a chance to join their national team. A live qualifier event in Katowice, Poland, in June will determine which teams will advance to the championship esports tournament in Tokyo from July 22-24, 2020, leading into the Tokyo 2020 Olympic Games. The live finals in Tokyo will host fans at the Zepp DiverCity venue. Intel will power all of the live Intel World Open events with the Intel Core i7 gaming processor, as well as the PCs used in the broadcasts and complete backend infrastructure.

“We are excited Intel is bringing the Intel World Open esports tournament to Japan in the lead up to the Olympic Games Tokyo 2020.  As we explore the engagement between esports and the Olympic Movement we are looking forward to learning from this event and continuing to engage with the passionate esports community from around the world,” said Kit McConnell, IOC Sports Director.

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IFA 2019: Intel Advances the Laptop Experience Together with the Ecosystem

mar, 03/09/2019 - 21:00

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What’s New: At IFA 2019 in Berlin, Intel is showcasing advancements in mobile computing that are driving the next evolution in PCs. The company shared details on new laptops verified through its innovation program code-named “Project Athena” and updates on Intel’s Open Labs, supporting performance and low-power optimization of vendor components for laptops. Throughout the week, new laptops based on the all-new 10th Gen Intel® Core™ processors will be announced from Acer, Asus, Lenovo, MSI and Razer. The 10th Gen Intel Core family includes a range of mobile PC processors that are redefining what’s possible in thin-and-light laptops and 2 in 1s – from next-generation graphics and new artificial intelligence (AI) capabilities to delivering the performance scaling needed for demanding multithreaded workloads.

“With Intel’s unmatched portfolio of leadership IP and technologies, the broad-scale innovation we’re driving across the ecosystem with Project Athena, and deep co-engineering efforts with our partners, we’re bringing next-gen laptop experiences to life. It’s an exciting time for the PC as we celebrate our joint efforts in pushing laptop innovation into the next era.”
–Chris Walker, Intel corporate vice president and general manager, Mobile Client Platforms in the Client Computing Group

New Laptops Verified through Project Athena: Intel’s OEM partners are also announcing new laptop configurations verified to the target specification and key experience indicators of the Project Athena innovation program, which will join Dell Inspiron 14 7000, Dell Latitude 7400 2-in-1Dell XPS 13 2-in-1HP EliteBook x360 1040HP EliteBook x360 1030 G4HP EliteBook x360 830 and Lenovo ThinkPad X1 Carbon. Check back in with the Intel Newsroom throughout the week for the latest news from Intel’s partners at IFA 2019.

Update from IFA: On Sept. 5, 2019, Lenovo unveiled what’s possible through collaboration in a new class of laptops engineered with Intel as part of Project Athena. The Lenovo Yoga C940, Lenovo Yoga S740 and the upcoming Lenovo Yoga S940 with 10th Gen Intel Core processors have been officially verified through Project Athena.

As first revealed in August, laptops verified through Project Athena will feature the “Engineered for Mobile Performance” identifier in signage and product marketing efforts from Intel and its partners. Look for it in stores and online from PC manufacturers and retailers including Best Buy, Costco, Dixons and this holiday season.

“Project Athena-based laptops will deliver what our members desire with improved performance, instant on, intelligence, great battery life and improved connectivity all in new, beautiful, sleek form factors. We’re excited to partner with Intel to be at the forefront of PC innovation,” said Jon Bubitz, general manager for PC Business at Costco.

“Project Athena-based laptops will soon launch on JD, and we are excited to partner with Intel to bring the best user experience to our customer,” said Yalong Li, general manager of the Laptop PC Department,

“With the Project Athena program, Intel and key brand partners are focused on delivering the most innovative devices for our customers,” said Matthew Higginson, head of Category Computing, Windows & Chrome at Dixons Carphone. “Great benefits including improved battery life, beautiful designs and accelerated performance are sure to give them an amazing user experience. We’re excited to feature Project Athena-based laptops at Currys PC World as a great solution for our customers.”

Laptop Components Optimized in Open Labs: Launched in Taipei, Shanghai and Folsom, California, this year, Intel’s Open Labs support performance and low-power optimization of vendor components for laptops aligned to Project Athena. Since opening in June, more than 20 laptop components have been verified for low-power optimization, and Intel continues to work with the industry to expand component assessment and validation.

Among the verified components are solid-state drives, touch controllers, embedded controllers and display panels, which can often have the greatest effect on a device’s performance and power consumption. Enabling component vendor assessment, tuning and compliance at the Open Labs will help drive consistency in delivering Intel’s vision for Project Athena. A list of verified optimized components will be available to OEMs for consideration throughout upcoming product development cycles.

What’s Next: As part of its long-term commitment to advancing innovation with the ecosystem, Intel will be joined by more than 800 members of the PC ecosystem on Sept. 5-6 in Taipei, Taiwan, and Sept. 9-10 in Shanghai, China, for its Ecosystem Symposium series to share insights on the program and discuss future innovation efforts.

More Context: 2019 IFA Press Kit | Project Athena Press Kit | 10th Gen Press Kit

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