10th Gen Intel Core H-series Introduces the World’s Fastest Mobile Processor at 5.3 GHz

Produits Intel - il y a 14 heures 53 min


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What’s New: Today, Intel breaks beyond the 5 GHz barrier for laptops with the launch of the 10th Gen Intel® Core™ H-series mobile processors. Headlined by the 10th Gen Intel Core i9-10980HK1 processor, the H-series delivers desktop-caliber performance that gamers and creators can take anywhere.

“Today’s introduction of the 10th Gen Intel Core H-series mobile platform extends Intel’s gaming leadership, delivering desktop-caliber performance in a mobile form factor and breadth of choice with more than 100 laptop designs launching this year, including more than 30 thin-and-light systems. The new platform is optimized for enthusiasts and creators by delivering the fastest frequency in the industry with 5 GHz across the majority of the volume which will deliver amazing game play and rich creation for users.”
–Fredrik Hamberger, general manager of the premium and gaming laptop segments at Intel

Why It’s Important: Gamers are moving increasingly toward mobile systems and they care about the flexibility of gaming where they want to as much as they do the raw performance of their systems, ranking processor speed in their top three most important features2. Packed with incredible performance typically only available from desktops, 10th Gen Intel Core laptop processors deliver faster performance with up to 5.3 GHz3 Turbo, eight cores and 16 threads to enable immersive gaming experiences with amazing responsiveness and consistent in-game performance. Games and applications continue to depend on high-frequency cores and Intel is pushing the frequency envelope to achieve lower latency and deliver the best PC gaming experience on a laptop.

More about the Fastest Mobile Processor4: At the top of the stack is the 10th Gen Intel Core i9-10980HK, featuring unparalleled performance across the board with up to 5.3 GHz Turbo, eight cores, 16 threads and 16MB of Intel® Smart Cache. The unlocked 10th Gen Intel Core i9-10980HK processor powers the ultimate laptops for gamers and creators, allowing further customization, optimization and tuning of the CPU’s performance.5

Compared with a three-year-old system, the i9-10980HK delivers:

  • Up to 54% more frames per second in gaming6 for even better playability across top titles
  • Up to 44% better overall performance7 for faster, more responsive productivity users can feel
  • Up to two times faster 4K video rendering8 and export9 making it faster and easier to create and share

The 10th Gen Intel Core i7-10750H processor with up to 5.0 GHz3 Turbo is purpose-built for enthusiast gamers and creators demanding optimized performance. Compared with a three-year-old system, i7-10750H delivers:

  • Up to 44% more frames per second in gaming10
  • Up to 33% better overall performance11
  • Up to 70% faster 4K video exporting12

The 10th Gen launch also introduces the new Intel Core i7-10875H, featuring up to 5.1 GHz3 Turbo, eight cores and 16 threads for the growing creator segments, enthusiast  gamers that also enjoy creation, and other demanding multitaskers.

How It is Optimized for Amazing Gaming: Engineered in collaboration with leading PC manufacturers, more than 30 thin-and-light systems measuring 20 mm or less in thickness and 100 designs across consumer, commercial and workstation segments will launch this year. Intel also optimizes laptops with PC-makers to support the latest technologies, including:

  • Integrated Intel® Wi-Fi 6 AX201 (Gig+) supports nearly three times faster downloads13 for high-speed, low-latency wireless performance14
  • Intel® Turbo Boost Max Technology 3.0​
  • Intel® Adaptix™ Dynamic Tuning Technology and Intel® Extreme Tuning Utility for intelligent performance tuning
  • Intel® Speed Optimizer15delivers simple one-click method to overclock1​
  • Thunderbolt™ 3 support with four times more bandwidth than USB 3.1 to move rich media content and connect to two 4K displays with ease
  • Intel® Optane™ memory support16 accelerates game launch and load17
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More Context: 10th Gen Intel Core mobile processors: Product Brief | 10th Gen Intel Core Processors – Amazing Gaming Starts With Intel (Press Kit) | Website

The Small Print: Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors.

Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions.  Any change to any of those factors may cause the results to vary.  You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.   For more complete information visit www.intel.com/benchmarks.

Performance results are based on testing as of dates shown in configurations and may not reflect all publicly available updates.  See backup for configuration details.  No product or component can be absolutely secure.

Your results may vary.

Intel technologies may require enabled hardware, software or service activation.

1 Warning: Altering PC clock or memory frequency and/or voltage may (i) reduce system stability and use life of the system, memory and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel assumes no responsibility that the memory, included if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. Check with memory manufacturer for warranty and additional details.

2 Source: Intel GIA Laptop Buyer Study Q1’20 | Q: Before you purchased this [device], what features were important in deciding which device to buy?

3 Includes the effect of Intel® Thermal Velocity Boost (Intel® TVB), a feature that opportunistically and automatically increases clock frequency above single-core and multi-core Intel® Turbo Boost Technology frequencies based on how much the processor is operating below its maximum temperature and whether turbo power budget is available. The frequency gain and duration is dependent on the workload, capabilities of the processor and the processor cooling solution.

4 Based on Intel® Core™ i9-10980HK’s highest achievable max turbo frequency of 5.3GHz, exceeding all other mobile products available as of April 2020.  Includes use of Intel® Thermal Velocity Boost.   User experience varies with workload

5 (Unlocked) Altering clock frequency or voltage may damage or reduce the useful life of the processor and other system components, and may reduce system stability and performance.  Product warranties may not apply if the processor is operated beyond its specifications.  Check with the manufacturers of system and components for additional details

6 As measured by Red Dead Redemption 2 on Intel® Core™ i9-10980HK vs. Intel® Core™ i7-7920HQ

7 As measured by SYSMark*2018 on Intel® Core™ i9-10980HK vs. Intel® Core™ i7-7820HK

8 As measured by Blender RUG 1013 on Intel® Core™ i9-10980HK vs. Intel® Core™ i7-7820HK

9 As measured by Power Director 4K video export workload RUG 1006 on Intel® Core™ i9-10980HK vs. Intel® Core™ i7-7820HK

10 As measured by Assassin’s Creed Odyssey on Intel® Core™ i7-10750H vs. Intel® Core™ i7-7700HQ

11 As measured by Power Director 4K video export workload RUG 1006 on Intel® Core™ i7-10750H vs. Intel® Core™ i7-7700HQ

12 As measured by SYSMark*2018 on Intel® Core™ i7-10750H vs. Intel® Core™ i7-7700HQ

13 Nearly 3X Faster:  ~3X Faster: Intel Wi-Fi 6 claims are based on internal Intel testing at 3M distance with Wi-Fi 6 (160MHz) average throughput of 1521Mbps verses 802.11ac (80MHz) average throughput of 541 for an improvement of 2.8X.  Testing at a range of 68M yields a 4.2X improvement from 102Mbps average throughput for 802.11ac (80MHz) to 432Mbps average throughput for Wi-Fi 6 (160MHz). Throughput measured in Intel lab with a Dell* Latitude 5491 running Windows 10* on a rotating table (1 revolution per minute) taking the average throughput over multiple tests. Access points used were Asus* AX88U FW: 3.0.0.4.384_5640 (Wi-Fi 6) and Asus* AC66U FW: 3.0.0.4.382_50470.  Wi-Fi 6 improvements requires use of similarly configured Wi-Fi 6 network routers

14 Intel® WiFi 6 AX201 requires specific hardware configurations

15 Features only available on select SKUs

16 As measured by SYSMark*2018 on Intel® Core™ i9-10980HK vs. Intel® Core™ i7-7820HK

17 Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.

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Intel CEO Bob Swan’s Annual Letter

Produits Intel - mar, 31/03/2020 - 15:15

Today, Intel published its 2019 Annual Report including CEO Bob Swan’s annual letter.

The post Intel CEO Bob Swan’s Annual Letter appeared first on Intel Newsroom.

Intel Allocates $6 Million for Coronavirus Relief, Builds on Previous Efforts

Produits Intel - jeu, 26/03/2020 - 17:00
The $6 million in additional donations by Intel will support coronavirus relief efforts in areas – like Washington County, Oregon – where the company has significant operations. (Credit: Intel Corporation)

What’s New: The Intel Foundation will provide $4 million to support coronavirus relief efforts in communities where the company has significant presence. The foundation will also offer a special match opportunity for every regular full-time and part-time employee and U.S. retiree to a total of $2 million for relief efforts around major Intel sites.

The Intel Foundation is committed to improving lives around the world and supporting communities during global crises and natural disasters.

Who It Helps: The $4 million donation will be distributed to community foundations and organizations that are focused on food security, shelter, medical equipment and small-business support.

For the matching donations, Intel has identified strategic organizations unique to each major Intel site. Beneficiaries include food banks, school districts and children’s hospitals
– all groups focused on helping local communities manage the impact of the coronavirus pandemic.

Donation areas in the U.S. include Arizona, California, Massachusetts, New Mexico, Oregon and Texas. Internationally, donation areas include Costa Rica, India, Ireland, Israel, Malaysia, Mexico and Vietnam.

How Matching Donations Work: Donations from employees and U.S. retirees will be matched from March 26 to April 10, or until a total of $2 million is reached.

More Context: These efforts build on previously announced support including a donation of 1 million gloves, masks and other equipment to healthcare workers and a $1 million International Red Cross donation Intel committed to in January. Additionally, Intel is applying technology and expertise to help better understand and combat the virus. For example, Intel NUCs are helping in the coronavirus fight, and Intel and Lenovo have teamed up with Beijing-based BGI Genomics to accelerate the analysis of genomic characteristics of COVID-19.

Even More Context: Intel Coronavirus News

The post Intel Allocates $6 Million for Coronavirus Relief, Builds on Previous Efforts appeared first on Intel Newsroom.

DarwinAI Makes AI Applications More Efficient and Less of a ‘Black Box’ — with Its Own AI

Produits Intel - mar, 24/03/2020 - 17:00
Employees of DarwinAI, an artificial intelligence software startup based in Waterloo, Ontario, gather with company CEO Sheldon Fernandez (seated, center, in the jacket). Credit: DarwinAI

As a student pursuing a doctorate in systems design engineering at the University of Waterloo, Alexander Wong didn’t have enough money for the hardware he needed to run his experiments in computer vision. So he invented a technique to make neural network models smaller and faster.

“He was giving a presentation, and somebody said, ‘Hey, your doctorate work is cool, but you know the real secret sauce is the stuff that you created to do your doctorate work, right?’” recalls Sheldon Fernandez.

Fernandez is the CEO of DarwinAI, the Waterloo, Ontario-based startup now commercializing that secret sauce. Wong is the company’s chief scientist. And Intel is helping the company multiply the performance of its remarkable software, from the data center to edge applications.

“We use other forms of artificial intelligence to probe and understand a neural network in a fundamental way,” says Fernandez, describing DarwinAI’s playbook. “We build up a very sophisticated understanding of it, and then we use AI a second time to generate a new family of neural networks that’s as good as the original, a lot smaller and can be explained.”

That last part is critical: A big challenge with AI, says Fernandez, is that “it’s a black box to its designers.” Without knowing how an AI application functions and makes decisions, developers struggle to improve performance or diagnose problems.

An automotive customer of DarwinAI, for instance, was troubleshooting an automated vehicle with a strange tendency to turn left when the sky was a particular shade of purple. DarwinAI’s solution — which it calls Generative Synthesis — helped the team recognize how the vehicle’s behavior was affected by training for certain turning scenarios that had been conducted in the Nevada desert, coincidentally when the sky was that purple hue (read DarwinAI’s recent deep dive on explainability).

Another way to think about Generative Synthesis, Fernandez explains, is to imagine an AI application that looked at a house designed by a human being, noted the architectural contours, and then designed a completely new one that was stronger and more reliable. “Because it’s AI, it sees efficiencies that would just never occur to a human mind,” Fernandez says. “That’s what we are doing with neural networks.” (A neural network is an approach to break down sophisticated tasks into a large number of simple computations.)

Intel is in the business of making AI not only accessible to everyone, but also faster and easier to use. Through the Intel AI Builders program, Intel has worked with DarwinAI to pair Generative Synthesis with the Intel® Distribution of OpenVINO™ toolkit and other Intel AI software components to achieve order-of-magnitude gains in performance.

In a recent case study, neural networks built using the Generative Synthesis platform coupled with Intel® Optimizations for TensorFlow were able to deliver up to 16.3 times and 9.6 times performance increases on two popular image recognition workloads (ResNet50 and NASNet, respectively) over baseline measurements for an Intel Xeon Platinum 8153 processor.

“Intel and DarwinAI frequently work together to optimize and accelerate artificial intelligence performance on a variety of Intel hardware,” says Wei Li, vice president and general manager of Machine Learning Performance at Intel.

The two companies’ tools are “very complementary,” Fernandez says. “You use our tool and get a really optimized neural network and then you use OpenVINO and the Intel tool sets to actually get it onto a device.”

This combination can deliver AI solutions that are simultaneously compact, accurate and tuned for the device where they are deployed, which is becoming critical with the rise of edge computing.

“AI at the edge is something we’re increasingly seeing,” says Fernandez. “We see the edge being one of the themes that is going to dominate the discussion in the next two, three years.”

In the shadow of coronavirus: Dominating all discussion right now is coronavirus. DarwinAI announced this week that “we have collaborated with researchers at the University of Waterloo’s VIP Lab to develop COVID-Net: a convolutional neural network for COVID-19 detection via chest radiography.” The company has made the source code and dataset available by open source on GitHub. Read about Intel and coronavirus.

More Customer Stories: Intel Customer Spotlight on Intel.com | Customer Stories on Intel Newsroom

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Intel Donates More Than 1 Million Protective Items for Healthcare Workers in Coronavirus Fight

Produits Intel - mar, 24/03/2020 - 00:50


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In response to the COVID-19 pandemic, Intel announced Monday that it will source and donate more than 1 million items of personal protective equipment – masks, gloves and other gear – to healthcare workers.

More: Intel Response to COVID-19 Crisis

“We will donate masks, gloves, face shields and other gear that we have sourced from our factory stock and emergency supplies, and we’ll continue to look for additional sources of personal protective equipment that we can source and donate as quickly as possible to meet our commitment of more than a million items,” said Todd Brady, director of Global Public Affairs for Intel.

Intel leaders are working with local health authorities and government agencies around the world. In January, Intel announced a $1 million donation to the International Red Cross to support global relief efforts for the coronavirus outbreak. Where possible, current and future donations will be made through local health authorities that can determine the areas of greatest need.

“We are immensely grateful to the healthcare workers who are at the front lines of slowing this pandemic,” Brady said.

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Intel Scales Neuromorphic Research System to 100 Million Neurons

Produits Intel - mer, 18/03/2020 - 16:15


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What’s New: Today, Intel announced the readiness of Pohoiki Springs, its latest and most powerful neuromorphic research system providing the computational capacity of 100 million neurons. The cloud-based system will be made available to members of the Intel Neuromorphic Research Community (INRC), extending their neuromorphic work to solve larger, more complex problems.

“Pohoiki Springs scales up our Loihi neuromorphic research chip by more than 750 times, while operating at a power level of under 500 watts. The system enables our research partners to explore ways to accelerate workloads that run slowly today on conventional architectures, including high-performance computing (HPC) systems.”
–Mike Davies, director of Intel’s Neuromorphic Computing Lab

What It is: Pohoiki Springs is a data center rack-mounted system and is Intel’s largest neuromorphic computing system developed to date. It integrates 768 Loihi neuromorphic research chips inside a chassis the size of five standard servers.

Loihi processors take inspiration from the human brain. Like the brain, Loihi can process certain demanding workloads up to 1,000 times faster and 10,000 times more efficiently than conventional processors. Pohoiki Springs is the next step in scaling this architecture to assess its potential to solve not just artificial intelligence (AI) problems, but a wide range of computationally difficult problems. Intel researchers believe the extreme parallelism and asynchronous signaling of neuromorphic systems may provide significant performance gains at dramatically reduced power levels compared with the most advanced conventional computers available today.

What the Opportunity for Scale is: In the natural world even some of the smallest living organisms can solve remarkably hard computational problems. Many insects, for example, can visually track objects and navigate and avoid obstacles in real time, despite having brains with well under 1 million neurons.

Similarly, Intel’s smallest neuromorphic system, Kapoho Bay, comprises two Loihi chips with 262,000 neurons and supports a variety of real-time edge workloads. Intel and INRC researchers have demonstrated the ability for Loihi to recognize gestures in real time, read braille using novel artificial skin, orient direction using learned visual landmarks and learn new odor patterns
– all while consuming tens of milliwatts of power. These small-scale examples have so far shown excellent scalability, with larger problems running faster and more efficiently on Loihi compared with conventional solutions. This mirrors the scalability of brains found in nature, from insects to human brains.

With 100 million neurons, Pohoiki Springs increases Loihi’s neural capacity to the size of a small mammal brain, a major step on the path to supporting much larger and more sophisticated neuromorphic workloads. The system lays the foundation for an autonomous, connected future, which will require new approaches to real-time, dynamic data processing.

How It will be Used: Intel’s neuromorphic systems, such as Pohoiki Springs, are still in the research phase and are not intended to replace conventional computing systems. Instead, they provide a tool for researchers to develop and characterize new neuro-inspired algorithms for real-time processing, problem solving, adaptation and learning.

INRC members will access and build applications on Pohoiki Springs via the cloud using Intel’s Nx SDK and community-contributed software components.

Examples of promising, highly scalable algorithms being developed for Loihi include:

  • Constraint satisfaction: Constraint satisfaction problems are present everywhere in the real world, from the game of sudoku to airline scheduling, to package delivery planning. They require evaluating a large number of potential solutions to identify the one or few that satisfy specific constraints. Loihi can accelerate such problems by exploring many different solutions in parallel at high speed.
  • Searching graphs and patterns: Every day, people search graph-based data structures to find optimal paths and closely matching patterns, for example to obtain driving directions or to recognize faces. Loihi has shown the ability to rapidly identify the shortest paths in graphs and perform approximate image searches.
  • Optimization problems: Neuromorphic architectures can be programmed so that their dynamic behavior over time mathematically optimizes specific objectives. This behavior may be applied to solve real-world optimization problems, such as maximizing the bandwidth of a wireless communication channel or allocating a stock portfolio to minimize risk at a target rate of return.

About Neuromorphic Computing: Traditional general-purpose processors, like CPUs and GPUs, are particularly skilled at tasks that are difficult for humans, such as highly precise mathematical calculations. But the role and applications of technology are expanding. From automation to AI and beyond, there is a rising need for computers to operate more like humans, processing unstructured and noisy data in real time, while adapting to change. This challenge motivates new and specialized architectures.

Neuromorphic computing is a complete rethinking of computer architecture from the bottom up. The goal is to apply the latest insights from neuroscience to create chips that function less like traditional computers and more like the human brain. Neuromorphic systems replicate the way neurons are organized, communicate and learn at the hardware level. Intel sees Loihi and future neuromorphic processors defining a new model of programmable computing to serve the world’s rising demand for pervasive, intelligent devices.

More Context: Neuromorphic Computing (Press Kit) | Intel Labs (Press Kit)

The post Intel Scales Neuromorphic Research System to 100 Million Neurons appeared first on Intel Newsroom.

How a Computer Chip Can Smell without a Nose

Produits Intel - lun, 16/03/2020 - 18:00
Intel Labs’ Nabil Imam holds a Loihi neuromorphic test chip in his Santa Clara, California, neuromorphic computing lab. He and a research team from Cornell University are building mathematical algorithms on computer chips that mimic what happens in your brain’s neural network when you smell something. (Credit: Walden Kirsch/Intel Corporation)
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Our Expert: Nabil Imam, a senior research scientist in Intel Labs’ neuromorphic computing group, works with olfactory neurophysiologists at Cornell University. “My friends at Cornell study the biological olfactory system in animals and measure the electrical activity in their brains as they smell odors,” explains Imam, who has a doctorate in neuromorphic computing. “On the basis of these circuit diagrams and electrical pulses, we derived a set of algorithms and configured them on neuromorphic silicon, specifically our Loihi test chip.” Loihi is Intel’s neuromorphic computing chip that applies the principles of computation found in biological brains to computer architectures.

More: Computers That Smell: Intel’s Neuromorphic Chip Can Sniff Out Hazardous Chemicals | Video: How Neuromorphic Computing Uses the Human Brain as a Model | Neuromorphic Computing at Intel (Press Kit) | Intel Labs (Press Kit) | Future of Technology series

It’s in the news: Today, Nature Machine Intelligence profiled research by Intel and Cornell University scientists who are building the mathematical algorithms. With researchers’ guidance, Loihi rapidly learned neural representations of 10 different odors.

First, how we smell: If you pick up a grapefruit and take a whiff, that fruit’s molecules stimulate olfactory cells in your nose (the word olfactory originates from Latin’s olfactare, which means “to smell”). The cells in your nose immediately send signals to your brain’s olfactory system where electrical pulses within an interconnected group of neurons generate a smell’s sensation. Whether you’re smelling a grapefruit, a rose or a noxious gas, networks of neurons in your brain create sensations specific to the object. Similarly, your senses of sight and sound, your recall of memory, your emotions, your decision-making each have individual neural networks that compute in particular ways.

Loihi learns to detect distinct odors in complex mixtures: Imam and team took a dataset consisting of the activity of 72 chemical sensors in response to 10 gaseous substances (odors) circulating within a wind tunnel. The sensors’ responses to the individual scents were transmitted to Loihi where silicon circuits mimicked the circuitry of the brain underlying the sense of smell. The chip rapidly learned neural representations of each of the 10 smells, including acetone, ammonia and methane, and identified them even in the presence of strong background interferents. Your smoke and carbon monoxide detectors at home use sensors to detect odors but they cannot distinguish between them; they beep when they detect harmful molecules in the air but are unable to categorize them in intelligent ways.

Future applications: Imam says the chemical-sensing community for years has looked for smart, reliable and fast-responding chemosensory processing systems, otherwise called “electronic nose systems.” He sees the potential of robots equipped with neuromorphic chips for environmental monitoring and hazardous materials detection, or for quality control chores in factories. They could be used for medical diagnoses where some diseases emit particular odors. Another example has neuromorphic-equipped robots better identifying hazardous substances in airport security lines.

Adding more senses in the future: “My next step,” Imam says, “is to generalize this approach to a wider range of problems — from sensory scene analysis (understanding the relationships between objects you observe) to abstract problems like planning and decision-making. Understanding how the brain’s neural circuits solve these complex computational problems will provide important clues for designing efficient and robust machine intelligence.”

Challenges to overcome: There are challenges in olfactory sensing, Imam says. When you walk into a grocery, you might smell a strawberry, but its smell might be similar to that of a blueberry or a banana, which induce very similar neural activity patterns in the brain. Sometimes it’s even hard for humans to distinguish between one fruit from a blend of scents. Systems might get tripped up when they smell a strawberry from Italy and one from California, which might have different aromas, yet need to be grouped into a common category. “These are challenges in olfactory signal recognition that we’re working on and that we hope to solve in the next couple of years before this becomes a product that can solve real-world problems beyond the experimental ones we have demonstrated in the lab,” Imam says. His work, he contends, is a “prime example of contemporary research taking place at the crossroads of neuroscience and artificial intelligence.”

The post How a Computer Chip Can Smell without a Nose appeared first on Intel Newsroom.

Computers That Smell: Intel’s Neuromorphic Chip Can Sniff Out Hazardous Chemicals

Produits Intel - lun, 16/03/2020 - 18:00
A close-up photo shows Loihi, Intel’s neuromorphic research chip. Intel’s latest neuromorphic system, Pohoiki Beach, will be comprised of 64 of these Loihi chips. Pohoiki Beach was introduced in July 2019. (Credit: Tim Herman/Intel Corporation)
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What’s New: In a joint paper published in Nature Machine Intelligence, researchers from Intel Labs and Cornell University demonstrated the ability of Intel’s neuromorphic research chip, Loihi, to learn and recognize hazardous chemicals in the presence of significant noise and occlusion. Loihi learned each odor with just a single sample, without disrupting its memory of previously learned scents. It demonstrated superior recognition accuracy compared with conventional state-of-the-art methods, including a deep learning solution that required 3,000 times more training samples per class to reach the same level of classification accuracy.

“We are developing neural algorithms on Loihi that mimic what happens in your brain when you smell something. This work is a prime example of contemporary research at the crossroads of neuroscience and artificial intelligence and demonstrates Loihi’s potential to provide important sensing capabilities that could benefit various industries.”
–Nabil Imam, senior research scientist in Intel’s Neuromorphic Computing Lab

Intel Labs’ Nabil Imam holds a Loihi neuromorphic test chip in his Santa Clara, California, neuromorphic computing lab. (Credit: Walden Kirsch/Intel Corporation)
» How a Computer Chip Can Smell without a Nose

About the Research: Using a neural algorithm derived from the architecture and dynamics of the brain’s olfactory circuits, researchers from Intel and Cornell trained Intel’s Loihi neuromorphic research chip to learn and recognize the scents of 10 hazardous chemicals. To do so, the team used a dataset consisting of the activity of 72 chemical sensors in response to these smells and configured the circuit diagram of biological olfaction on Loihi. The chip quickly learned the neural representation of each of the smells and recognized each odor, even when significantly occluded, demonstrating a promising future for the intersection of neuroscience and artificial intelligence.

More Context: How a Computer Chip Can Smell Without a Nose | Nature Machine Intelligence | Neuromorphic Computing at Intel | Intel Labs

The post Computers That Smell: Intel’s Neuromorphic Chip Can Sniff Out Hazardous Chemicals appeared first on Intel Newsroom.

Intel Update: Managing the Coronavirus Situation

Produits Intel - ven, 13/03/2020 - 21:14

Intel’s top priority in managing the coronavirus situation is protecting the health and well-being of employees while keeping the business running for our customers. Last week, Intel CFO George Davis addressed the topic at a Morgan Stanley conference, saying that although it remains a developing situation, the company continues to operate on a relatively normal basis around the world, including manufacturing-related operations in Oregon, Arizona, New Mexico and California in the U.S., and in Ireland, Israel and China.

In a message to employees, Intel CEO Bob Swan acknowledged employee efforts to keep the business running for Intel customers, writing:

“We wouldn’t be able to manage this challenging situation effectively without the help of our entire Intel family. Thank you for supporting each other throughout the past few weeks and for being understanding of the unusual demands this situation has placed upon many of our sites and people. We will continue to put our employees’ welfare and customers’ needs front and center in all our decision-making. Thank you for your cooperation and understanding. I am very proud of how we are living our One Intel values.”

More: Intel Response to COVID-19 Crisis

The company has taken the following measures to care for its direct and indirect workforce and to ensure business continuity throughout the developing situation:

  • Work-from-home and social distancing policies: We have recommended our employees work-from-home, if their roles allow. In order to safeguard our manufacturing and other employees that will continue to work on-site, we have instituted social distancing policies. For example, we are reducing the seating capacity in cafeterias and limiting in-person meeting attendance. We first put these policies in place at our sites in China, and they have helped keep our employees safe and our operations running.
  • Keeping hourly workers whole: We are continuing to pay-in-full Intel’s hourly workers. For at least the next two months, this policy also extends to hourly workers employed by Intel service partners around the world, regardless of changes to service levels due to our remote-work and social distancing policies. Please refer to supplier.intel.com for list of detailed qualified services.
  • Benefits updates: Employees and contractors asked to work from home or self-quarantine due to travel restrictions will be paid their regular pay, and Intel will reimburse up to 15 days of care services for employees who need backup childcare and/or elder care in the case where there are school or care center closures or if an employee or family member is required to be self-quarantined due to the coronavirus outbreak.
  • Increased cleaning of Intel facilities: Intel offices will remain open to support the large number of Intel’s global workforce who work in labs and factories critical to so much of our world’s digital infrastructure. At Intel, maintaining clean and safe facilities is core to how we operate. As an extra precaution, we have contracted for additional and sustained several-times-daily cleaning of Intel facilities around the world.

In addition, Intel is applying its technology and expertise to help better understand and combat the virus. For example, Intel and Lenovo have teamed up with Beijing-based BGI Genomics to accelerate the analysis of genomic characteristics of COVID-19. Our combined work will further advance the capabilities of BGI’s sequencing tools to help scientists investigate transmission patterns of the virus and create better diagnostic methods. Intel will continue to look for opportunities to assist our partners and customers in this urgent and important work.

Intel’s Pandemic Leadership Team, in partnership with Intel’s Corporate Emergency Operations Center, is closely monitoring any changes in the global environment. This specialized team of medical, safety and operational experts was established more than 15 years ago to lead Intel through global health situations like the one we are navigating now. The team’s focus is to safeguard the well-being of employees and minimize the spread of infection by partnering with local governments and public health organizations and following their recommendations. In the past, the team has successfully helped Intel manage through global health issues such as bird flu, SARS, Ebola, Zika and H1N1 virus.

Intel will continue to evolve our response and keep our employees informed with their safety and well-being as the top priority.

The post Intel Update: Managing the Coronavirus Situation appeared first on Intel Newsroom.

Intel Declares Quarterly Cash Dividend

Produits Intel - jeu, 12/03/2020 - 15:00

SANTA CLARA, Calif., Mar. 12, 2020 – Intel Corporation today announced that its board of directors has declared a quarterly dividend of $0.33 per share ($1.32 per share on an annual basis) on the company’s common stock. The dividend will be payable on June 1, 2020, to stockholders of record on May 7, 2020.

The post Intel Declares Quarterly Cash Dividend appeared first on Intel Newsroom.

Tour the Intel Museum in a New Video

Produits Intel - lun, 09/03/2020 - 17:00

Every year, more than 85,000 people – many with student tours and field trips – visit the Intel Museum at Intel’s headquarters in Santa Clara, California.

Learn more about the museum (location, hours, tour information and visiting guides) on the Intel website.

Editor’s Note: Effective Monday, March 9, 2020, the Intel Museum and Intel Store at Intel’s headquarters in Santa Clara will be closed until further notice. Call 408-765-5050 or visit the Intel Museum’s web page for the latest updates on the reopening.

More: All Intel Images | Intel Headquarters and Museum Images and B-Roll Video

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Intel Demonstrates Industry-First Co-Packaged Optics Ethernet Switch

Produits Intel - jeu, 05/03/2020 - 19:36


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What’s New: Intel today announced it has successfully integrated its 1.6 Tbps silicon photonics engine with its 12.8 Tbps programmable Ethernet switch. This co-packaged solution brings together the essential technology building blocks from Intel and its Barefoot Networks Division for integrated optics on an Ethernet switch.

“Our co-packaged optics demonstration is the first step to making optical I/O with silicon photonics a reality. We share the industry belief that co-packaged optics offers power and density advantages for switches at 25 Tbps and higher, and ultimately is a necessary and enabling technology for bandwidth scalability in future networks. The timing of this demonstration shows the technology is ready to support our customers’ requirements.”
–Hong Hou, Intel corporate vice president and general manager of the Silicon Photonics Products Division

Who It Helps: The co-packaged switch is optimized for hyperscale data centers, where demand for cost-effective interconnect and bandwidth is limitless. Intel is currently demonstrating this technology to customers.

Why It Matters: Today’s data center switches depend on pluggable optics installed in the switch faceplate that are connected to switch serializer/deserializer (SerDes) ports using an electrical trace. But as data center switch bandwidth grows, connecting the SerDes to pluggable optics electrically will be more complex and require more power. With co-packaged optics, the optical port is placed near the switch within the same package, thus reducing power and enabling continued switch bandwidth scalability.

What is Being Demonstrated: This demonstration brings together the best of Barefoot Networks’ programmable Ethernet switch technology and Intel’s silicon photonics technology. The integrated switch package in this demonstration uses a P4-programmable Barefoot Tofino™ 2 switch ASIC co-packaged with 1.6 Tbps silicon photonics engines from Intel’s Silicon Photonics Product Division.

More about Barefoot Networks Ethernet Switch: Barefoot Tofino 2 is a P4-programmable Ethernet switch that delivers up to 12.8 Tbps throughput and is based on the company’s Protocol Independent Switch Architecture (PISA). PISA is programmed using the open source P4 programming language for data planes. With the P4 data plane, Tofino switches’ forwarding capability can be adapted via software to new needs in the network or to new protocols that are supported by P4. The performance and programmability of Tofino 2 are designed to meet the needs of hyperscale data centers and cloud and service provider networks.

For co-packaged optics, the Barefoot Tofino 2 switch ships in a multi-die package that makes it easier to co-package the optical engine and to upgrade the SerDes for lower power or higher throughput.

“As switch chips scale to meet requirements for demand of limitless bandwidth in cloud-scale data centers, the need for power- and cost-effective interconnect is critical,” said Ed Doe, vice president and general manager of the Barefoot Division. “We have designed our Tofino 2 switch series using leading edge multi-die technology that enables interface flexibility, making it easier for us to integrate and create a scalable co-packaged solution with our silicon photonics products.  This has empowered us to deliver an industry-first solution that will greatly advance the future of data center infrastructure and architectures.”

More about the Silicon Photonics Engine: The silicon photonics interconnect platform features 1.6 Tbps photonic engines realized as 4 ports of 400GBase-DR4 interfaces, designed and manufactured in the Intel silicon photonics platform. The engines are modular arrays of transceivers built around integrated silicon photonics chips with on-chip lasers and high-speed modulators and detectors, representing the evolution of the silicon photonics platform that has shipped in more than 3 million units of 100G pluggable transceivers and powers the 200G and 400G pluggable modules ramping to volume this year. Highlighting the modularity and flexibility of the co-packaged switch platform developed by Intel, the integrated switch package features a combination of co-packaged optical ports and copper ports supporting front-plate cages for optical modules or copper cables.

What Barefoot Networks is: Intel acquired Barefoot Networks in 2019 to accelerate its delivery of Ethernet-based fabrics. Barefoot Networks is an emerging leader in Ethernet switch silicon and software for use in the data center, specializing in the programmability and flexibility necessary to meet the performance and ever-changing needs of the hyperscale cloud. Barefoot empowers network owners and their infrastructure partners to design, optimize and innovate to meet their specific requirements and gain competitive advantage. In combining the P4 programming language with fast programmable switches, Barefoot has also created an ecosystem for compilers, tools and P4 programs to make P4 accessible to anybody.

More Context: Data Center News | 5G News

The Small Print: Intel technologies may require enabled hardware, software or service activation.

No product or component can be absolutely secure.

Your costs and results may vary.

The post Intel Demonstrates Industry-First Co-Packaged Optics Ethernet Switch appeared first on Intel Newsroom.

Intel Announces 2019 Supplier Continuous Quality Improvement Awards

Produits Intel - jeu, 05/03/2020 - 18:00

Today, Intel recognizes 37 suppliers for their exceptional commitment to quality and performance in 2019. These suppliers have collaborated with Intel to implement innovative process improvements and operate with the highest level of integrity while providing superior products and services.

“At Intel, listening to our customers, suppliers and stakeholders is an integral part of our culture,” said Bob Swan, Intel’s chief executive officer. “Intel values the ecosystem partners who embrace a deep commitment to quality, role model affordability and drive innovation. I’m pleased to congratulate the winners of our quality awards. Thank you for enabling Intel to deliver solutions that unleash the potential of data and delight our customers.”

In 2019, Intel spent billions of dollars with nearly 16,000 suppliers from more than 20 countries. This vibrant and diverse supply chain helped Intel deliver products to 2,000 customers, resulting in nearly 2 billion units shipped.

“Congratulations to all award winners,” said Dr. Murthy Renduchintala, Intel’s chief engineering officer and group president of the Technology, Systems Architecture & Client Group. “Transformative innovations and consistent high performance across all aspects of the supply chain by these partners play a vital role in Intel’s success. Together, we advance Moore’s Law by providing differentiated enablement, delivering leading products and helping our customers succeed.”

“Today, we are recognizing a distinguished group of partners who share a relentless drive for excellence, a collaborative approach to innovation and an unwavering commitment to quality,” said Dr. Randhir Thakur, head of the Global Supply Chain at Intel. “These key partners are industry role models and consistently collaborate with Intel to grow and win together.”

Intel has three levels of supplier recognition: The Supplier Continuous Quality Improvement (SCQI) Award, the Preferred Quality Supplier (PQS) Award and the Supplier Achievement Award (SAA). The awards are part of Intel’s SCQI program, which encourages Intel’s key suppliers to strive for best-in-class levels of excellence and continuous improvement. Through the SCQI program, the SAA and the Distinguished Performance designation also recognize supplier achievements in supplier diversity, cost, quality, sustainability, technology, innovation, availability and world-class safety program performance. Learn more about the quality expectations of Intel suppliers.

Supplier Continuous Quality Improvement Award (SCQI) winners:

  • DISCO Corporation (with Distinguished Performance in Safety): Cutting, grinding and polishing equipment, consumables and services
  • Fujimi Corporation: Innovative and enabling CMP slurry technologies
  • Securitas USA Inc.: Physical security services, security systems support and related services
  • Senju Metal Industry Co. Ltd.: Solder spheres, pastes and flux
  • Tokyo Electron Limited: Coater/developer, dry etch, wet etch, thermal processing, deposition, test and 3DI systems

Preferred Quality Supplier Award (PQS) winners:

  • Advanced Semiconductor Engineering: Semiconductors assembly, packaging and test services
  • Applied Materials Inc.: Materials engineering solutions, including equipment, integrated processes and services
  • Arvato Supply Chain Solutions: Value-added and forward logistics services
  • ASM International N.V.: Leading-edge semiconductor materials deposition technology solutions and support
  • AT&S: CPU substrates and interposer
  • Brewer Science Inc.: Lithographic underlayer, antireflective coating materials and temporary wafer bonding materials
  • Carl Zeiss SMT GmbH: Semiconductor photomask solutions (mask repair, metrology, tuning systems)
  • GF Piping Systems: Comprehensive range of piping systems and specialized solutions
  • Hitachi High-Technologies: Fab etch and metrology equipment
  • KOKUSAI ELECTRIC CORPORATION (with Distinguished Performance in Safety): Batch thermal processing systems
  • Lam Research Corporation: Semiconductor manufacturing equipment in the etch, deposition and cleans areas
  • Mitsubishi Gas Chemical Company Inc.: Super pure ammonium hydroxide and custom formulations to increase yield
  • Murata Machinery Ltd.: Automated material handling systems – hoist vehicles and stockers
  • NAMICS Corporation: Innovative epoxy material solutions
  • Schneider Electric Industries SAS: Energy distribution and management
  • Shin-Etsu Chemical Co. Ltd: Silicon wafers, mask blanks, thermal insulating materials, underfill and photoresist
  • Siltronic AG: Polished and epitaxial silicon wafers
  • SUMCO Corporation: 200mm and 300mm epitaxial and polished silicon wafers
  • Taiwan Semiconductor Manufacturing Company Ltd: Wafer manufacturing for externally produced Intel products
  • The PEER Group Inc.: Innovative factory automation software for high-volume smart manufacturing
  • Tokyo Ohka Kogyo Co. LTD: Photo resists, developers, cleaning solutions and supporting high purity chemistries
  • Tosoh Quartz Inc.: Quartzware for semiconductor wafer processing equipment
  • TOSOH SMD INC.: High-purity metal and alloy targets for physical vapor deposition
  • Valex: Ultra-high-purity components manufacturer for gas delivery systems

Supplier Achievement Award (SAA) winners:

  • ASML: Technology
  • Ebara Corporation: Sustainability
  • JLL: Supplier Diversity
  • King Yuan Electronics Corp. (KYEC): Availability
  • Lasertec Corporation: Innovation
  • Powertech Technology Inc.: Availability
  • Skanska USA Building Inc.: Supplier Diversity
  • Toray Engineering Co. Ltd.: Technology

The post Intel Announces 2019 Supplier Continuous Quality Improvement Awards appeared first on Intel Newsroom.

Billions of Transistors Make Up a Processor. A New Video Shows How They are Made.

Produits Intel - lun, 02/03/2020 - 18:00

Intel builds processors at the heart of nearly everything. And transistors – lots and lots of them – make up the engine that powers every Intel processor. To build a modern microchip, Intel’s engineers place billions of these tiny switches into an area no larger than a fingernail. It’s one of mankind’s most complex feats, and it’s happening every day across Intel’s global network of chip manufacturing facilities.

In February, Intel produced a video that animated a chip’s journey from concept to customer. For a deeper look into the chipmaking process and the technological marvels that are Intel’s transistor technology, view the video “From Sand to Silicon: The Making of a Microchip.”

More: Manufacturing at Intel | All Intel Images

The post Billions of Transistors Make Up a Processor. A New Video Shows How They are Made. appeared first on Intel Newsroom.

Product Fact Sheet: Accelerating 5G Network Infrastructure, from the Core to the Edge

Produits Intel - mer, 26/02/2020 - 21:59


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This week, Intel announced an unmatched silicon portfolio for 5G infrastructure with the launch of the Intel Atom® P5900, a 10nm system-on-chip (SoC) for wireless base stations, and the introduction of both a structured ASIC for 5G network processing and a 5G network-optimized Ethernet network adapter, offering high-precision, GPS-based network service synchronization.

More: Intel Announces Unmatched Portfolio for 5G Network Infrastructure (News Release) | Intel Reinforces Data Center Leadership with New 2nd-Gen Intel Xeon Scalable Processors (News Byte) | Intel Announces Unmatched Portfolio for 5G Network Infrastructure (Press Kit)

Additionally, Intel announced the expansion of its 2nd gen Intel® Xeon® Scalable processor lineup as the company continues to deliver workload-optimized performance, integrated artificial intelligence (AI) acceleration and hardened security at the platform level.

Launching Intel Atom P5900 Platform  

In a highly integrated 10nm SoC, the Intel Atom P5900 delivers what customers require for future-ready 5G base stations, including ultra-low latency, accelerated throughput and precise load balancing.

Performance improvements include up to 5.6 times more secured network communication with the Intel Atom® P5952B processor and Intel® QuickAssist Technology (versus software alone)1 and up to 3.7 times more packet processing with the Intel Atom P5952B processor and Intel® Dynamic Load Balancer (versus software alone)2.

Key features include:

  • Up to 24 Intel Atom P5000 processor cores, based on the Tremont microarchitecture, using 10nm process technology.
  • L1 cache of 32KB/core, L2 cache of 4.5MB per 4-core cluster and shared LLC cache up to 15MB.
  • Base frequency support of up to 2.2 GHz, single-thread performance.
  • Memory capacity of up to 128GB of DDR4 up to 2,933 MT/s with server-class reliability, availability and serviceability (RAS) and support for RDIMM, UDIMM, SODIMM and memory down.
  • Up to 100 Gbps throughput with integrated Intel Ethernet 800 series technology.
  • Up to 100 Gbps security processing with Intel QuickAssist Technology.
  • Up to 440 Gbps network switching connectivity support with up to 20 fully integrated Ethernet SerDes.
  • Up to 16 lanes of flexible high-speed IO configured as PCIe, SATA and/or USB 3.0.
  • Up to 16 lanes of PCIe Gen 3.0.
  • Up to 4 USB 2.0 ports, eMMC 5.1, LPC or eSPI.
  • Extended temperature support of minus 40 C to 85 C with full dynamic temperature range.

New 2nd Gen Intel Xeon Scalable Processors  

The new 2nd Gen Intel Xeon Scalable processors launched today deliver an average of 36% more performance and an average of 42% more performance per dollar3 than the prior generation Intel Xeon Gold and increased value for customers across their cloud, network and edge needs.

Updates include:

  • These new processors add more cores, cache and/or frequency, providing more performance and value across a wide range of mainstream price points.
  • Industry-leading frequency, with a new processor featuring base frequency of 3.9 GHz and turbo frequency up to 4.5 GHz.
  • Continued hardware-based mitigations against side-channel attacks, plus built-in encryption acceleration and key protection technologies.
  • Eighteen Intel® Select Solutions will be updated in the coming weeks with new processor options to take advantage of the improved performance and value. Intel Select Solution are workload-optimized configurations for a variety of popular workloads that reduce the guesswork and accelerate time-to-deployment.
  • Find additional information and SKU chart on “Intel Reinforces Data Center Leadership with New 2nd Gen Intel Xeon Scalable Processors.”

Introducing “Diamond Mesa,” Intel’s First Next-Generation Structured ASIC for 5G Network Acceleration

Structured ASICs like “Diamond Mesa” provide a minimum-risk optimization path for workloads that do not require the full programmability of FPGAs, targeting double the performance efficiency versus the prior generation, and uniquely position Intel as the only provider delivering a full silicon platform foundation for network infrastructure.

Key features include:

  • The first eASIC device to leverage all-new IP from the Intel Programmable Solutions Group, a quad-core ARM A53 processor and secure device manager subsystem.
  • Structured ASICs like Diamond Mesa strike a balance between the programmability and fast time-to-market of FPGAs and the efficient performance of purpose-built ASICs.
  • Only Intel offers developers a full range of silicon solutions to optimize platforms for performance, cost, power, flexibility and time-to-market – from Intel Xeon processors to purpose-built ASICs.

Introducing the Intel Ethernet 700 Series Network Adapter with Hardware-Enhanced Precision Time Protocol (code-named “Edgewater Channel”)

Intel introduced the Intel® Ethernet 700 Series network adapter with hardware-enhanced Precision Time Protocol (PTP), which is designed for 5G, edge and other use cases with very tight latency and timing requirements.

Intel Ethernet 700 Series is compliant with the IEEE 1588 PTP standard and increases phase accuracy through a combination of hardware enhancements and software optimizations with within 100 nanoseconds or less.

Key features include:

  • Onboard high-precision oscillator with up to 5,000 times tighter accuracy: Provides greater phase
    accuracy than a standard Ethernet adapter and better holdover between clock interruption. (5000x=20 ppb TCXO oscillator (10 °C to 70 °C) vs. typical 100 ppm crystal)
  • Dual SubMiniature version A (SMA) coaxial connectors: Allow connection to external timing sources, such as GPS signaling devices and to timing sinks/recipients, allowing the NIC to act as
    a grandmaster and as a timing source for other equipment.
  • Software-defined pins (SDPs): User-configurable I/O pins drive the SMAs and provide built-in timing coordination between ports.
  • Standard Linux support: Linux PTP utility provides support for multiple PTP profiles and use of SDPs for sync via 1 pulse per second (PPS) input and output signals.

 

Performance results are based on testing as of dates in configuration and may not reflect all publicly available security updates. See configuration disclosure for details. No product can be absolutely secure.  For more complete information about performance and benchmark results, visit www.intel.com/benchmarks. Refer to http://software.intel.com/en-us/articles/optimization-notice for more information regarding performance and optimization choices in Intel software products. Results have been estimated or simulated. Int, Integer Throughput: estimated SPECrate®2017_int_base based on Intel internal measurements; fp, Floating Point Throughput: estimated SPECrate®2017_fp_base based on Intel internal measurements. SPEC®, SPECrate® and SPEC CPU® are registered trademarks of the Standard Performance Evaluation Corporation. See www.spec.org for more information.

Get up to 5.6X more packet security throughput with Intel QAT and the integrated switch, versus software: Tested by Intel on 1/27/2020, 1x Intel Atom® P5952B processor (Running under A-3 Eng Silicon 20C, 2.2GHz) on Intel internal Frost Creek platform, 16GB DDR4 2933MHz, OS: Ubuntu 18.04 with Kernel: 5.2.10-rt5, BIOS: JBVLCRB1.86B.0011.D44.1909191126, uCode: 0x90010006, Benchmark: DPDK IPSec (using Intel® QAT) (1420B packet size) (1C/1T/1P) (Estimated), Software: DPDK 19.05, Compiler: GCC 7.3.0 with MKL, Network: Onboard 100GbE NIC compared to 1x Intel Atom® P5952B processor (Running under A-3 Eng Silicon 20C, 2.2GHz) on Intel internal Frost Creek platform, 16GB DDR4 2933MHz, OS: Ubuntu 18.04 with Kernel: 5.2.10-rt5, BIOS: JBVLCRB1.86B.0011.D44.1909191126, uCode: 0x90010006, Benchmark: DPDK IPSec (using software cipher algorithm AES-128-CBC) (1420B packet size) (1C/1T/1P) (Estimated), Software: DPDK 19.05, Compiler: GCC 7.3.0 with MKL, Network: Onboard 100GbE NIC.

Achieve up to 3.7X more packet balancing throughput versus software queue management: Tested by Intel on 1/27/2020, 1x Intel Atom® P5952B processor (Running under A-3 Eng Silicon 20C, 2.2GHz) on Intel internal Victoria Canyon platform, 16GB DDR4 2933MHz ,OS: Ubuntu 18.04 with Kernel: 5.2.10-rt5, BIOS: JBVLCRB1.86B.0012.D17.1911070324, uCode: 0x90040006, Benchmark: DPDK Event Device Ordered Scheduling (3 stages) (Estimated), Software: RDK19.11, Compiler: GCC 7.3.0 with MKL, Network: 1x Intel® Ethernet Network Adapter X710-DA4 (10GbE) compared to 1x Intel Atom® P5952B processor (Running under A-3 Eng Silicon 20C, 2.2GHz) on Intel internal Victoria Canyon platform, 16GB DDR4 2933MHz, OS: Ubuntu 18.04 with Kernel: 5.2.10-rt5, BIOS: JBVLCRB1.86B.0012.D17.1911070324, uCode: 0x90040006, Benchmark: DPDK Event Device Ordered Scheduling (3 stages) (Estimated), Software: RDK19.11, Compiler: GCC 7.3.0 with MKL, Network: 1x Intel® Ethernet Network Adapter X710-DA4 (10GbE).

3 Configuration details updated on March 12, 2020, to reflect the latest SPEC guidelines.
36% More Performance and 42% More Performance/Dollar: Geomean of Integer Throughput, Floating Point Throughput, STREAM Triad, and Intel® Distribution for LINPACK Across Ten New 2-socket 2nd Gen Intel® Xeon® Gold Processors Vs. First Generation. 2nd Gen Intel® Xeon® Gold R processors: 1-node, 2x 2nd Gen Intel Xeon Gold processor (62xxR/$$) on Intel Reference platform with 384GB (12 slots / 32 GB / 62xx@2933,52xx@2666) total memory, ucode 0x500002c, HT on for all except off for STREAM (GB/s), LINPACK (GFLOPS/s), Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6258R/$3950: int=323, fp=262, STREAM=224, LINPACK =3305; 6248R/$2700: int=299, fp=248, STREAM=224, LINPACK =3010; 6246R/$3286: int=238, fp=217, STREAM=225, LINPACK =2394; 6242R/$2529: int=265, fp=231, STREAM=227, LINPACK =2698; 6240R/$2200: int=268, fp=228, STREAM=223, LINPACK=2438; 6238R/$2612: int=287, fp=240, STREAM=222, LINPACK =2545; 6230R/$1894: int=266, fp=227, STREAM=222, LINPACK =2219; 6226R/$1300: int=208, fp=192, STREAM=200, LINPACK =2073; 5220R/$1555: int=257, fp=220, STREAM=210, LINPACK =1610; 5218R/$1273: int=210, fp=188, STREAM=199, LINPACK =1290, test by Intel on 12/25/2019. First Gen Intel® Xeon® Gold processor: 1-node, 2x Intel Xeon Gold processor (61xx/$$) on Intel Reference platform with 384GB (12 slots / 32 GB / 61xx@2666,51xx@2400) total memory, ucode 0x500002c, HT on for all except off for STREAM (GB/s), LINPACK (GFLOPS/s), Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6152/$3655: int=224, fp=198, STREAM=200, LINPACK =1988; 6148/$3072: int=225, fp=198, STREAM=197, LINPACK =2162; 6146/$3286: int=161, fp=175, STREAM=185, LINPACK =1896; 6142/$2946: int=193, fp=176, STREAM=185, LINPACK =1895; 6140/$2445: int=202, fp=183, STREAM=188, LINPACK =1877; 6138/$2612: int=189, fp=195, STREAM=189, LINPACK =1976; 6130/$1894: int=172, fp=165, STREAM=185, LINPACK =1645; 6126(proj)/$1776: int=141, fp=157, STREAM=170, LINPACK =1605; 5120(proj)/$1555: int=148, fp=148, STREAM=159, LINPACK =924, 5118/$1273: int=134, fp=132, STREAM=149, LINPACK =818, test by Intel on 2/18/2020. Your costs and results may vary.

The post Product Fact Sheet: Accelerating 5G Network Infrastructure, from the Core to the Edge appeared first on Intel Newsroom.

Intel Highlights Latest Security Investments at RSA 2020

Produits Intel - mer, 26/02/2020 - 16:00


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SAN FRANCISCO, Feb. 26, 2020 – At the Intel Security Day event during RSA Conference 2020, Intel underscored its commitment to security with several announcements, including details on security capabilities coming in future products. At Intel, security is a fundamental and foundational element of all aspects of architecture, design and implementation. Together with customers and partners, Intel is building a more trusted foundation in this data-centric world.

“Hardware is the bedrock of any security solution. Just as a physical structure requires a foundation established on bedrock to withstand the forces of nature, security solutions rooted in hardware will provide the greatest opportunity to provide security assurance against current and future threats,” said Tom Garrison, Intel vice president and general manager of Client Security Strategy and Initiatives. “Intel hardware, and the assurance and security technologies it brings, help harden the layers above from attack.”

More: Intel Security News

Intel customers build solutions and services that depend on the breadth and depth of technologies in the silicon, vertical integration and substantive reach from edge to cloud. It is Intel’s mission to provide common security capabilities across all architectures, to help address the ever-increasing sophistication of user experiences.

Data must be protected at rest and in motion. The protection of data is critical to extracting value from it, while delivering uncompromised performance. The next 10 years will see more architecture ​advancements than the past 50 years.

“Intel is uniquely positioned in the industry to create and deliver truly innovative security technologies that span architectures, memory and interconnect,” said John Sell, Intel Fellow and director of Intel Security Architecture and Technology.

Data Platform Protection

As the demand for data-intensive computing grows, there is a need to balance the ease of scaling deployment with the level of data protections. To address customer challenges, new confidential computing capabilities on future data center platforms are expected to offer scale and choice:

  • Application isolation helps protect data in use with a very narrow attack surface. Already deployed for production data centers and solutions, Intel® Software Guard Extensions (Intel SGX) will expand to a broader range of mainstream data-centric platforms, and is expected to provide larger protected enclaves, extended protections to offload accelerators and improved performance. This will further expand the number of usages able to leverage these advanced application isolation capabilities.
  • VM and container isolation helps provide protections in virtualized environments, isolating them from each other and from the hypervisor and cloud provider without requiring application code modifications.
  • Full memory encryption helps better protect against physical memory attacks​ by providing hardware-based encryption transparent to the operating system and software​ layers.
  • Intel® Platform Firmware Resilience is an Intel FPGA-based solution that helps protect the various platform firmware components by monitoring and filtering malicious traffic on the system buses. It also verifies the integrity of platform firmware images before any firmware code is executed and can recover corrupted firmware back to a known good state. When combined with other trusted boot technologies on new platform generations, Intel continues to contribute additional tools to increase resistance against attack and help provide a more trusted foundation for modern cloud and enterprise deployments.

More information can be found on Intel’s IT Peer Network.

Compute Lifecycle Assurance Industry Traction

Since its launch in December, Intel’s Compute Lifecycle Assurance Initiative has gained traction with customers and ecosystem partners, starting with the foundational offering Intel® Transparent Supply Chain (Intel TSC).

Transparency of a device’s origin helps establish the foundation for a trusted supply chain. Intel TSC tools allow platform manufacturers to bind platform information and measurement using the Trusted Computing Group’s (TCG) Trusted Platform Module 2.0 (TPM) standard, also referred to as ISO 11889. This allows customers to gain traceability and accountability for platforms with component-level reporting. More information can be found in a blog by Intel’s Tom Dodson.

Intel TSC is currently available for customers across Intel vPro® platform-based PCs, Intel® NUC, Intel® Xeon® SP systems, Intel® solid-state drives and certain Intel® Core™ commercial PCs.

To demonstrate Intel’s commitment to transparency, measurement and assurance of the supply chain, Intel also enables ecosystem partners with Intel TSC tools. Today, Hyve Solutions, Inspur, Lenovo (client and server), Mitac, Quanta, Supermicro and ZT Systems have enabled Intel TSC tools. In addition, Intel has active deployments of Intel TSC with enterprise IT and cloud service providers.

“This chain of trust process provides essential traceability based on the TPM,” said Thorsten Stremlau, chair of TCG’s Marketing Work Group. “Bringing component-level traceability to platforms and systems increases confidence and reduces the risk of counterfeit electronic parts while also facilitating procurement standards. This is the right direction for the industry.”

It often takes the industry working together to make technological advancements. Intel has a strong legacy of assisting its customers and industry partners in developing new and innovative ways to improve hardware security. Intel shares knowledge of this experience through its participation and contributions to leading industry initiatives and standards bodies, including the Confidential Computing Consortium under the Linux Foundation, the FIDO Alliance’s IoT Technical Workgroup and the newly expanded Common Weakness Enumeration led by MITRE. Such efforts underscore Intel’s unique capacity to build a more trusted foundation for the industry.

Notices & Disclaimers

Intel technologies may require enabled hardware, software or service activation.

No product or component can be absolutely secure.

Your costs and results may vary.

The post Intel Highlights Latest Security Investments at RSA 2020 appeared first on Intel Newsroom.

Intel World Open: Path to Tokyo Kicks off in March

Produits Intel - mar, 25/02/2020 - 20:00

What’s New: Intel is elevating esports for audiences worldwide with the Intel World Open ahead of the Olympic Games Tokyo 2020, giving gamers a chance to compete among the world’s best athletes on a global stage. Anyone from anywhere can register, beginning March 2, for a chance to be crowned the Intel World Open champion.

“We introduced Intel Extreme Masters PyeongChang in 2018 and we’re excited to continue raising the stakes for esports with the Intel World Open in 2020. There are more than 490 million esports fans worldwide and the Intel World Open exemplifies Intel’s global leadership in esports and delivers a pinnacle tournament on the world’s biggest sports stage.”
– Mark Subotnick, Intel director of gaming and esports business development

What It Is: The Intel World Open is an extension of Intel’s Worldwide TOP Partnership with the International Olympic Committee (IOC), and will feature two of the most recognized esports titles: Capcom’s Street Fighter™ V: Champion Edition and Psyonix’s Rocket League. Online qualifiers for Street Fighter V: Champion Edition start March 21 and Rocket League start May 2.

The Path to Tokyo: Any player at any level can compete in the Intel World Open for a chance to join a national, territory or regional team. Live qualifier events in Katowice, Poland, in June will determine which teams advance to the championship esports tournament in Tokyo.

The final event in Tokyo on July 22-24 will host hundreds of fans at the Zepp DiverCity venue – the same area as Olympic venues – where teams will compete for a majority share of the prize pool:

  • $250,000 total prize pool for Street Fighter V: Champion Edition
  • $250,000 total prize pool for Rocket League

For more details and registration, visit the Intel World Open website.

The Street Fighter V: Champion Edition Tournament Format: A force in the fighting genre and esports scene for 32 years, the legendary fighting franchise returns with Street Fighter V: Champion Edition.

Tournament Structure:

  • Territory qualifiers: Territory qualifiers begin March 2 and determine each territory’s three best players who will come together and form the team representing that territory and advance to the live qualifier in Poland. The 12 pre-selected territories include:
    • Brazil
    • China
    • Chinese Taipei
    • Dominican Republic
    • France
    • Hong Kong, China
    • Korea
    • Russia
    • Singapore
    • United Arab Emirates
    • United Kingdom
    • United States
  • Regional qualifiers: Players outside of the 12 pre-selected territory teams can participate through the team-based regional qualifier process that will take place in March through May. The top teams from the eight regions will advance to the live qualifier in Poland. The eight regions include:
    • Europe 1
    • Europe 2
    • Middle East & Africa
    • North America
    • Central America
    • South America
    • Asia
    • Oceania
  • Live qualifier in Katowice, Poland: From June 18-21, the final qualifier brings together the winning teams formed from the territory and regional qualifiers to determine who advances to the final Intel World Open event in Tokyo.
  • Japan qualifier: As the host country, Japan will have the final guaranteed spot at the Intel World Open finals in Tokyo. Japan qualifiers are single-player matches with the winning team being formed from the top players on the Intel World Open leaderboard.
  • Intel World Open finals: The finals take place July 22-24 at the Zepp DiverCity venue in Tokyo, where qualifying teams will compete to claim the majority share of the $250,000 prize pool.

For full qualification rules and details, visit the Intel World Open website.

The Rocket League Tournament Format: Developed by Epic Games’ San Diego-based studio, Psyonix, Rocket League is a high-powered hybrid of arcade-style soccer and vehicular mayhem. The Rocket League Intel World Open will feature 3v3 competitions in Psyonix’s signature game mode, Soccar.

Tournament Structure:

  • National qualifiers: National qualifiers begin May 2 and one team from each of the nine pre-selected countries will advance to the live qualifier in Katowice, Poland. The nine nations include:
    • Australia
    • Brazil
    • Canada
    • China
    • France
    • Germany
    • Japan
    • United Kingdom
    • United States
  • Regional qualifiers: Players outside of the nine pre-selected national team countries can participate through the regional qualifier process, from which eight teams will advance to the semifinals in Poland. Both qualifiers will have a double-elimination format and will not have a team cap. The eight regions include:
    • Africa
    • Asia (Mainland)
    • Asia (Maritime & Oceania)
    • Europe (three European seeds will qualify for the regional final)
    • Latin America (Mexico and southward)
    • Middle East
  • Live qualifier in Katowice, Poland: The final qualifier in Katowice, Poland, features the 16 best teams in the world separated into two groups of eight teams. The teams will compete in a round-robin, with the top two teams from each group automatically advancing to the Intel World Open Finals in Tokyo to join the host country, Japan. After the round-robin stage, the rest of the teams will participate in a double-elimination bracket. The upper bracket winner and both teams from the lower bracket finals will qualify for the Intel World Open finals.
  • Intel World Open finals: The epic culmination of the Intel World Open will be the live final in Tokyo featuring a two-day event showcasing the best eight teams in the world. They will battle through a high-stakes, single-elimination bracket in order to claim the Intel World Open title and majority share of the $250,000 prize pool.

For full qualification rules and details, visit the Intel World Open website.

Intel’s Role in Gaming Technology Leadership: Intel’s gaming technology, led by the Intel® Core™ i7 and i9 processors, has powered the best esports experiences for more than 15 years. Intel inspires fans and players by supporting a vibrant community that brings together committed partners in the industry to deliver best-in-class technology that pushes the boundaries of the sport. Intel’s leadership in end-to-end solutions will power the future of gaming and grow the esports market for the next billion fans.

More Context: Intel and the Olympic Games Tokyo 2020

The Small Print: Capcom and the Capcom logo are registered trademarks of Capcom Co. Ltd. in the U.S. or other countries. Street Fighter is a trademark and/or registered trademark of Capcom U.S.A. Inc. in the U.S. and/or other countries.

The post Intel World Open: Path to Tokyo Kicks off in March appeared first on Intel Newsroom.

Intel Announces Unmatched Portfolio for 5G Network Infrastructure

Produits Intel - lun, 24/02/2020 - 16:00

SANTA CLARA, Calif., Feb. 24, 2020 – Unlocking the full potential of 5G requires transforming network infrastructure from core to edge. As the world’s leading network silicon provider, Intel is at the forefront of driving this transformation. Today, the company made a sweeping set of hardware and software announcements, including the launch of the new Intel Atom® P5900, a 10nm system-on-chip (SoC) for wireless base stations, which is a critical early deployment target for 5G networks.

More: Intel Announces Unmatched Portfolio for 5G Network Infrastructure (Press Kit) | Intel Reinforces Data Center Leadership with New 2nd-Gen Intel Xeon Scalable Processors | Product Fact Sheet: Accelerating 5G Network Infrastructure, from the Core to the Edge

Navin Shenoy, executive vice president and general manager of the Data Platforms Group at Intel Corporation, displays the Intel Atom P5900. The highly integrated 10nm system-on-chip is designed for critical 5G network needs. On Monday, Feb. 24, 2020, Intel announced its unmatched portfolio of hardware and software to unlock the full potential of 5G. (Credit: Walden Kirsch/Intel Corporation)
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“As the industry makes the transition to 5G, we continue to see network infrastructure as the most significant opportunity, representing a $25 billion silicon opportunity by 2023,” said Navin Shenoy, executive vice president and general manager of the Data Platforms Group at Intel. “By offering customers the fastest and most effective path to design, deliver and deploy 5G solutions across core, edge and access, we are poised to expand our leading silicon position in this growing market.”

Unmatched Portfolio for 5G Infrastructure

As the promise of 5G takes hold, customers are demanding the increased performance and flexibility they need to rapidly deliver services with lower latency where they are needed most. In this light, Intel announced a number of firsts today, including:

  • Launching the Intel Atom P5900 platform, the first Intel architecture-based 10nm SoC for wireless base stations: With the launch of the Intel Atom P5900, the company is extending Intel architecture from the core to access and all the way to the farthest edge of the network. Intel now expects to be the leading silicon provider in base stations by 2021, a year earlier than first predicted. As a highly integrated 10nm SoC, the Intel Atom P5900 is designed to meet critical 5G network needs, including high bandwidth and low latency to deliver what’s required for 5G base stations today and in the future. The product augments Intel’s rich silicon portfolio for network environments and introduces Intel silicon as the foundation for the wireless base stations market, with 6 million 5G base stations forecasted through 2024. Intel is working with leading providers to deliver this product as part of their future-differentiated solutions in market.
  • New 2nd Gen Intel® Xeon® Scalable processors: As the foundation for data platform infrastructure with over 30 million units sold, Intel Xeon Scalable processors have led the transformation of the network. This year, 50% of core network deployments are transforming to virtualized networks, with the expectation to grow beyond 80% by 2024¹, fueled by 5G. The new 2nd Gen Intel Xeon Scalable processors launched today deliver an average of 36% more performance and an average of 42% more performance per dollar² than the prior generation Intel® Xeon® Gold and increased value for customers across their cloud, network and edge needs. In addition, Intel Xeon Scalable helps protect the integrity of the data and the platform with hardware-enhanced security and built-in encryption accelerators. In conjunction, Intel’s solution partners plan to upgrade 18 Select Solutions supporting these new processors across customer-prioritized workloads.
  • Introducing “Diamond Mesa,” Intel’s first next-generation structured ASIC for 5G network acceleration: “Diamond Mesa” (code name) is designed to complement Intel’s unmatched portfolio of processors and FPGAs delivering the high performance and low latency required for 5G networks. Structured ASICs like Diamond Mesa provide a minimum-risk optimization path for workloads that do not require the full programmability of FPGAs, targeting double the performance efficiency versus the prior generation, and uniquely position Intel as the only provider delivering a full silicon platform foundation for network infrastructure. Diamond Mesa is open to early access customers.
  • Introducing the Intel® Ethernet 700 Series Network Adapter with hardware-enhanced Precision Time Protocol, the first 5G network-optimized Ethernet NIC: The Ethernet 700 series (code-named “Edgewater Channel”) is Intel’s first 5G-optimized network adapter, offering GPS-based cross-network service synchronization with hardware-enhanced Precision Time Protocol (PTP). Latency requirements across 5G network implementations have challenged existing Ethernet technology, especially in edge servers. Maintaining accurate time synchronization across the network at a cost-effective price point, however, is one avenue to help address application latency. The Ethernet 700 series adapter increases the timing precision required for 5G networks through a combination of hardware and software enhancements. Edgewater Channel is sampling now and will enter production in 2020’s second quarter.


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New Software Investments

Intel expands its industry-leading edge computing software toolkits to accelerate time-to-market innovation for its customers and partners with new capabilities integrated into the Open Network Edge Services Software (OpenNESS) toolkit. OpenNESS now supports standalone 5GNR and Enhanced Platform Awareness (EPA) deployments, giving customers the flexibility to easily deploy their choice of cloud-native edge microservices. Intel is delivering customized OpenNESS experience kits to accelerate custom 5G deployments. OpenNESS complements Intel’s OpenVINO™ and Open Visual Cloud for edge computing development needs.

Unrivaled Ecosystem Collaborations

Technology innovation requires deep collaboration across industry innovators that build on each other’s contributions. Given its rich heritage in leading technology transitions, Intel is in a unique position to accelerate collaboration across its customers and partners. Intel has announced strategic collaborations with industry leaders, including Altiostar, Dell, Deutsche Telecom, HPE, Lenovo, QCT, Rakuten, VMware and ZTE to advance network infrastructure capability and speed edge solutions in the market.

Intel has been at the forefront of technology innovation for 51 years. By delivering the broadest silicon portfolio for 5G network infrastructure, the company continues to open a world of opportunity for its customers and partners.

¹Source: Dell’Oro Mobile Core Network 5 Year Forecast Report, Dell’Oro Group, 01/2020
²Configuration details updated on March 2, 2020, to reflect the latest SPEC guidelines.
36% More Performance and 42% More Performance/Dollar: Geomean of Integer Throughput (estimated SPECrate®2017_int_base), Floating Point Throughput (estimated SPECrate®2017_fp_base), STREAM Triad, and Intel® Distribution for LINPACK Across Ten New 2-socket 2nd Gen Intel® Xeon® Gold Processors Vs. First Generation. 2nd Gen Intel® Xeon® Gold R processors: 1-node, 2x 2nd Gen Intel Xeon Gold processor (62xxR/$$) on Intel Reference platform with 384GB (12 slots / 32 GB / 62xx@2933,52xx@2666) total memory, ucode 0x500002c, HT on for all except off for STREAM (GB/s), LINPACK (GFLOPS/s), Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6258R/$3950: int=323, fp=262, STREAM=224, LINPACK =3305; 6248R/$2700: int=299, fp=248, STREAM=224, LINPACK =3010; 6246R/$3286: int=238, fp=217, STREAM=225, LINPACK =2394; 6242R/$2529: int=265, fp=231, STREAM=227, LINPACK =2698; 6240R/$2200: int=268, fp=228, STREAM=223, LINPACK=2438; 6238R/$2612: int=287, fp=240, STREAM=222, LINPACK =2545; 6230R/$1894: int=266, fp=227, STREAM=222, LINPACK =2219; 6226R/$1300: int=208, fp=192, STREAM=200, LINPACK =2073; 5220R/$1555: int=257, fp=220, STREAM=210, LINPACK =1610; 5218R/$1273: int=210, fp=188, STREAM=199, LINPACK =1290, test by Intel on 12/25/2019. First Gen Intel® Xeon® Gold processor: 1-node, 2x Intel Xeon Gold processor (61xx/$$) on Intel Reference platform with 384GB (12 slots / 32 GB / 61xx@2666,51xx@2400) total memory, ucode 0x500002c, HT on for all except off for STREAM (GB/s), LINPACK (GFLOPS/s), Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6152/$3655: int=224, fp=198, STREAM=200, LINPACK =1988; 6148/$3072: int=225, fp=198, STREAM=197, LINPACK =2162; 6146/$3286: int=161, fp=175, STREAM=185, LINPACK =1896; 6142/$2946: int=193, fp=176, STREAM=185, LINPACK =1895; 6140/$2445: int=202, fp=183, STREAM=188, LINPACK =1877; 6138/$2612: int=189, fp=195, STREAM=189, LINPACK =1976; 6130/$1894: int=172, fp=165, STREAM=185, LINPACK =1645; 6126(proj)/$1776: int=141, fp=157, STREAM=170, LINPACK =1605; 5120(proj)/$1555: int=148, fp=148, STREAM=159, LINPACK =924, 5118/$1273: int=134, fp=132, STREAM=149, LINPACK =818, test by Intel on 2/18/2020. Your costs and results may vary.

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Intel Reinforces Data Center Leadership with New 2nd Gen Intel Xeon Scalable Processors

Produits Intel - lun, 24/02/2020 - 16:00
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Intel today announced the addition of new performance and performance-per-dollar-optimized processors to the Intel® Xeon® Scalable platform, the industry’s most widely deployed server platform with more than 30 million units sold. The addition of these new processors targets the majority of Intel’s mainstream Xeon Scalable customers across cloud, network and edge. With broad availability starting today from leading OxMs, these new 2nd Gen Intel Xeon Scalable processors reinforce Intel’s data center leadership by providing greater performance and performance-per-dollar choices for customers.

“Intel’s data-centric platforms offer the broadest market coverage of any server processor platform -– from the cloud, through the network, to the intelligent edge,” said Lisa Spelman, corporate vice president and general manager of the Xeon and Memory Group within Intel’s Data Platform Group. “Working closely with our customers, we are delivering these new server processors to address their performance and pricing needs across a broad range of markets and workloads.”

More: 5G Network Portfolio Launch (Press Kit) | Intel Announces Unmatched Portfolio for 5G Network InfrastructureProduct Fact Sheet: Accelerating 5G Network Infrastructure, from the Core to the Edge

The new 2nd Gen Intel Xeon Gold processors deliver an average of 1.36-times higher performance1 and 1.42-times better performance-per-dollar1 compared with the 1st Gen Intel Xeon Gold processors.

To deliver this level of performance and value, Intel has optimized these new server processors in several areas, including adding more cores, increasing cache sizes or by boosting processor frequency. The new processors — labeled with an “R,” “T” or “U” suffix — are designed for dual- and single-socket mainstream and entry-level server systems. The addition of more cores and increased cache in these processors are targeted at workloads where capacity-per-server is critical, such as virtualized clouds, hyper-converged infrastructure (HCI) and network function virtualization (NFV).

Intel also announced today two new processors (Intel Xeon Gold 6256 and 6250) that feature the industry’s highest server processor frequency, delivering a base and turbo frequency up to 3.9 GHz and 4.5 GHz, respectively. These high-frequency processors are optimized for workloads that scale with clock frequency, such as financial trading, simulation and modeling, high-performance computing, and databases.

The new 2nd Gen Intel Xeon Scalable processors target three broad customer use cases:

  • Industry-leading frequencies for high-performance usages: New Intel Xeon Gold 6200 processors deliver up to 4.5 GHz processor frequency with Intel Turbo Boost Technology and up to 33% more processor cache, offering customers breakthrough performance for frequency-fueled workloads.
  • Enhanced performance for mainstream usages: New Intel Xeon Gold 6200R and 5200R processors deliver built-in value through a combination of higher base and Intel Turbo Boost Technology frequencies, in addition to increased processor cache.
  • Increased value and capability for entry-level, edge, networking and IoT usages: New Intel Xeon Gold 6200U, Silver 4200R, Sliver 4210T and Bronze 3200R processors deliver increased value for single-socket entry-level servers, as well as edge, networking and internet of things (IoT) usages.

Intel’s broad ecosystem partners are taking advantage of the additional Xeon Scalable processor value now. Hundreds of systems featuring the new 2nd Gen Intel Xeon Scalable processors are offered through leading OEMs and ODMs. Systems are available today, with more in the coming weeks.

With these new processors, Intel continues to reinforce its data center leadership by delivering the performance and value customers require. The 2nd Gen Intel Xeon Scalable processors support the broadest market coverage of any server processor platform. Today’s Intel Xeon Scalable processors remain the only mainstream server processor with built-in artificial intelligence (AI) acceleration, with Intel DL Boost technology and with support for Intel® Optane™ persistent memory, which offers a large and persistent memory tier at affordable costs.

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1 Performance results are based on testing as of dates in configuration and may not reflect all publicly available security updates. See configuration disclosure for details. No product can be absolutely secure.  For more complete information about performance and benchmark results, visitwww.intel.com/benchmarks. Refer to http://software.intel.com/en-us/articles/optimization-notice for more information regarding performance and optimization choices in Intel software products. Results have been estimated or simulated.

Configuration details updated on March 2, 2020, to reflect the latest SPEC guidelines.
36% More Performance and 42% More Performance/Dollar: Geomean of Integer Throughput (estimated SPECrate®2017_int_base), Floating Point Throughput (estimated SPECrate®2017_fp_base), STREAM Triad, and Intel® Distribution for LINPACK Across Ten New 2-socket 2nd Gen Intel® Xeon® Gold Processors Vs. First Generation. 2nd Gen Intel® Xeon® Gold R processors: 1-node, 2x 2nd Gen Intel Xeon Gold processor (62xxR/$$) on Intel Reference platform with 384GB (12 slots / 32 GB / 62xx@2933,52xx@2666) total memory, ucode 0x500002c, HT on for all except off for STREAM (GB/s), LINPACK (GFLOPS/s), Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6258R/$3950: int=323, fp=262, STREAM=224, LINPACK =3305; 6248R/$2700: int=299, fp=248, STREAM=224, LINPACK =3010; 6246R/$3286: int=238, fp=217, STREAM=225, LINPACK =2394; 6242R/$2529: int=265, fp=231, STREAM=227, LINPACK =2698; 6240R/$2200: int=268, fp=228, STREAM=223, LINPACK=2438; 6238R/$2612: int=287, fp=240, STREAM=222, LINPACK =2545; 6230R/$1894: int=266, fp=227, STREAM=222, LINPACK =2219; 6226R/$1300: int=208, fp=192, STREAM=200, LINPACK =2073; 5220R/$1555: int=257, fp=220, STREAM=210, LINPACK =1610; 5218R/$1273: int=210, fp=188, STREAM=199, LINPACK =1290, test by Intel on 12/25/2019. First Gen Intel® Xeon® Gold processor: 1-node, 2x Intel Xeon Gold processor (61xx/$$) on Intel Reference platform with 384GB (12 slots / 32 GB / 61xx@2666,51xx@2400) total memory, ucode 0x500002c, HT on for all except off for STREAM (GB/s), LINPACK (GFLOPS/s), Turbo on, with Ubuntu19.10, 5.3.0-24-generic, 6152/$3655: int=224, fp=198, STREAM=200, LINPACK =1988; 6148/$3072: int=225, fp=198, STREAM=197, LINPACK =2162; 6146/$3286: int=161, fp=175, STREAM=185, LINPACK =1896; 6142/$2946: int=193, fp=176, STREAM=185, LINPACK =1895; 6140/$2445: int=202, fp=183, STREAM=188, LINPACK =1877; 6138/$2612: int=189, fp=195, STREAM=189, LINPACK =1976; 6130/$1894: int=172, fp=165, STREAM=185, LINPACK =1645; 6126(proj)/$1776: int=141, fp=157, STREAM=170, LINPACK =1605; 5120(proj)/$1555: int=148, fp=148, STREAM=159, LINPACK =924, 5118/$1273: int=134, fp=132, STREAM=149, LINPACK =818, test by Intel on 2/18/2020. Your costs and results may vary.

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Navin Shenoy Introduces Intel’s 5G Network Portfolio

Produits Intel - lun, 24/02/2020 - 15:59

Navin Shenoy, Intel executive vice president and general manager of the Data Platforms Group, introduces the newest additions to Intel’s robust portfolio for 5G network infrastructure.

Read more about Intel’s 5G network transformation:

The post Navin Shenoy Introduces Intel’s 5G Network Portfolio appeared first on Intel Newsroom.