Intel Names Dawn Jones CDIO and VP of Social Impact

Produits Intel - mer, 14/04/2021 - 19:15

Intel Corporation today announced the appointment of Dawn Jones as chief diversity and inclusion officer (CDIO) and vice president of social impact, effective immediately. Jones is a 24-year Intel veteran and will lead the company’s global diversity and inclusion strategy as well as Intel’s investments and programs driving positive global impact. This includes prioritizing cross-company and industrywide initiatives to achieve Intel’s ambitious 10-year 2030 RISE Strategy. Jones will report to Sandra Rivera, Intel’s executive vice president and chief people officer.

“Dawn Jones is a leading advocate of actionable change who has demonstrated deep expertise and experience leading diversity initiatives on a global scale,” said Rivera. “Her experience inside and outside of Intel will enable her to lead this critical component of Intel’s business and global impact strategy to create innovative solutions through the advancement of diversity, inclusion and corporate responsibility at every level in our company and the broader industry.”

Since January 2021, Jones served as acting CDIO after the departure of Barbara Whye. Prior to that, Jones was global director of Policy, Strategy and Partnerships, responsible for Intel’s diversity and inclusion policy, strategy, communications, external alliances and stakeholder engagement. Jones’ philosophy that leadership is driven from any seat has propelled her at Intel from administrative assistant to Public Affairs manager of community and education investments to acting CDIO.

“Today starts a new chapter in our collective journey to create a more diverse, inclusive and responsible workplace, industry and world,” said Jones in response to the announcement. “I look forward to partnering across Intel and our industry to accelerate action on our most pressing issues, from persistent gaps in women and underrepresented minority leadership and systemic inequities to sustainability and inclusiveness.”

Jones graduated from Arizona State University with a Bachelor of Arts in broadcast journalism; she earned a Master of Science in communications management from Syracuse University.

The post Intel Names Dawn Jones CDIO and VP of Social Impact appeared first on Intel Newsroom.

Mobileye and Udelv Ink Deal for Autonomous Delivery

Produits Intel - lun, 12/04/2021 - 15:00

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  • Mobileye’s self-driving system ― branded Mobileye Drive™ ― will be the autonomous “driver” for Udelv’s next-generation electric self-driving delivery vehicle, called “Transporter,” which was revealed today.
  • Fleets of Transporters will begin operations in 2023; more than 35,000 Mobileye-driven Transporters will be produced between 2023 and 2028.
  • First pre-order of 1,000 Udelv Transporters announced today by Donlen, one of America’s largest commercial fleet leasing and management companies.
  • Premiere deal signals commercial readiness of Mobileye Drive™ for large-scale deployment in the movement of goods and people and maturity of Udelv’s delivery technology.

JERUSALEM, Israel, and BURLINGAME, Calif., April 12, 2021 – Mobileye, an Intel Company, and Udelv, a Silicon Valley venture-backed company, announced that Mobileye’s self-driving system ― branded Mobileye Drive™ ― will “drive” the next-generation Udelv autonomous delivery vehicles (ADV), called “Transporters.” The companies plan to produce more than 35,000 Mobileye-driven Transporters by 2028, with commercial operations beginning in 2023. Today’s news is believed to be the first large-scale deal for a self-driving system and signals that Mobileye Drive is ready for commercial deployment in solutions involving the autonomous movement of goods and people.

More: Mobileye Drive (Fact Sheet) | Autonomous Driving/Mobileye (Press Kit) | Mobileye News

“Our deal with Udelv is significant for its size, scope and rapid deployment timeline, demonstrating our ability to deliver Mobileye Drive™ for commercial use now and in volume,” said Prof. Amnon Shashua, Mobileye president and CEO. “COVID-19 has accelerated demand for autonomous goods delivery, and we are delighted to partner with Udelv to address this demand in the near term.”

Daniel Laury, CEO and co-founder of Udelv, said: “Mobileye is the only company providing a full-stack self-driving system with commercial viability and scale today. The readiness of Mobileye Drive™, along with its vast map coverage of North America, Europe and Asia, will allow us to ramp up the production and deployment of Udelv Transporters and rapidly offer the service at scale to our expanding list of customers.”

Last-mile delivery is the most expensive aspect of distribution, accounting for 53% of the overall cost of goods. At the same time, consumers are buying more and more goods online which is expected to raise urban last-mile delivery volume by 75 to 80% by 2030 and require 36% more delivery vehicles. And a shortage of drivers is making it difficult for companies to keep pace. It is a service model that is ripe for improvement.

Udelv’s customers expect Transporters to dramatically improve the efficiency of last- and middle-mile delivery services for everything from baked goods and auto parts to groceries and medical supplies.

Donlen, one of America’s largest commercial fleet management companies at the forefront of fleet management innovation and technology, today placed the first pre-order for 1,000 Transporters. This pre-order is believed to be the largest to date for an autonomous delivery vehicle.

“We are thrilled to be the first customer for the Udelv Transporter,” said Tom Callahan, president of Donlen. “The combination of Udelv’s zero-emissions Transporter and automated delivery management system with Mobileye Drive™ will enable sweeping delivery cost reductions, make our roads safer, and lower carbon emissions across America.”

Mobileye Drive comprises EyeQ™ system-on-chip-based level 4 (L4) compute, sensors and software, the company’s proprietary Road Experience Management™ AV mapping solution and Responsibility-Sensitive Safety-based autonomous driving policy. Udelv will perform the integration with its Delivery Management System, with Mobileye providing technical oversight. Mobileye will also provide over-the-air software support.

Mobileye-driven Transporters will be capable of L4 self-driving, point-to-point operation. Udelv’s proprietary tele-operations system will allow for the maneuvering of the vehicles at the edges of the mission, in parking lots, loading zones, apartment complexes and private roads.

Celebrated for creating the world’s first custom-made ADV that completed the first autonomous delivery in early 2018, Udelv has quietly performed extensive deployment trials with customers across various industries.

As one of Udelv’s early customers, Mike Odell, president and CEO of XL Parts and Marubeni Automotive Aftermarket Holdings, said: “We placed our trust in Udelv’s technology two years ago and are thrilled to witness the progress this company has made in such a short period of time. XL Parts remains committed to expanding its partnership with Udelv and to being one of the first clients for the Transporters.”

The deal with Udelv advances Mobileye’s global mobility-as-a-service ambitions, validating the company’s technology and business approach. Mobileye plans to deploy autonomous shuttles with Transdev ATS and Lohr Group beginning in Europe. Mobileye also plans to begin operating an autonomous ride-hailing service in Israel in early 2022.

About Mobileye

Mobileye is leading the mobility revolution with its autonomous driving and driver-assist technologies, harnessing world-renowned expertise in computer vision, machine learning, mapping, and data analysis. Our technology enables self-driving vehicles and mobility solutions, powers industry-leading advanced driver-assistance systems, and delivers valuable intelligence to optimize mobility infrastructure. Mobileye pioneered such groundbreaking technologies as True Redundancy™ sensing, REM™ crowdsourced mapping, and Responsibility Sensitive Safety (RSS) technologies that are driving the ADAS and AV fields towards the future of mobility. For more information,

About Udelv

On a mission to improve people’s lives, road safety and sustainable delivery, Udelv is revolutionizing the logistics space with its autonomous delivery vans (ADV) for last- and middle-mile delivery on public roads. Founded in California in 2017 by Daniel Laury and CTO Akshat Patel, Udelv successfully accomplished the first ever autonomous delivery on public roads in 2018. Udelv has since completed over 20,000 deliveries for multiple merchants in California, Arizona, and Texas and is preparing for expansion in many other states. Udelv’s focus on autonomous vehicles paired with its uPod delivery technology enable long-range and high-capacity deliveries that are eco, business and customer friendly. For more information, visit

About Donlen

Fleet management is moving in a new direction and you’ll want a trusted partner for the road ahead. Headquartered in Bannockburn, Illinois, Donlen develops innovative fleet management technology solutions and offers a proactive, hands-on approach to customer service. Donlen listens to your needs, truly understanding your business, and guides you towards a more successful future. Donlen is a wholly-owned subsidiary of Athene, a leading financial services company with total assets of $202.8 billion (as of Dec. 31, 2020). For more information, visit

The post Mobileye and Udelv Ink Deal for Autonomous Delivery appeared first on Intel Newsroom.

SD Supercomputer Center Selects Habana, Intel for Efficient AI

Produits Intel - jeu, 08/04/2021 - 14:00

What’s New: Intel today announced that San Diego Supercomputer Center (SDSC) at UC San Diego will leverage Habana’s purpose-built artificial intelligence (AI) training and inference accelerators, with Intel® Xeon® Scalable processors, in SDSC’s Voyager supercomputer for high-performance and high-efficiency AI compute. Expected to be in service in fall of 2021, Voyager is a first-of-its-kind in the National Science Foundation resource portfolio and will focus on advancing AI research across a range of science and engineering domains.

“With innovative solutions optimized for deep learning operations and AI workloads, Habana accelerators are ideal choices to power Voyager’s forthcoming AI research. We look forward to partnering with Habana, Intel and Supermicro to bring this uniquely efficient class of compute capabilities to the Voyager program, giving academic researchers access to one of the most capable AI-focused systems available today.”
–Amitava Majumdar, head of SDSC’s Data Enabled Scientific Computing division and principal investigator for the Voyager project

How It Works: The Voyager supercomputer will use Habana’s unique interconnectivity technology to efficiently scale AI capacity with 336 Gaudi processors for training and 16 Habana Goya processors for AI inference. Gaudi processors for AI training are architected for scaling large supercomputer training systems and are the industry’s only AI processor to natively integrate ten 100-gigabit Ethernet ports of RoCE RDMA v2 on chip, enabling flexibility of scaling and reduction of throughput bottlenecks that can limit scaling capacity.

“We are honored that Habana processors have been selected to accelerate compute workloads that will run on SDSC’s Voyager supercomputer,” said Eitan Medina, chief business officer at Habana, an Intel Company. “This implementation of our Gaudi and Goya products showcases how top academic institutions like SDSC can harness efficiency and performance to effectively address the growing computational demands of AI research workloads.”

Why It’s Important: The first three years of Voyager’s operation will be the Testbed Phase, during which SDSC will work with select research teams from astronomy, climate sciences, chemistry, particle physics and other fields to gain AI experience and insights leveraging Voyager’s unique features. The documentation developed during the Testbed Phase will serve as a resource for an expanded user base.

“The level of performance and efficiency that Voyager will require is precisely what Intel architectures are designed for,” said Trish Damkroger, vice president and general manager of Intel’s High Performance Computing Group. “Our Xeon Scalable processors coupled with Habana AI accelerators will ensure Voyager’s users have the HPC and AI capabilities they need to power their game-changing research.”

About the Technology: Voyager will leverage the following AI systems:

“Combining Supermicro’s advanced application-optimized server and storage hardware with Habana’s AI training and inference products is the best solution for SDSC’s multiyear Voyager AI project,” said Ray Pang, vice president of Technology and Business Enablement, Supermicro. “We continue to work closely with leading innovators to deliver solutions for computationally intensive projects worldwide at leading research and HPC environments for science and medical discovery, compute and leading-edge AI solutions.”

The Voyager supercomputer buildout, as well as ongoing community support and operations, are funded by a grant from the National Science Foundation.

More Context: Habana AI Accelerators Chosen by the San Diego Supercomputer Center to Power Voyager Research Program (Habana News Release) | San Diego Supercomputer Center | | Intel HPC

More Partner Stories: Intel Customer Spotlight on | Partner Stories on Intel Newsroom

The post SD Supercomputer Center Selects Habana, Intel for Efficient AI appeared first on Intel Newsroom.

Media Alert: April Intel Partner Connect 2021 (Virtual)

Produits Intel - mer, 07/04/2021 - 18:00

On April 20-22, Intel will host its first of three Intel Partner Connect events for 2021. April’s virtual event gives Partner Alliance members an opportunity to hear from Intel leaders on the priorities and challenges for the coming year. Participants will be able to interact with the industry’s premier ecosystem for solutions to today’s most challenging problems.

Intel believes 2021 will bring incredible business opportunity for partners. At April’s Intel Partner Connect, participants will learn how to demonstrate excellence in technology innovation, go-to-market strategizing, sales growth, marketing and more. The event aims to empower businesses to grow faster to drive global progress that enriches lives.

Intel Partner Connect provides access to Intel’s executive leadership, subject matter experts and information on product priorities and key technology trends. Participants can experience solutions through demonstrations and connect with Intel and sponsoring partners to gain insights into how technology is shaping the future.

What: Intel Partner Connect (virtual)

Who: Intel Partner Alliance members and business leaders


  • EMEA: 9:30 a.m. – 15:15 CEST, Tuesday, April 20, 2021
  • Asia: 12:30 p.m. – 18:00 HKT, Wednesday, April 21, 2021
  • Americas: 8 a.m. – 1:30 p.m. PDT, Thursday, April 22, 2021


Premier Sponsors: Accenture, Dell Technologies, HP, Lenovo, Microsoft, VMware

More Context: Intel Partner Connect

The post Media Alert: April Intel Partner Connect 2021 (Virtual) appeared first on Intel Newsroom.

Leveraging Technology to Provide Global Pandemic Relief

Produits Intel - mer, 07/04/2021 - 15:00
Rick Echevarria
Vice President, Sales, Marketing, and Communications Group​​​​​
General Manager, Intel Olympic Program

By Rick Echevarria

One year ago, Intel launched the Pandemic Response Technology Initiative (PRTI), a $50 million commitment to use technology to combat the effects of COVID-19. The Initiative sought to provide a 360-degree view of the challenges ahead, focusing on how our technologies can enhance healthcare, education and the economic recovery of businesses at multiple levels. Our goals were to provide immediate relief where it was needed most, develop innovative solutions to support the new normal and invest in technology that would limit the impact of future crises. Nearly every piece of Intel® technology was leveraged in some way.

Twelve months later, the scope of PRTI work includes 230 projects spread across 170 organizations. We’ve partnered with organizations around the world to apply our solutions and expertise to geographically unique problems as well as global challenges, and we don’t want to stop.

INFOGRAPHIC: Mapping the Impact of Intel’s Pandemic Response Technology Initiative

Aligned with Intel’s RISE 2030 goals, we are transitioning this process and the technical expertise of our employee volunteers to the Intel RISE Technology Initiative (IRTI). The IRTI will continue to review and fund projects related to healthcare, education and the economy with new dedicated workstreams for social equity and human rights, accessibility, and climate action.

IRTI will create a broader, purpose-driven platform for action with a new $20 million commitment. We’re excited to share more about those projects throughout the year. For now, our work with the PRTI offers a glimpse at what can be achieved through technology, strategic partnerships and a collective desire to do good.

Diagnose, Treat and Prevent the Next Pandemic

The challenges of the healthcare industry are innumerable. When assessing projects, how do you choose between helping patients, assisting medical staff, funding life-saving research or making sense of massive amounts of unstructured patient data? We wanted to ensure we were tapping into the full breadth of Intel’s portfolio to provide support and make a lasting difference. The PRTI worked with partners across the healthcare space, from universities and hospitals to equipment manufacturers and infrastructure partners, to maximize our impact at every level.

Diagnose: In early 2020, there was a huge shortage of polymerase chain reaction tests, which are critical to the analysis and identification of infectious agents. Intel partners in the medical imaging space stepped up to use CT and X-ray scanning machines to help diagnose and triage patients with COVID-19. Using artificial intelligence (AI), these machines were able to determine the presence and severity of COVID-19 and facilitate a treatment plan when tests weren’t readily available. This paved the way for organizations to create diverse datasets for more accurate diagnoses. UC San Francisco leveraged Intel® SGX to deploy a confidential computing platform that will help protect both the algorithms and privacy of healthcare data when building AI models.

Treat: Telehealth solutions enabled access to medical care while minimizing the risk for patients and clinicians. Intel worked with Banner Health and VeeMed to augment in-room displays with Intel® NUC Mini PCs running telehealth software. Providers and specialists were able to consult on COVID-19 cases, and medical staff could remotely speak to patients, log data from in-room monitors and even zoom in to check a patient’s vitals.

Prevent: Our projects targeted patient and provider needs along with work in research and therapeutic development. This included partnering with our customers to provide high performance compute (HPC) resources for COVID-19 research as well as research projects that go beyond the current pandemic. The Berlin Institute of Health leveraged Intel®-based HPC architecture to successfully perform compute-intensive RNA sequencing on a single-cell level to better understand how the novel coronavirus works.

Connect, Engage and Evolve Education

The immediate needs in the education space during the pandemic were very clear: Children needed devices and connectivity to stay in school. As we worked to provide devices to students, we learned that focusing on connectivity alone would be a “maintenance-only” solution. We wanted students to actually advance. We partnered with schools, ecosystem partners, local governments, teachers and device manufacturers to make a difference through a solutions-led approach.

Connect: The PRTI engaged in many opportunities to distribute laptops and bolster connectivity in communities around the world. With the Intel® Online Learning Initiative, we were able to serve a million students globally. In the U.S., we focused in the areas of most need, we provided a remote learning solution to students in over 15,000 families representing 45 school districts that serve Title 1 students in the U.S.

Among the students awarded were cadets from the Airforce JROTC program at Aberdeen High School in Mississippi, which offers a gateway to Advanced Placement Computer Science education.

For Aberdeen High School in Mississippi, we provided a remote learning solution to students in over 15,000 families representing 45 school districts that serve Title 1 students in the U.S. Among the students awarded were cadets from the Airforce JROTC program, which offers a gateway to Advanced Placement Computer Science education.

Engage: Through our work with the LA Unified School District, we learned that 30% of students who were able to connect while distance learning would switch off. We realized the need to develop educational materials that keep students engaged. Our Houston Space Center partnership created a new public program around NASA’s Artemis mission to the moon in 2024. A group of 500 educators engaged in the deployment of virtual learning experiences about the next manned moon mission. The project will include future NASA missions, too.

Evolve: One of our most exciting education projects focused on the crucial emotional support teachers provide. District Zero is a Chicago-based company that focuses on wellness-based learning. Using natural-language processing and sentiment analysis, District Zero’s emotional learning tool gives teachers actionable insights and solutions to help students who may be struggling. With Intel’s support, the company will deploy its system for all students in the Indian Prairie School District that serves 30,000 students from areas outside just outside of Chicago.

Protect, Adapt and Enable the Economy

Throughout the year, we looked at multiple factors contributing to the economic downturn. The common theme was safety, whether it’s developing solutions that make it safe for businesses to open, minimizing the risk to patrons or investing in solutions that help deliver a more resilient economy when the next global health crisis occurs.

Protect: Citywide quarantines and stay-at-home orders are a last resort designed to stop the spread of contagious disease, but even with these protective measures in place, businesses need to be able to open safely to serve essential needs. The PRTI invested in several projects designed to make buildings safer during the pandemic, including AI-enabled occupancy and social distancing controls with Johnson Controls. The solution trades human observation monitoring of social distancing for environmental data and sensors to optimize air quality and physical distancing analysis.

Adapt: Helping businesses adapt to facilitate essential activities is key to economic recovery. While movement and travel were greatly limited by the pandemic, they cannot be eliminated completely. GE Digital Aviation Software developed a new predictive maintenance application for cabin air quality to help airline carriers proactively monitor the health of air quality systems on their flights.

Enable:  Investing in solutions offers a degree of resilience against the future spread of disease and pandemics. With funding from Intel, Purdue University is developing autonomous robots that can detect pathogens and disinfect within seconds. Two functional robots already exist and are being tested in Purdue COVID-19 quarantine rooms and classrooms. Six patents later, the college is moving toward commercialization opportunities. The hope is that this work will help make public spaces safer and minimize exposure risk in high-traffic “hot zone” areas for pathogens.

A New Path for Positive Impact with the IRTI

Key to the success of the PRTI projects are the scores of Intel experts working with partners to understand the heart of the issues and provide tailored solutions that yield real results. You can see a map of our global impact with the PRTI and you can watch for this map to grow as we continue this work through the IRTI. The work has already started with the IRTI, and we’re looking forward to sharing more throughout the year. Visit the website for more information.

Rick Echevarria is vice president in the Sales, Marketing and Communications Group and general manager of the Intel Olympic Program at Intel Corporation. He leads Intel’s Pandemic Response Technology Initiative.

The post Leveraging Technology to Provide Global Pandemic Relief appeared first on Intel Newsroom.

Intel Xeon Advances Nasdaq’s Homomorphic Encryption R&D

Produits Intel - mar, 06/04/2021 - 17:00
Nasdaq, a global technology company, leverages the crypto acceleration in Intel’s 3rd Generation Intel Xeon Scalable platform to significantly speed up computation for its high performance advanced homomorphic encryption applications. (Credit: Nasdaq)

What’s New: Nasdaq, a global technology company serving the capital markets and other industries, is leveraging the crypto acceleration in Intel’s 3rd Generation Intel® Xeon® Scalable platform to significantly speed up computation for its high performance advanced homomorphic encryption (HE) applications. HE is an emerging form of encryption that allows the ability to compute private data without having to decrypt the data.

“Homomorphic encryption is a powerful new tool that will allow our customers to gain valuable insights while protecting the most private and sensitive data. In our collaboration with Nasdaq, we are building advanced technology to power the future of computing.”
–Nir Peled, general manager, Private AI and Analytics, Intel

Why It Matters: Intel continues to introduce new instruction set architecture (ISA) extensions designed to significantly increase cryptographic performance and further enable the emerging HE ecosystem. HE allows users to compute on always-encrypted data. The data never needs to be decrypted, helping reduce the risk from cyberthreats. HE offers developers and enterprises new ways of gaining insights from sensitive data across organizations, and Intel’s platform improves performance to support end-to-end data encryption. To further accelerate HE applications, Intel and Nasdaq are co-engineering HE calculations utilizing the new Advanced Vector Extensions (AVX) 512 Integer Fused Multiply Add Instructions (AVX512_IFMA) available in the latest 3rd Gen Intel Xeon Scalable processor.

To test the real-world applications of HE, Nasdaq validates these capabilities through a variety of proof of concepts. It has been utilizing HE to better enable artificial intelligence and machine learning datasets, as well as apply HE in Nasdaq’s fight against financial crime — particularly around anti-money laundering (AML) and fraud detection. Having the ability to unlock proprietary data without exposing the data itself allows for a stronger collective effort to consolidate unique datasets to analyze and identify potential financial crime activity.

“Homomorphic encryption permits computation on encrypted data without decryption, enabling users to gain new insights from encrypted datasets,” said Nikolai Larbalestier, senior vice president, Enterprise Architecture at Nasdaq. “However, HE is performance-intensive and poses usability challenges for large, enterprise-size datasets. For Nasdaq, we have been exploring and experimenting with HE in strengthening our technology solutions that focus on financial crime detection while also complying with data privacy regulations. The performance improvements achieved with Intel’s latest Xeon platform will support our efforts in wider adoption of HE, particularly in improving data analysis and insights, as well as product innovation around areas such as anti-financial crime.”

How It Works: Homomorphic encryption (HE) is a powerful new technique for enabling computation and collaboration on private and sensitive data through end-to-end encryption. HE could revolutionize how financial institutions interact with and share datasets for analysis in the future, empowering organizations to gain valuable insights while reducing risk of exposure that could compromise confidentiality.

Trusted execution environments, such as Intel® Software Guard Extensions (Intel® SGX), also address the protection of data while being processed in memory, though from a slightly different angle. Intel SGX provides a hardware-based trusted enclave for general-purpose workloads to operate within, protecting both data and code from the broader system stack with minimal performance overhead. As performance and usability challenges are resolved, HE promises to bring new options for end-to-end encryption, especially in purpose-specific data-sharing schemes. This is a new frontier and a burgeoning arena for innovation as attacks become more sophisticated and regulatory expectations increase.

Intel also recently announced that it had been selected as a research partner to perform in DARPA’s Data Protection in Virtual Environments (DPRIVE) program. The multi-year program aims to develop an accelerator for fully homomorphic encryption (FHE) to reduce the performance overhead currently associated with it. When realized, the accelerator could deliver a massive improvement in executing FHE workloads. Intel is collaborating with partners to provide leadership in this exciting field, ensuring the broadest and most performant set of options for protecting sensitive data wherever it resides.

More Context: 3rd Gen Intel Xeon Scalable Launch (Press Kit) | Intel® Homomorphic Encryption Toolkit (Intel® HE Toolkit) | Intel to Collaborate with Microsoft on DARPA Program | Nasdaq Decodes: Tech Trends 2021

Intel Partner Stories: Intel Customer Spotlight on | Partner Stories on Intel Newsroom

The post Intel Xeon Advances Nasdaq’s Homomorphic Encryption R&D appeared first on Intel Newsroom.

New Intel Processors Accelerate 5G Network Transformation

Produits Intel - mar, 06/04/2021 - 17:00

What’s New: Intel today launched its newest 3rd Gen Intel® Xeon® Scalable processor (code-named “Ice Lake”), including new network-optimized “N-SKUs” along with verified solution blueprints that accelerate time to market. New “N-SKUs” deliver an average 62% more performance1 on a range of broadly deployed 5G and network workloads over the prior generation. Intel also announced it has started sampling next-generation Intel® Xeon® D processors designed for space and power-constrained environments at the edge.

“We are further unleashing the capabilities of 5G and the power of the intelligent edge with our latest network-optimized 3rd Gen Intel Xeon Scalable processors. Designed to support diverse network environments, our newest 3rd Gen processors and platform ingredients enable global communications service providers to deliver the next breakthrough in network innovation for even richer consumer and enterprise use cases.”
–Dan Rodriguez, Intel corporate vice president and general manager, Network Platforms Group

Why They Matter: With the buildout of 5G and the rise of the intelligent edge, network infrastructure and technology need to evolve. As the leading provider of network silicon, Intel delivers the most complete set of network technologies to transform the network, and fosters the broadest, most proven ecosystem so customers have more choices and can accelerate time to deployment.

About 3rd Gen Intel Xeon Scalable Processors: The new network-optimized SKUs are the ideal choice for wireless core, wireless access, network edge workloads and security appliances. They are available in a range of cores, frequency, features and power to deliver lower latency, higher throughput and deterministic performance for service provider network transformation requirements.

Security is important for 5G networks, and Intel® Software Guard Extensions integrated into the 3rd Gen Xeon processors enable secure channel setup and communication between the 5G control functions. Built-in crypto acceleration can reduce the performance impact of full data encryption and increase the performance of encryption-intensive workloads.

How They Pair With Other Platform Ingredients: 3rd Gen Intel Xeon Scalable processors can be paired with Intel’s suite of platform ingredients and software — including Intel® FPGAs, Intel® Ethernet 800 series adapters, Intel® Optane™ persistent memory, FlexRAN, OpenNESS, Open Visual Cloud and Intel® Smart Edge — to bring the processor performance to life and help customers achieve the right total cost of ownership.

Agilex 10 nanometer (nm) FPGAs, which are now shipping and achieve nearly twice the performance per watt over competing 7nm devices, are being used in wireless core and access segments to provide infrastructure acceleration capabilities and other valuable features to complement core and access workloads running on Intel Xeon Scalable processors.

What Network-Optimized SKUs Enable: A flexible infrastructure is paramount as customers must keep pace with the ever-growing need for data. Network-optimized 3rd Gen Intel Xeon Scalable processors are designed to support diverse operator network environments, and optimized for multiple workloads, for example:

  • 5G wireless core: With 3rd gen Intel Xeon Scalable processors, Intel has demonstrated that communications service providers can increase 5G UPF performance by up to 42%1. Combined with Intel Ethernet 800 series adapters, they can deliver the performance, efficiency and trust for use cases that require low latency, including augmented reality, cloud-based gaming, discrete automation and even robotic-aided surgery.
    • Rakuten Mobile Inc. (Rakuten Mobile): Rakuten Mobile is working with Intel to leverage new features available in 3rd Gen Intel Xeon Scalable processors for its next-generation mobile cloud platform server, which will support various workloads in central and regional data centers.
    • SK Telecom: Now with the 3rd Generation Intel Xeon Scalable processor paired with Ethernet adapters and optimized NFV solutions, SK Telecom can accelerate deployment of the latest technologies in the core and throughout the 5G network. This will result in its subscribers enjoying stable 5G service quality.
  • vRAN: As operators virtualize the Radio Access Network (vRAN) for agility, they are relying on 5G massive multiple-input and multiple-output (MIMO) to increase capacity and throughput. With Intel’s newest Intel Xeon processors, Intel Ethernet 800 series adapters and Intel vRAN dedicated accelerators, customers can double massive MIMO throughput in a similar power envelope for a best-in-class 3x100MHz 64T64R vRAN configuration.1
    • Verizon: Verizon has been on the leading edge of virtualizing their entire network, including the RAN. Intel Xeon processors deliver processing requirements to support Verizon’s end-to-end virtualization goals, and the advancements in the silicon provide higher capacity and efficiency for vRAN.
    • Vodafone: Vodafone depends on the most advanced technologies and partnerships to build an agile and flexible mobile network, as they bring Open RAN to commercial reality. Intel has been a long-standing partner to Vodafone, bringing a diverse and innovative ecosystem. The newest 3rd Gen Intel Xeon Scalable processors are a good example of the high-performance technology that can be leveraged as Vodafone works on 5G massive MIMO workflows for Open RAN development.
  • CDN:. With Intel 3rd Gen Xeon Scalable processors and the latest Intel Optane persistent memory, customers can get up to 1.63 times higher throughput and 33% more memory capacity, enabling them to serve the same number of subscribers at higher resolution or a greater number of subscribers at the same resolution.1
    • AT&T: AT&T has been working with Intel as a strategic technology collaborator since 2016 to deliver a scalable, standards-based infrastructure to address the increased demand for live, high definition content. With the combination of Intel 3rd Gen Xeon Scalable processors performance and power savings with Intel Optane Persistent Memory, AT&T can expand CDN capacity with fewer nodes, providing significant savings in total cost of ownership.

About Intel® Select Solutions: Intel announced updates to its network workload-optimized solutions for vRAN, Visual Cloud Deliver Network and NFVI Forwarding Platform, which offer pre-tested and verified configurations that accelerate development time and simplify infrastructure deployment. These solutions were developed with various software partners, including Red Hat, VMware and Wind River. Intel is also working with a number of Intel Network Builders ecosystem partners to verify their offerings for these solutions, including: ASUS, Advantech, Hewlett Packard Enterprise (HPE), Intequus, Inventec, Lanner Electronics, Lenovo, Nexcom, QCT, Supermicro and ZT Systems.

About Next Generation Intel Xeon D Processors: Code-named “Ice Lake-D,” these processors are designed to support denser, size-constrained and ruggedized designs at the edge. Intel is now sampling these processors and working with customers and partners including Cisco for networking products, Supermicro for FlexRAN-based vRAN solutions and Rakuten Mobile for next-generation RAN products to serve higher capacity needs.

More Context: News Release: Intel Launches Its Most Advanced Performance Data Center Platform | Press Kit: 3rd Gen Intel Xeon Scalable Launch | 5G Network Performance Made Flexible (Dan Rodriguez Event Track) | 5G Network Performance Made Flexible (infographic)

The Small Print:

Notices & Disclaimers
1Performance varies by use, configuration and other factors. See [91] at

Intel technologies may require enabled hardware, software or service activation.

No product or component can be absolutely secure.

Your costs and results may vary.

The post New Intel Processors Accelerate 5G Network Transformation appeared first on Intel Newsroom.

Intel Teams with Leidos, Fortanix to Accelerate Clinical Trials

Produits Intel - mar, 06/04/2021 - 17:00

What’s New: Leidos and Fortanix are using Intel® Software Guard Extension (Intel® SGX), a unique security technology of Intel® Xeon® processors, to help streamline and accelerate the clinical drug trial process. Leidos provides information technology services for a variety of industries, including life sciences. As clinical trials have become increasingly complex, building systems that can address privacy and security concerns are paramount for driving collaboration that can accelerate therapies to market.

“Collection and analysis of protected medical data is fraught with challenges, including the sensitivity of and distributed nature of the data across multiple healthcare entities and systems, which requires strong protections for patient privacy. Technology now gives us the tools to securely share private information between parties and create a collaborative, real-time clinical information system. By addressing security concerns at the hardware level, Intel SGX creates a trusted computing environment that helps ensure data integrity and privacy. This means information is shared and validated more quickly and securely — and needed therapies can more quickly be presented to those in need.”
–Chris Gough, general manager, Health and Life Sciences at Intel

How It Works: Intel SGX and the Fortanix Confidential Computing Manager provide the foundation for creating a distributed network of trusted computing environments. This enables Leidos to deliver services that facilitate the real-time sharing of critical data while meeting the stringent patient and industry compliance regulations.

Why It Matters: The ability to quickly and cost-effectively get new drugs to market and help ensure safety once there is one of healthcare’s greatest challenges. Real-world data (RWD) — including electronic health records — has the potential to increase the efficiency of the traditional drug development process and improve future clinical trial design. And increasing the body of knowledge around how to use RWD in clinical research can speed the adoption of these methods.

However, gathering RWD from hospitals, clinics and medical groups must be accomplished while preserving patient privacy and complying with HIPAA and other regulations. All queries, data, applications and results must be encrypted at rest, in motion and in use. This historically has been a huge technological challenge. However, Intel SGX enclaves, orchestrated using Fortanix Confidential Computing Manager, now enable Leidos to create a distributed trusted computing environment that meets all these requirements.

“Our team at Leidos understands the technological challenges associated with clinical information systems and the need to create trusted computing environments to securely share information,” said Erika Killian, FDA Portfolio director at Leidos. “Intel SGX gives us the hardware foundation needed to build an ecosystem of partners that can confidently share data privately and securely, while still meeting the stringent compliance regulations in the space. Given the size and scope of these sorts of trials, we’re also excited by the upcoming scalability and performance enhancements that will enable us to run larger amounts of data through SGX enclaves.”

How It’s Unique: At its core, Intel SGX is a set of instructions that increases the security of application code and data, giving them more protection from disclosure or modification. Developers can partition sensitive information into enclaves (or Trusted Execution Environments or TEEs), which are areas in memory on the processor that protect data while in use and only allow access by authorized code. The enclaves are isolated from the rest of the environment to ensure transmitted information is encrypted and can only be decoded once inside the enclave. Finally, applications running in these protected areas are verified and signed by data suppliers, which helps protect against malicious functions hidden in application code.

Leidos utilizes Intel SGX to create a centralized research portal where enclaves capture, encrypt and analyze data. Secure enclaves at RWD endpoints receive queries, verify policy approvals, gather data and return requests to the centralized portal. Using the Fortanix Self-Defending Key Management Service as a centralized key management system, with cryptographic keys also being protected within Intel SGX enclaves, requested clinical data is tokenized and remains encrypted at rest, in transit and in use.

More Context: 3rd Gen Intel Xeon Scalable Launch (Press Kit)

Intel Partner Stories: Intel Customer Spotlight on | Partner Stories on Intel Newsroom

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Intel Launches Its Most Advanced Performance Data Center Platform

Produits Intel - mar, 06/04/2021 - 17:00

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  • New 3rd Gen Intel® Xeon® Scalable processors — combined with Intel’s portfolio of Intel® Optane™ persistent memory and storage, Ethernet adapters, FPGAs and optimized software solutions — deliver performance and workload optimizations across hybrid-cloud, high performance computing (HPC), networking and intelligent edge applications.
  • New 3rd Gen Intel Xeon Scalable processors feature a flexible architecture with integrated artificial intelligence (AI) acceleration with Intel® DL Boost technology, plus advanced security capabilities to protect data and application code with Intel® Software Guard Extension (Intel® SGX) and Intel® Crypto Acceleration.
  • New 3rd Gen Intel Xeon Scalable processors are rapidly ramping, having shipped more than 200,000 units for revenue in the first quarter of 2021 with broad industry adoption across all market segments, including the world’s top cloud service providers set to deploy services; more than 250 design wins within 50 unique OxM partners; more than 15 major telecom equipment manufacturers and communications service providers readying POCs and networking deployments; and over 20 HPC labs and HPC-as-a-service environments leveraging our latest Xeon Scalable processors.

SANTA CLARA, Calif., April 6, 2021 – Intel today launched its most advanced, highest performance data center platform optimized to power the industry’s broadest range of workloads — from the cloud to the network to the intelligent edge. New 3rd Gen Intel Xeon Scalable processors (code-named “Ice Lake”) are the foundation of Intel’s data center platform, enabling customers to capitalize on some of the most significant business opportunities today by leveraging the power of AI.

More: Press Kit: 3rd Gen Intel Xeon Scalable Launch | Event Livestream & Replay: 3rd Gen Intel Xeon Scalable Launch | News Byte: New Intel Processors Accelerate 5G Network Transformation | News Byte: Intel Teams with Leidos, Fortanix to Accelerate Clinical Trials | News Byte: Intel Xeon Advances Nasdaq’s Homomorphic Encryption R&D | Product Fact Sheet: 3rd Gen Intel Xeon Scalable Platform | SKU Stack
Editor’s Note: This news release’s headline and body copy have been adjusted to reference the “only x86 data center processor with built-in AI.”

New 3rd Gen Intel Xeon Scalable processors deliver a significant performance increase compared with the prior generation, with an average 46% improvement on popular data center workloads.1 The processors also add new and enhanced platform capabilities including Intel SGX for built-in security, and Intel Crypto Acceleration and Intel DL Boost for AI acceleration. These new capabilities, combined with Intel’s broad portfolio of Intel® Select Solutions and Intel® Market Ready Solutions, enable customers to accelerate deployments across cloud, AI, enterprise, HPC, networking, security and edge applications.

“Our 3rd Gen Intel Xeon Scalable platform is the most flexible and performant in our history, designed to handle the diversity of workloads from the cloud to the network to the edge,” said Navin Shenoy, executive vice president and general manager of the Data Platforms Group at Intel. “Intel is uniquely positioned with the architecture, design and manufacturing to deliver the breadth of intelligent silicon and solutions our customers demand.”

3rd Gen Intel Xeon Scalable Processors

Leveraging Intel 10 nanometer (nm) process technology, the latest 3rd Gen Intel Xeon Scalable processors deliver up to 40 cores per processor and up to 2.65 times higher average performance gain compared with a 5-year-old system.2 The platform supports up to 6 terabytes of system memory per socket, up to 8 channels of DDR4-3200 memory per socket and up to 64 lanes of PCIe Gen4 per socket.

New 3rd Gen Intel Xeon Scalable processors are optimized for modern workloads that run in both on-premise and distributed multicloud environments. The processors provide customers with a flexible architecture including built-in acceleration and advanced security capabilities, leveraging decades of innovation.

  • Built-in AI acceleration: The latest 3rd Gen Intel Xeon Scalable processors deliver the AI performance, productivity and simplicity that enable customers to unlock more valuable insights from their data. As the only x86 data center processor with built-in AI acceleration, extensive software optimizations and turnkey solutions, the new processors make it possible to infuse AI into every application from edge to network to cloud. The latest hardware and software optimizations deliver 74% faster AI performance compared with the prior generation and provide up to 1.5 times higher performance across a broad mix of 20 popular AI workloads versus AMD EPYC 7763 and up to 1.3 times higher performance on a broad mix of 20 popular AI workloads versus Nvidia A100 GPU.3
  • Built-in security: With hundreds of research studies and production deployments, plus the ability to be continuously hardened over time, Intel SGX protects sensitive code and data with the smallest potential attack surface within the system. It is now available on 2-socket Xeon Scalable processors with enclaves that can isolate and process up to 1 terabyte of code and data to support the demands of mainstream workloads. Combined with new features, including Intel® Total Memory Encryption and Intel® Platform Firmware Resilience, the latest Xeon Scalable processors address today’s most pressing data protection concerns.
  • Built-in crypto acceleration: Intel Crypto Acceleration delivers breakthrough performance across a host of important cryptographic algorithms. Businesses that run encryption-intensive workloads, such as online retailers who process millions of customer transactions per day, can leverage this capability to protect customer data without impacting user response times or overall system performance.

Additionally, to accelerate workloads on the 3rd Gen Intel Xeon Scalable platform, software developers can optimize their applications using oneAPI open, cross-architecture programming, which provides freedom from technical and economic burdens of proprietary models. The Intel® oneAPI Toolkits help realize the processors’ performance, AI and encryption capabilities through advanced compilers, libraries, and analysis and debug tools.

Intel Xeon Scalable processors are supported by more than 500 ready-to-deploy Intel® IoT Market Ready Solutions and Intel Select Solutions that help to accelerate customer deployments — with up to 80% of our Intel Select Solutions being refreshed by end of year.

Industry-Leading Data Center Platform

Intel’s data center platforms are the most pervasive on the market, with unmatched capabilities to move, store and process data. The latest 3rd Gen Intel Xeon Scalable platform includes the Intel Optane persistent memory 200 series, Intel Optane Solid State Drive (SSD) P5800X and Intel® SSD D5-P5316 NAND SSDs, as well as Intel Ethernet 800 Series Network Adapters and the latest Intel® Agilex FPGAs. Additional information about all these is available in the 3rd Gen Intel Xeon Scalable platform product fact sheet.

Delivering Flexible Performance Across Cloud, Networking and Intelligent Edge

Our latest 3rd Gen Xeon Scalable platform is optimized for a wide range of market segments — from the cloud to the intelligent edge.

  • For the cloud: 3rd Gen Intel Xeon Scalable processors are engineered and optimized for the demanding requirements of cloud workloads and support a wide range of service environments. Over 800 of the world’s cloud service providers run on Intel Xeon Scalable processors, and all of the largest cloud service providers are planning to offer cloud services in 2021 powered by 3rd Gen Intel Xeon Scalable processors.
  • For the network: Intel’s network-optimized “N-SKUs” are designed to support diverse network environments and optimized for multiple workloads and performance levels. The latest 3rd Gen Intel Xeon Scalable processors deliver on average 62% more performance on a range of broadly-deployed network and 5G workloads over the prior generation.4 Working with a broad ecosystem of over 400 Intel® Network Builders members, Intel delivers solution blueprints based on 3rd Gen Intel Xeon Scalable processor “N SKUs,” resulting in accelerated qualification and shortened time-to-deployment for vRAN, NFVI, virtual CDN and more.
  • For the intelligent edge: 3rd Gen Intel Xeon Scalable processors deliver the performance, security and operational controls required for powerful AI, complex image or video analytics, and consolidated workloads at the intelligent edge. The platform delivers up to 1.56 times more AI inference performance for image classification than the prior generations.5

For more details, see the 3rd Gen Intel Xeon Scalable SKU table.

1See [125] at Results may vary.

2See [25] at Results may vary.

3See [123, 43, 44] at Results may vary.

4See [91] at Results may vary.

5See [121] at Results may vary.

Performance varies by use, configuration and other factors. Learn more at​.

Performance results are based on testing as of dates shown in configurations and may not reflect all publicly available ​updates.  See backup for configuration details.  No product or component can be absolutely secure.

Intel contributes to the development of benchmarks by participating in, sponsoring, and/or contributing technical support to various benchmarking groups, including the BenchmarkXPRT Development Community administered by Principled Technologies.

Your costs and results may vary.

Intel technologies may require enabled hardware, software or service activation.

Some results may have been estimated or simulated.

Intel does not control or audit third-party data.  You should consult other sources to evaluate accuracy.

All product plans and roadmaps are subject to change without notice.

Statements in this document that refer to future plans or expectations are forward-looking statements.  These statements are based on current expectations and involve many risks and uncertainties that could cause actual results to differ materially from those expressed or implied in such statements.  For more information on the factors that could cause actual results to differ materially, see our most recent earnings release and SEC filings at

The post Intel Launches Its Most Advanced Performance Data Center Platform appeared first on Intel Newsroom.

3rd Gen Intel Xeon Scalable Launch (Replay)

Produits Intel - mar, 06/04/2021 - 16:23

On April 6, 2021, Intel’s Navin Shenoy, executive vice president in the Data Platforms Group, and Lisa Spelman, corporate vice president in the Xeon and Memory Group, launched the latest 3rd Gen Intel® Xeon® Scalable processors (code-named “Ice Lake”) and the latest additions to Intel’s hardware and software portfolio targeting data centers, 5G networks and intelligent edge infrastructure.

The virtual “How Wonderful Gets Done 2021” launch event featured Intel executives and ecosystem partners addressing some of today’s greatest business opportunities. The event also included brief remarks by Intel Chief Executive Officer Pat Gelsinger.

More: Visit the Intel events website for more information or follow along on Twitter at @IntelNews and @Intel.

More: News Release: Intel Launches Its Most Advanced Performance Data Center Platform | Press Kit: 3rd Gen Intel Xeon Scalable Launch | News Byte: New Intel Processors Accelerate 5G Network Transformation | News Byte: Intel Teams with Leidos, Fortanix to Accelerate Clinical Trials | News Byte: Intel Xeon Advances Nasdaq’s Homomorphic Encryption R&D | Product Fact Sheet: 3rd Gen Intel Xeon Scalable Platform | SKU Stack

The post 3rd Gen Intel Xeon Scalable Launch (Replay) appeared first on Intel Newsroom.

At John Deere, ‘Hard Iron Meets Artificial Intelligence’

Produits Intel - jeu, 01/04/2021 - 17:00
A Hybrid 944K Wheel Loader distributes aggregate in Georgetown, Texas. (Credit: John Deere)

What’s New: John Deere is leveraging Intel’s artificial intelligence (AI) technology to help solve a costly, age-old problem in the manufacturing welding process. Deere is piloting a solution that uses computer vision to automatically spot common defects in the automated welding process in its manufacturing facilities.

“Welding is a complicated process. This AI solution has the potential to help us produce our high-quality machines more efficiently than before. The introduction of new technology into manufacturing is opening up new opportunities and changing the way we think about some processes that haven’t changed in years.”
–Andy Benko, quality director, John Deere Construction & Forestry Division

Why It Matters: At 52 factories around the world, John Deere uses the Gas Metal Arc Welding (GMAW) process to weld mild- to high-strength steel to create machines and products. In these factories, hundreds of robotic arms consume millions of weld wire pounds annually.

With this volume of welding, Deere has experience finding solutions to welding issues — and is always looking for new ways to deal with potential problems. One common welding challenge felt across the industry is porosity, in which cavities in the weld metal are caused by trapped gas bubbles as the weld cools. The cavities weaken the weld strength.

Traditionally, GMAW defect detection has been a manual process requiring highly skilled technicians. Past attempts throughout the industry to deal with weld porosity issues during the welding process haven’t always been successful. If these flaws are found later in the manufacturing process, they require re-work or even scrapping of full assemblies, which can be disruptive and expensive to manufacturers.

How it Works: The opportunity to work with Intel to leverage AI to address weld porosity was a chance to bring together two of John Deere’s core values — innovation and quality. “We wanted to drive technology to make John Deere’s weld quality better than it’s ever been. That’s the commitment we have to our customers, and that’s what they expect from John Deere,” said Benko.

Intel and Deere combined expertise to develop an integrated, end-to-end system of hardware and software that can generate insights in real time at the edge, at levels beyond the human sense’s capability. When using a neural network-based inference engine, the solution logs defects in real time and automatically stops the welding process. The automated system allows Deere to correct the issue in real time and produce the quality products that Deere is known for.

“Deere is leveraging AI and machine vision to solve a common challenge with robotic welding,” said Christine Boles, vice president in Intel’s Internet of Things Group and general manager of Industrial Solutions Group. “By leveraging Intel technology and smart infrastructure in their factories, Deere is positioning themselves well to capitalize not only on this welding solution, but potentially others that emerge as part of their broader Industry 4.0 transformation.”

About the Solution: The AI defect detection at the edge solution is powered by Intel® Core™ i7 processors and uses Intel® Movidius™ VPUs and the Intel® Distribution of OpenVINO™ toolkit, implemented with an industrial-grade ADLINK Machine Vision Platform and a MeltTools welding camera.

More Context: ADLINK Enables Automated Arc-Welding Defect Detection with Industrial Machine Vision Edge Solution Toward Industry 4.0 (Solution Brief) | Intel Industrial IoT

Intel Partner Stories: Intel Customer Spotlight on | Partner Stories on Intel Newsroom

The post At John Deere, ‘Hard Iron Meets Artificial Intelligence’ appeared first on Intel Newsroom.

Intel 2020 Supplier Continuous Quality Improvement Awards

Produits Intel - mar, 30/03/2021 - 17:00
» Click for full image

Today, Intel announced winners of the 2020 Intel Supplier Continuous Quality Improvement (SCQI) Program Award.

“Our suppliers help us achieve our goal of being the leader in every category in which we compete,” said Intel CEO Pat Gelsinger. “Congratulations to the winners of Intel’s Supplier Continuous Quality Improvement Program Awards. Your pursuit of excellence through continuous improvement, your flawless execution in meeting commitments and your bold innovation through collaboration make you a role model for the industry.”

The Intel SCQI Program has three award levels: The SCQI Award recognizes the highest performance in the entire Intel supply chain, the Preferred Quality Supplier (PQS) Award recognizes companies whose performance consistently exceeds expectations, and the Supplier Achievement Award (SAA) recognizes companies who are steadily improving across the board and exceeding expectations in at least one critical area.

“The 2020 Intel SCQI Program Award winners are a remarkable group of companies — and their employees — who have helped Intel and the industry continue to grow and deliver safely in the hardest of times,” said Dr. Randhir Thakur, Intel chief supply chain officer. “Their commitment to quality, innovation and operational excellence makes them true partners who have earned our trust and our gratitude along with their awards.”

The Intel SCQI Program began in 1987 to establish an objective system for measuring and improving quality. Only a select group of suppliers are invited to join. These award-winning suppliers are trusted partners who represent truly world-class commitment to continuous improvement.

This year, the program added “COVID-19 response” as a category for SAA. It recognizes the extraordinary performance, innovation and resolve demonstrated by suppliers in the face of pandemic-related supply-chain challenges. Recipients of this special recognition were exemplary in their efforts to ensure uninterrupted supply and help Intel meet customer needs while keeping their employees and communities safe.

» Learn more about the Intel SCQI Program and awards.

SCQI Award winners:

  • Applied Materials, Inc. (with distinguished performance in supplier diversity): Materials engineering solutions, including equipment, integrated processes and technology-enabled services
  • Lam Research Corporation (with distinguished performance in supplier diversity): Semiconductor manufacturing equipment
  • Securitas Security Services USA, Inc.: Physical security services, security systems support and related services
  • Senju Metal Industry Co., Ltd.: Solder paste, solder ball, flux and STIM
  • Siltronic AG: Polished and epitaxial silicon wafers
  • Taiwan Semiconductor Manufacturing Company, Limited: Foundry services and a broad range of technologies
  • Tokyo Electron Limited: Coater/developer, dry etch, wet etch, thermal processing, deposition, test and 3DI systems

PQS winners:

  • Arvato Supply Chain Solutions: International value-added and forward logistics services
  • ASM International N.V. (with distinguished performance in safety): Leading-edge semiconductor materials deposition technology solutions and support
  • ASML: Advanced lithography hardware, software and services
  • AT&S Austria Technologie & Systemtechnik AG: Substrates, interposer and PCB
  • Brewer Science, Inc.: Lithographic underlayer, antireflective coating materials and temporary wafer bonding materials
  • DISCO Corporation: Cutting, grinding and polishing equipment, consumables, and services
  • Fujimi Corporation: Innovative and enabling CMP slurry technologies
  • GF Piping Systems: Comprehensive range of piping systems and specialized solutions
  • Hitachi High-Tech Corporation: Etch and metrology equipment
  • JX Nippon Mining & Metals Corporation: Sputtering targets for physical vapor deposition
  • King Yuan Electronics Corp.: Wafer sort, die preparation and IC test services
  • Kokusai Electric Corporation: Batch thermal processing systems
  • Lasertec Corporation: Patterned and unpatterned lithography mask inspection tools
  • Moses Lake Industries (TAMA Chemicals): Ultra-high-purity process and performance chemicals
  • Murata Machinery, Ltd.: Automated material handling systems — hoist vehicles and stockers
  • NAMICS Corporation: Cutting-edge epoxy solutions
  • Shin-Etsu Chemical Co., Ltd.: Silicon wafers, mask blanks, thermal insulating materials, underfill and photoresists
  • SUMCO Corporation: 200mm and 300mm epitaxial and polished silicon wafers
  • Synopsys, Inc. (with distinguished performance in innovation): Advanced technologies for silicon manufacturing, chip design, verification, IP integration and software security
  • Technoprobe SPA: Design and manufacturing of probe cards
  • The PEER Group Inc.: Innovative factory automation software for high-volume smart manufacturing
  • Tokyo Ohka Kogyo Co., LTD: Photoresists, developers, cleaning solutions and high-purity chemistries support
  • Tosoh Quartz, Inc.: Quartzware for semiconductor wafer processing equipment
  • Tosoh SMD, INC.: High-purity metal and alloy targets for physical vapor deposition
  • Valex Corp.: Stainless-steel components used in ultra-high-purity gas, vacuum and water systems
  • Veolia: Extracting value out of waste resources

SAA winners:

  • AEM Singapore Pte. Ltd.: COVID-19 response
  • AGC Inc.: Technology
  • American Express Meetings & Events, a division of American Express Global Business Travel: COVID-19 response
  • Amtech Systems Inc.: COVID-19 response
  • ASM Pacific Technology Limited: COVID-19 response
  • Avantor: COVID-19 response
  • Cadence Design Systems Inc.: COVID-19 response
  • Capgemini: Innovation
  • Courier Network Inc.: COVID-19 response
  • Daewon Semiconductor Packaging Industrial Co., Ltd.: COVID-19 response
  • DB Schenker: COVID-19 response
  • Deutsche Post DHL Group: COVID-19 response
  • DSV Panalpina A/S: COVID-19 response
  • Dynacast (Dongguan) Ltd., A Form Technologies Company: COVID-19 response
  • Flex: COVID-19 response
  • Fragomen: COVID-19 response
  • Gemtek Technology Co., Ltd.: COVID-19 response
  • GMJ Air Shuttle, LLC: COVID-19 response
  • HCL Technologies Limited: Cost and COVID-19 response
  • Infosys Limited: COVID-19 response
  • JLL: Supplier diversity
  • KellyOCG: Supplier diversity
  • Keysight Technologies, Inc.: Technology
  • KLA Corporation: Technology
  • Microsoft Corporation: COVID-19 response
  • ModusLink: COVID-19 response
  • Onto Innovation: Technology
  • R&D Altanova: COVID-19 response
  • Solvay Special Chem: COVID-19 response
  • Super Micro Computer, Inc: COVID-19 response
  • Tata Consultancy Services Limited: COVID-19 response
  • Tektronix Inc.: COVID-19 response
  • Texas Instruments Incorporated: COVID-19 response
  • Ultra Clean Technologies (UCT): COVID-19 response
  • VMLY&R: COVID-19 response
  • Wipro Limited: COVID-19 response
  • XPO Logistics, Inc.: COVID-19 response
  • YOKOWO CO., LTD.: COVID-19 response

The post Intel 2020 Supplier Continuous Quality Improvement Awards appeared first on Intel Newsroom.

Kisaco Research: SigOpt is a Leader in AI Software

Produits Intel - ven, 26/03/2021 - 17:00
A SigOpt engineer works on next-generation software for deep learning. (Credit: SigOpt)

What’s New: A new report from analyst firm Kisaco Research positions SigOpt, an Intel company, as a leader in artificial intelligence (AI) software acceleration, due to the quality of its optimization platform, breadth of its market penetration and strength of its go-to-market strategy. By making customers’ AI workloads more efficient, SigOpt helps them get the most out of their hardware investment.

“SigOpt, an Intel company, achieved an impressive score across all dimensions of our KLC evaluation to be ranked as Leader. Customers using SigOpt benefit from productivity gains, faster time to train, and efficient utilization of compute. In combination, this empowers modelers to bring more models into production on a faster timeline, boosting the overall return of AI for enterprises.”
– Michael Azoff, Kisaco Research

What the Study Says: SigOpt is prominent in the machine learning community for its automated, scalable and high-performing hyperparameter optimization solution that can be applied to any parameterized system but is most often used in the context of deep learning tasks. Kisaco Research says the platform can take “operational tasks that are time intensive for machine learning and [make] them easy and seamless, using AI to assist in this task.” For customers, this means a boost in productivity and the ability to tune algorithms faster and utilize compute more efficiently.

The report details how two of SigOpt’s Fortune 500 customers, Two Sigma and an unnamed large global technology consulting firm, use the advanced features that are only available in its platform to solve entirely new business problems. In the case of the consulting firm, SigOpt helped the firm yield productivity gains of over 30% and projected value of nearly $50 million annually.

Primary SigOpt functionalities are designed to help manage, optimize, and scale AI applications. (Graphic shows how SigOpt fits into the machine learning technology stack.)

Why It’s Important: The complexity, size and variety of AI models is exploding, making it resource-intensive to efficiently fine-tune models to meet the particular needs of a given project. SigOpt’s platform eases this burden by introducing a more efficient approach to model development: integrating best-in-class automation and productivity tools for model development, including model artifact tracking, training visualization, and sample-efficient hyperparameter optimization. For developers, data scientists, researchers and machine learning engineers, this means a highly intuitive and efficient modeling experience that ultimately leads to much better AI results.

SigOpt’s fully hardware and software-agnostic platform also provides the same user experience throughout – including deep learning, machine learning, reinforcement learning, or simulations. When combined with Intel AI hardware and the consistent developer experience afforded by Intel® oneAPI Toolkits, SigOpt will continue to offer developers the most efficient way to develop and deploy AI models. Individuals and enterprises can access the SigOpt platform by signing up on the SigOpt website.

More Context: Kisaco Leadership Chart on AI software optimization solutions 2021: SigOpt, an Intel company (report) | Intel AI | Intel to Acquire SigOpt to Scale AI Productivity and Performance (News Byte) | Intel AI Software Tools

The post Kisaco Research: SigOpt is a Leader in AI Software appeared first on Intel Newsroom.

Intel Announces oneAPI Challenge Winners

Produits Intel - jeu, 25/03/2021 - 15:00

What’s New: Intel today announced the winners of the Great Cross-Architecture Challenge, a collaboration with the European Organization for Nuclear Research (CERN) and Argonne National Laboratory, and run by CodeProject. The challenge attracted participants across five continents, demonstrating the growing momentum of oneAPI’s open, cross-architecture, multi-vendor programming approach. Entrants used oneAPI and Data Parallel C++ (DPC++) to create applications in areas such as bioinformatics, cryptography, data analytics, education, financial services, genomics, healthcare, image processing, mathematics, molecular dynamics, particle physics and ray tracing.

“This challenge showcases the ease of use and freedom of choice that oneAPI’s open, cross-architecture programming model delivers. The participants were able to either quickly port, or develop from scratch, applications with real-world impact across a range of disciplines. We are highly impressed with the innovative and creative submissions received from around the world, and the positive feedback and growing adoption of oneAPI.”
–Jeff McVeigh, Intel vice president, Datacenter XPU Products and Solutions

About the Challenge: The Great Cross-Architecture Challenge invited software developers of all levels to use oneAPI to create fast, efficient and future-ready applications that take advantage of various XPUs, including CPUs, GPUs, FPGAs and other accelerators. Participants used free Intel® oneAPI Toolkits and the Intel® DevCloud, which provides the ability to test code and workloads across a variety of Intel XPU architectures to update an existing C/C++ application, to port a compute unified device architecture (CUDA) application to DPC++ or create an entirely new oneAPI application to work on multiple architectures.

“The participants in the Great Cross-Architecture Challenge demonstrated the potential of oneAPI,” said Maria Girone, chief technology officer, CERN openlab. “Through its use, they were able to write code for heterogeneous hardware architectures with a diverse range of applications. People from across the world were able to access cutting-edge technology through this developer challenge. We look forward to welcoming the winners of the competition to CERN.”

“The challenge was an exciting opportunity to explore oneAPI and its power to develop applications across heterogenous computing architectures,” said Katherine Riley, director of Science at Argonne Leadership Computing Facility. “The entries covered a breadth of topics and used multiple approaches that illustrated oneAPI’s vast potential — and the creativity of the participants! We look forward to bringing that creativity to Argonne as we prepare for our upcoming exascale system, Aurora.”

About the Winners: 

Winner of a summer CERN openlab internship:

  • Eugenio Marinelli of Sophia Antipolis, France, leveraged oneAPI’s cross-architecture libraries and tools to efficiently develop a new application that can be used to quickly and accurately decode digital data stored in synthetic DNA. This new storage method provides easy, quick and inexpensive data archival storage that can last centuries, even in harsh environments.

Winner of a chance to work on a oneAPI-related project with Argonne National Laboratory:

  • Andrew Pastrello of Sydney, Australia, showed the ease of porting CUDA code and modified the application using DPC++ and oneAPI tools to synthesize audio from gravitational waveforms produced by black hole simulations to be used in music production and astronomy education.

Winners of a trip to CERN :

  • Rafael Campos of Lisbon, Portugal, demonstrated oneAPI’s fast and efficient development by adapting OpenCL applications to improve the performance, power and efficiency of bioinformatic applications. The solution has the potential to improve epistasis detection, enabling early detection of life-threatening diseases such as Alzheimer’s and various cancers.
  • Zhen Ju of Shenzhen, China, showed the ease of migrating a CUDA-based application and the benefits of an open programming model that serves various architectures. The application port efficiently and accurately filters out redundant sequences in gene research, benefiting pharmaceutical discoveries, agriculture and medical care.
  • Ricardo Nobre of Lisbon, Portugal, used the Intel® DPC++ Compatibility Tool to port a CUDA-based application, with more than 95% of the code automatically migrated. The application utilizes CPU and GPU devices to detect new associations between genotypes and phenotypes, potentially resulting in improved preventative care, personalized treatments and drug development.

Participants had access to free resources, such as code samples, developer guides, webinars and the DevMesh developer collaboration portal to help speed their development.

About the Prizes: Five grand prize winners were selected by an outside panel of six esteemed judges who evaluated the contest entries based on innovation, impact on humanity, use of cross-architecture computing, overall usefulness for target audience, level of coding expertise and quality of project explanation. Winners were awarded one of the following grand prizes:

  • A summer CERN openlab internship (in person or virtual), or $8,000 in cash.
  • Participation in a oneAPI-related project at Argonne National Laboratory (in person or virtual), or $8,000 in cash.
  • One of three trips1 to CERN for a special tour, or $5,000 cash.

Twenty applicants will receive $500 cash prizes for their quality submissions. For more information, please visit the Great Cross-Architecture Challenge contest site.

About oneAPI Ecosystem Support: More than 65 leading research organizations, companies and universities support oneAPI. See oneAPI ecosystem support/reviews. The oneAPI applications catalog details more than 250 oneAPI-powered applications.

About oneAPI Developer Resources: To start building high-performance, cross-architecture applications, download free Intel oneAPI Toolkits locally or use the Intel DevCloud.

More Context: Documentation | oneAPI Programming Guide | Code Samples  | Free Training

The Small Print:

1Contingent upon COVID-19 travel restrictions.

Notices & Disclaimers

Intel technologies may require enabled hardware, software or service activation.

No product or component can be absolutely secure.

Your costs and results may vary.

The post Intel Announces oneAPI Challenge Winners appeared first on Intel Newsroom.

Intel AI-Powered Backpack Helps Visually Impaired Navigate World

Produits Intel - mer, 24/03/2021 - 17:00

What’s New: Artificial intelligence (AI) developer Jagadish K. Mahendran and his team designed an AI-powered, voice-activated backpack that can help the visually impaired navigate and perceive the world around them. The backpack helps detect common challenges such as traffic signs, hanging obstacles, crosswalks, moving objects and changing elevations, all while running on a low-power, interactive device.

“Last year when I met up with a visually impaired friend, I was struck by the irony that while I have been teaching robots to see, there are many people who cannot see and need help. This motivated me to build the visual assistance system with OpenCV’s Artificial Intelligence Kit with Depth (OAK-D), powered by Intel.”
–Jagadish K. Mahendran, Institute for Artificial Intelligence, University of Georgia

Why It Matters: The World Health Organization estimates that globally 285 million people are visually impaired. Meanwhile, visual assistance systems for navigation are fairly limited and range from Global Positioning System-based, voice-assisted smartphone apps to camera-enabled smart walking stick solutions. These systems lack the depth perception necessary to facilitate independent navigation.

Jagadish K. Mahendran models his AI-powered, voice-activated backpack that can help the visually impaired navigate and perceive the world around them.

“It’s incredible to see a developer take Intel’s AI technology for the edge and quickly build a solution to make their friend’s life easier,” said Hema Chamraj, director, Technology Advocacy and AI4Good at Intel. “The technology exists; we are only limited by the imagination of the developer community.”

How It Works: The system is housed inside a small backpack containing a host computing unit, such as a laptop. A vest jacket conceals a camera, and a fanny pack is used to hold a pocket-size battery pack capable of providing approximately eight hours of use. A Luxonis OAK-D spatial AI camera can be affixed to either the vest or fanny pack, then connected to the computing unit in the backpack. Three tiny holes in the vest provide viewports for the OAK-D, which is attached to the inside of the vest.

“Our mission at Luxonis is to enable engineers to build things that matter while helping them to quickly harness the power of Intel AI technology,” said Brandon Gilles, founder and chief executive officer, Luxonis. “So, it is incredibly satisfying to see something as valuable and remarkable as the AI-powered backpack built using OAK-D in such a short period of time.”

The OAK-D unit is a versatile and powerful AI device that runs on Intel Movidius VPU and the Intel® Distribution of OpenVINO™ toolkit for on-chip edge AI inferencing. It is capable of running advanced neural networks while providing accelerated computer vision functions and a real-time depth map from its stereo pair, as well as color information from a single 4k camera.

A Bluetooth-enabled earphone lets the user interact with the system via voice queries and commands, and the system responds with verbal information. As the user moves through their environment, the system audibly conveys information about common obstacles including signs, tree branches and pedestrians. It also warns of upcoming crosswalks, curbs, staircases and entryways.

More Context: A Vision System for the Visually Impaired (Case Study) | Intel OpenVINO Toolkit | Artificial Intelligence at Intel

The Small Print:
Intel is committed to respecting human rights and avoiding complicity in human rights abuses. See Intel’s Global Human Rights Principles. Intel’s products and software are intended only to be used in applications that do not cause or contribute to a violation of an internationally recognized human right.

The post Intel AI-Powered Backpack Helps Visually Impaired Navigate World appeared first on Intel Newsroom.

Intel Unleashed: Engineering the Future (Replay)

Produits Intel - mer, 24/03/2021 - 02:15

On March 23, 2021, Pat Gelsinger, Intel’s chief executive officer, offered a business update and webcast address on the new era of innovation and technology leadership at Intel.

Press Kit: Engineering the Future

This presentation includes forward-looking statements, including with respect to Intel’s business outlook and future plans and expectations. These statements are based on management’s current expectations and are subject to risks and uncertainties. Important factors that could cause actual results to differ materially include those set forth in the press releases issued by Intel on March 23, 2021 and Intel’s SEC filings, including its most recent Form 10-K, available at

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Intel CEO Pat Gelsinger Announces ‘IDM 2.0’ Strategy for Manufacturing, Innovation and Product Leadership

Produits Intel - mar, 23/03/2021 - 23:00

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  • Announcing manufacturing expansion plans; beginning with ~$20 billion investment to build two new fabs in Arizona  
  • Intel 7 nanometer process development progressing well with tape in of 7nm compute tile for “Meteor Lake” expected in the second quarter of 2021 
  • Announcing Intel Foundry Services with plans to become a major provider of foundry capacity in the U.S. and Europe to serve customers globally 
  • Announcing plans for new research collaboration with IBM 
  • Bringing the spirit of Intel Developer Forum event back this year with Intel Innovation event planned for October in San Francisco 

SANTA CLARA, Calif., March 23, 2021 – Today, Intel CEO Pat Gelsinger outlined the company’s path forward to manufacture, design and deliver leadership products and create long-term value for stakeholders. During the company’s global “Intel Unleashed: Engineering the Future” webcast, Gelsinger shared his vision for “IDM 2.0,” a major evolution of Intel’s integrated device manufacturing (IDM) model. Gelsinger announced significant manufacturing expansion plans, starting with an estimated $20 billion investment to build two new factories (or “fabs”) in Arizona. He also announced Intel’s plans to become a major provider of foundry capacity in the U.S. and Europe to serve customers globally.  

More News and Resources: Engineering the Future (Press Kit) 

“We are setting a course for a new era of innovation and product leadership at Intel,” said Gelsinger. “Intel is the only company with the depth and breadth of software, silicon and platforms, packaging, and process with at-scale manufacturing customers can depend on for their next-generation innovations. IDM 2.0 is an elegant strategy that only Intel can deliver – and it’s a winning formula. We will use it to design the best products and manufacture them in the best way possible for every category we compete in.” 

IDM 2.0 represents the combination of three components that will enable the company to drive sustained technology and product leadership:

  1. Intel’s global, internal factory network for at-scale manufacturing is a key competitive advantage that enables product optimization, improved economics and supply resilience. Today, Gelsinger re-affirmed the company’s expectation to continue manufacturing the majority of its products internally. The company’s 7nm development is progressing well, driven by increased use of extreme ultraviolet lithography (EUV) in a rearchitected, simplified process flow. Intel expects to tape in the compute tile for its first 7nm client CPU (code-named “Meteor Lake”) in the second quarter of this year. In addition to process innovation, Intel’s leadership in packaging technology is an important differentiator that enables the combination of multiple IPs or “tiles” to deliver uniquely tailored products that meet diverse customer requirements in a world of pervasive computing.
  2. Expanded use of third-party foundry capacity. Intel expects to build on its existing relationships with third-party foundries, which today manufacture a range of Intel technology – from communications and connectivity to graphics and chipsets. Gelsinger said he expects Intel’s engagement with third-party foundries to grow and to include manufacturing for a range of modular tiles on advanced process technologies, including products at the core of Intel’s computing offerings for both client and data center segments beginning in 2023. This will provide the increased flexibility and scale needed to optimize Intel’s roadmaps for cost, performance, schedule and supply, giving the company a unique competitive advantage.
  3. Building a world-class foundry business, Intel Foundry Services. Intel announced plans to become a major provider of U.S.– and Europe-based foundry capacity to serve the incredible global demand for semiconductor manufacturing. To deliver this vision, Intel is establishing a new standalone business unit, Intel Foundry Services (IFS), led by semiconductor industry veteran Dr. Randhir Thakur, who will report directly to Gelsinger. IFS will be differentiated from other foundry offerings with a combination of leading-edge process technology and packaging, committed capacity in the U.S. and Europe, and a world-class IP portfolio for customers, including x86 cores as well as ARM and RISC-V ecosystem IPs. Gelsinger noted that Intel’s foundry plans have already received strong enthusiasm and statements of support from across the industry.

To accelerate Intel’s IDM 2.0 strategy, Gelsinger announced a significant expansion of Intel’s manufacturing capacity, beginning with plans for two new fabs in Arizona, located at the company’s Ocotillo campus. These fabs will support the increasing requirements of Intel’s current products and customers, as well as provide committed capacity for foundry customers.  

This build-out represents an investment of approximately $20 billion, which is expected to create over 3,000 permanent high-tech, high-wage jobs; over 3,000 construction jobs; and approximately 15,000 local long-term jobs. Today, Arizona Gov. Doug Ducey and U.S. Secretary of Commerce Gina Raimondo participated with Intel executives in the announcement. Gelsinger commented: “We are excited to be partnering with the state of Arizona and the Biden administration on incentives that spur this type of domestic investment.” Intel expects to accelerate capital investments beyond Arizona, and Gelsinger said he plans to announce the next phase of capacity expansions in the U.S., Europe and other global locations within the year. 

Intel plans to engage the technology ecosystem and industry partners to deliver on its IDM 2.0 vision. To that end, Intel and IBM today announced plans for an important research collaboration focused on creating next–generation logic and packaging technologies. For more than 50 years, the two companies have shared a deep commitment to scientific research, world-class engineering and a focus on bringing advanced semiconductor technologies to market. These foundational technologies will help unleash the potential of data and advanced computation to create immense economic value.

Leveraging each company’s capabilities and talent in Hillsboro, Oregon, and Albany, New York, this collaboration aims to accelerate semiconductor manufacturing innovation across the ecosystem, enhance the competitiveness of the U.S. semiconductor industry and support key U.S. government initiatives. 

Finally, Intel is bringing back the spirit of its popular Intel Developer Forum event this year with the launch of Intel On, a new industry event series. Gelsinger encouraged technology lovers to join him at this year’s Intel Innovation event planned for October in San Francisco. 

For more information and to watch a replay of today’s webcast, visit the Intel Newsroom or Intel’s investor relations website

Forward-Looking Statements 

Statements in this press release that refer to future plans and expectations, including with respect to Intel’s strategy, internal and external manufacturing plans, manufacturing expansion and investment plans including Intel’s anticipated Arizona expansion, plans and goals related to Intel’s foundry business, future products and technology, and Intel’s planned research collaboration with IBM, are forward-looking statements that involve a number of risks and uncertainties. Words such as “anticipates,” “expects,” “intends,” “goals,” “plans,” “believes,” “seeks,” “estimates,” “continues,” “may,” “will,” “would,” “should,” “could,” “strategy,” “progress,” “path,” “vision,” “course,” “formula,” “accelerate,” and “committed” and variations of such words and similar expressions are intended to identify such forward-looking statements. Statements that refer to or are based on estimates, forecasts, projections, and uncertain events or assumptions, including statements relating to the benefits of Intel’s strategy; the availability and benefits of future products and technology, including with respect to Intel’s 7nm and future manufacturing processes, packaging technology, and 2023 products; manufacturing and design goals and progress; future internal manufacturing volumes; external foundry usage and related benefits; future manufacturing capacity including with respect to Intel’s foundry business; investment returns and benefits; government incentives; the nature, timing, and benefits of Intel’s manufacturing expansion, including its Arizona expansion; benefits related to Intel’s foundry business; foundry service offerings, including IP offerings; benefits related to Intel’s planned research collaboration with IBM; supply expectations; market opportunity; anticipated trends in Intel’s businesses or the markets relevant to them; and future announcements also identify forward-looking statements.  

Such statements are based on management’s current expectations and involve many risks and uncertainties that could cause actual results to differ materially from those expressed or implied in these forward-looking statements. Important factors that could cause actual results to differ materially from the company’s expectations include, among others, Intel’s failure to realize the anticipated benefits of its strategy and plans; risks related to increased use of external foundries, including risks of increased costs, insufficient foundry capacity, and schedule delays; increases in capital requirements and changes in capital investment plans; construction delays or changes in plans due to business, economic, or other factors; risks related to Intel’s foundry business plans, including risks of failure of Intel’s foundry service offerings to achieve or maintain market acceptance or demand, inability to manage and allocate manufacturing capacity successfully, delays in the development of new and competitive manufacturing technologies, failure to compete successfully across factors such as technology, capacity, price, ease of use, quality, and customer satisfaction, deterioration in demand for global foundry services, actions taken by competitors, lack of ecosystem support, and the risk that Intel may not realize an adequate return on its foundry business investments; adverse impacts of strategy announcements on Intel’s business and business relationships; risks that Intel’s planned research collaboration with IBM may not be consummated or the anticipated benefits realized; as well as the factors set forth in Intel’s earnings release dated January 21, 2021, which is included as an exhibit to Intel’s Form 8-K furnished to the SEC on such date, and Intel’s SEC filings, including the company’s most recent report on Form 10-K. Copies of Intel’s SEC filings may be obtained by visiting Intel’s Investor Relations website at or the SEC’s website at Intel does not undertake, and expressly disclaims any duty, to update any statement made in this press release, whether as a result of new information, new developments or otherwise, except to the extent that disclosure may be required by law. 

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Media Alert: Intel to Launch 3rd Gen Intel Xeon Scalable Portfolio

Produits Intel - lun, 22/03/2021 - 14:00

SANTA CLARA, Calif., March 22, 2021 – Join Intel’s Navin Shenoy, executive vice president in the Data Platforms Group, and Lisa Spelman, corporate vice president in the Xeon and Memory Group, on April 6 for the launch of the latest 3rd Gen Intel® Xeon® Scalable processors (code-named “Ice Lake”) and the latest additions to Intel’s hardware and software portfolio targeting data centers, 5G networks and intelligent edge infrastructure.

The virtual “How Wonderful Gets Done 2021” launch event will feature Intel executives and ecosystem partners addressing some of today’s greatest business opportunities. The event will also include brief remarks by Intel Chief Executive Officer Pat Gelsinger.

What: “How Wonderful Gets Done 2021” Launch Event

When: 8 a.m. PDT, Tuesday, April 6, 2021

View: Watch live on the Intel website or the Intel Newsroom, where a replay will also be available.

More: Visit the Intel events website for more information or follow along on Twitter at @IntelNews and @Intel.

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Intel, DARPA Develop Secure Structured ASIC Chips Made in the US

Produits Intel - jeu, 18/03/2021 - 12:00

Intel’s newest, leading-edge manufacturing facility is Fab 42 in Ocotillo, Arizona. Fab 42 connects to three other Intel fabrication plants, making the site Intel’s first mega-factory network. It manufactures Intel’s newest generation of leadership products that will power hundreds of millions of computing devices worldwide. (Credit: Intel Corporation)What’s New: Intel and the U.S. Defense Advanced Research Projects Agency (DARPA) today announced a three-year partnership to advance the development of domestically manufactured structured Application Specific Integrated Circuit (ASIC) platforms. The Structured Array Hardware for Automatically Realized Applications (SAHARA) partnership enables the design of custom chips that include state-of-the-art security countermeasure technologies. A reliable, secure, domestic source of leading-edge semiconductors remains critical to the U.S.

“We are combining our most advanced Intel® eASIC structured ASIC technology with state-of-the-art data interface chiplets and enhanced security protection, and it’s all being made within the U.S. from beginning to end. This will enable defense and commercial electronics systems developers to rapidly develop and deploy custom chips based on Intel’s advanced 10nm semiconductor process.”
–José Roberto Alvarez, senior director, CTO Office, Intel Programmable Solutions Group

Why It Matters: As the sole U.S.-based advanced semiconductor manufacturer, Intel promotes supply-chain security by utilizing facilities within the U.S. to manufacture, assemble and test custom chips for the SAHARA partnership.

“Structured ASICs have advantages over FPGAs that are widely used in many Department of Defense applications. In partnering with Intel on the SAHARA program, DARPA aims to transform currently fielded as well as future capabilities into structured ASIC implementations with significantly higher performance and lower power consumption,” said Serge Leef, a program manager in DARPA’s Microsystems Technology Office. “SAHARA aims to dramatically shorten the ASIC design process through automation while adding unique security features to support manufacturing of the resulting silicon in zero-trust environments. Additionally, Intel will establish domestic manufacturing capabilities for the structured ASICs on their 10nm process.”

How It Works: In collaboration with the University of Florida, Texas A&M and University of Maryland, Intel will develop security countermeasure technologies that enhance protection of data and intellectual property from reverse engineering and counterfeiting. University teams will use rigorous verification, validation and new attack strategies to test the security of these chips. The security countermeasure technologies will be integrated into Intel’s structured ASIC design flow.

Intel will use its structured ASIC technology to develop platforms that significantly accelerate development time and reduce engineering cost compared to traditional ASICs. Intel will manufacture these chips using its 10nm process technology with the advanced interface bus die-to-die interconnect and embedded multi-die interconnect bridge packaging technology to integrate multiple heterogenous die in a single package.

About Intel eASICs: Intel® eASIC™ devices are structured ASICs, an intermediary technology between field-programmable gate arrays (FPGAs) and standard-cell ASICs. These devices provide lower unit-cost and run on lower power compared with FPGAs and provide a faster time to market and lower non-recurring engineering cost compared with standard-cell ASICs.

More ContextIntel to Collaborate with Microsoft on DARPA Program | Intel and Sandia National Labs Collaborate on Neuromorphic Computing | Intel Wins US Government Advanced Packaging Project | Building a Future for Semiconductor Manufacturing in America

The Small Print: Intel technologies may require enabled hardware, software or service activation. No product or component can be absolutely secure.

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Media Alert – Intel Unleashed: Engineering the Future

Produits Intel - mer, 17/03/2021 - 18:00

Join Intel CEO Pat Gelsinger for a business update and webcast address on the new era of innovation and technology leadership at Intel.

When: 2-3 p.m. PDT, Tuesday, March 23

Where: Watch live on the Intel Newsroom at

More: Event coverage on

To receive updates on the news, visit the Intel Newsroom and follow along on Twitter with @IntelNews. A replay will be available on the Intel Newsroom following the webcast.

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