Intel Reports Fourth-Quarter and Full-Year 2020 Financial Results

Produits Intel - jeu, 21/01/2021 - 21:50

Intel Corporation’s fourth-quarter and full-year 2020 earnings news release and presentation are available on the company’s Investor Relations website. The earnings conference call for investors begins at 2 p.m. PST today; a public webcast will be available at www.intc.com.

» Intel Executive Prepared Remarks

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Note from Pat Gelsinger to Intel

Produits Intel - mer, 13/01/2021 - 16:00

Pat Gelsinger, who today was named chief executive officer of Intel Corporation, effective Feb. 15, 2021, sent the following note to all Intel employees:

I am thrilled and humbled to be returning to Intel as CEO. I was 18 years old when I joined Intel, fresh out of the Lincoln Technical Institute. Over the next 30 years of my tenure at Intel, I had the honor to be mentored at the feet of Grove, Noyce and Moore. Intel then helped me continue my education at Santa Clara University and Stanford University. The company also gave me the opportunity to work on the forefront of silicon innovation with the best and brightest talent in the industry.

My experience at Intel has shaped my entire career, and I am forever grateful to this company. To come back “home” to Intel in the role of CEO during what is such a critical time for innovation, as we see the digitization of everything accelerating, will be the greatest honor of my career.

I have tremendous regard for the company’s rich history and the powerful technologies created here that have transformed, and continue to transform, the world’s digital infrastructure. We have incredible talent and remarkable technical expertise that is the envy of the industry.

I look forward to working with all of you to continue to shape the future of technology. While Intel’s history is rich, the transformation from a CPU to multi-architecture XPU company is exciting and our opportunity as a world-leading semiconductor manufacturer is greater than it’s ever been. I will be sharing more in the near-term about my vision and strategy for Intel, but I know we can continue to accelerate innovation, strengthen our core business and create value for our shareholders, customers and employees.

I want to extend my gratitude to Bob for his leadership and significant contributions to Intel through this critical period of transformation. I welcome his counsel and ongoing guidance through the transition period to make it as seamless as possible for our customers and all of you.

I’m sure you will have many questions about what is to come, and I look forward to hearing them, even if I won’t have all the answers on day one. I can’t wait to resume this journey with all of you.

– Pat

The post Note from Pat Gelsinger to Intel appeared first on Intel Newsroom.

Intel Appoints Tech Industry Leader Pat Gelsinger as New CEO

Produits Intel - mer, 13/01/2021 - 15:26

News Highlights:

  • Bob Swan will remain in CEO role until February 15
  • Intel expects to exceed its previously communicated guidance for fourth-quarter 2020 revenue and earnings per share (EPS). Full fourth-quarter results will be released Jan. 21, 2021, as scheduled.
  • The company has made strong progress on its 7nm process technology and will provide an update on its Jan. 21 earnings call.

SANTA CLARA, Calif., Jan. 13, 2021 – Intel today announced that its board of directors has appointed 40-year technology industry leader Pat Gelsinger as its new chief executive officer, effective Feb. 15, 2021. Gelsinger will also join the Intel board of directors upon assuming the role. He will succeed Bob Swan, who will remain CEO until Feb. 15.

Intel Corporation’s board of directors has named Pat Gelsinger as its CEO. He will take on the role on Feb. 15, 2021.
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Today’s announcement is unrelated to Intel’s 2020 financial performance. Intel expects its fourth-quarter 2020 revenue and EPS to exceed its prior guidance provided on Oct. 22, 2020. In addition, the company has made strong progress on its 7nm process technology and plans on providing an update when it reports its full fourth-quarter and full-year 2020 results as previously scheduled on Jan. 21, 2021.

More: Note from Pat Gelsinger to Intel

Gelsinger is a highly respected CEO and industry veteran with more than four decades of technology and leadership experience, including 30 years at Intel where he began his career.

“Pat is a proven technology leader with a distinguished track record of innovation, talent development, and a deep knowledge of Intel. He will continue a values-based cultural leadership approach with a hyper focus on operational execution,” said Omar Ishrak, independent chairman of the Intel board. “After careful consideration, the board concluded that now is the right time to make this leadership change to draw on Pat’s technology and engineering expertise during this critical period of transformation at Intel. The board is confident that Pat, together with the rest of the leadership team, will ensure strong execution of Intel’s strategy to build on its product leadership and take advantage of the significant opportunities ahead as it continues to transform from a CPU to a multi-architecture XPU company.”

“I am thrilled to rejoin and lead Intel forward at this important time for the company, our industry and our nation,” said Gelsinger. “Having begun my career at Intel and learned at the feet of Grove, Noyce and Moore, it’s my privilege and honor to return in this leadership capacity. I have tremendous regard for the company’s rich history and powerful technologies that have created the world’s digital infrastructure. I believe Intel has significant potential to continue to reshape the future of technology and look forward to working with the incredibly talented global Intel team to accelerate innovation and create value for our customers and shareholders.”

“The board and I deeply appreciate Bob Swan for his leadership and significant contributions through this period of transformation for Intel,” continued Ishrak. “Under his leadership, Intel has made significant progress on its strategy to transform into a multi-architecture XPU company to capitalize on market shifts and extend Intel’s reach into fast-growing markets. Bob has also been instrumental in reenergizing the company’s culture to drive better execution of our product and innovation roadmap. He leaves Intel in a strong strategic and financial position, and we thank him for his ongoing guidance as he works with Pat to ensure the leadership transition is seamless.”

“My goal over the past two years has been to position Intel for a new era of distributed intelligence, improving execution to strengthen our core CPU franchise and extending our reach to accelerate growth,” said Swan. “With significant progress made across those priorities, we’re now at the right juncture to make this transition to the next leader of Intel. I am fully supportive of the board’s selection of Pat and have great confidence that, under his leadership and the rest of the management team, Intel will continue to lead the market as one of the world’s most influential technology companies.”

Most recently, Gelsinger served as the CEO of VMware since 2012, where he significantly transformed the company into a recognized global leader in cloud infrastructure, enterprise mobility and cyber security, almost tripling the company’s annual revenues. Prior to joining VMware, Gelsinger was president and chief operating officer of EMC Information Infrastructure Products at EMC, overseeing engineering and operations for information storage, data computing, backup and recovery, RSA security and enterprise solutions. Before joining EMC, he spent 30 years at Intel, becoming the company’s first chief technology officer and driving the creation of key industry technologies such as USB and Wi-Fi. He was the architect of the original 80486 processor, led 14 different microprocessor programs and played key roles in the Core and Xeon families.

Forward-Looking Statements

Statements in this press release that refer to future plans and expectations are forward-looking statements that involve a number of risks and uncertainties. Words such as “anticipates,” “expects,” “intends,” “goals,” “plans,” “believes,” “seeks,” “estimates,” “continues,” “may,” “will,” “would,” “should,” “could,” and variations of such words and similar expressions are intended to identify such forward-looking statements. Statements that refer to or are based on estimates, forecasts, projections, uncertain events or assumptions, including statements relating to market opportunity and anticipated trends in our businesses or the markets relevant to them, also identify forward-looking statements. All forward-looking statements included in this release are based on management’s expectations as of the date of this release and involve many risks and uncertainties that could cause actual results to differ materially from those expressed or implied in such statements. Important factors that could cause actual results to differ materially are set forth in Intel’s earnings release dated October 22, 2020, which is included as an exhibit to Intel’s Form 8-K furnished to the SEC on such date, and Intel’s SEC filings, including the company’s most recent reports on Forms 10-K and 10-Q. Copies of Intel’s Form 10-K, 10-Q and 8-K reports may be obtained by visiting our Investor Relations website at www.intc.com or the SEC’s website at www.sec.gov. Intel does not undertake, and expressly disclaims any duty, to update any statement made in this report, whether as a result of new information, new developments or otherwise, except to the extent that disclosure may be required by law.

The post Intel Appoints Tech Industry Leader Pat Gelsinger as New CEO appeared first on Intel Newsroom.

CES 2021: Thomas Friedman and Prof. Amnon Shashua (Replay)

Produits Intel - mer, 13/01/2021 - 13:45

Pulitzer Prize winner Thomas Friedman and Mobileye’s Dan David laureate Prof. Amnon Shashua will explore the global impact of artificial intelligence. During the intimate 30-minute fireside chat, the two will explore the technological mega shifts shaping the world, from the ethics and values governing today’s technology to the challenges facing a rapid pace of change and automation. They will also collectively share their vision for maximizing opportunities in the era of disruption.

Tune in to the livestream on this page: Wednesday, Jan. 13, at 6:45 a.m. PST

More: Mobileye News | Autonomous Driving News | Intel at CES 2021

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CES 2021: Under the Hood with Prof. Amnon Shashua (Replay & Live Blog)

Produits Intel - mar, 12/01/2021 - 17:00


» Download video: “2021 CES: Under the Hood with Prof. Amnon Shashua”

On the heels of Monday’s Intel news conference, Prof. Amnon Shashua takes a deeper and more technical dive into the company’s latest progress on automated driving technologies.

He gets under the hood of Mobileye Roadbook™ and how Mobileye is building a scalable, autonomous vehicle map that differs greatly from traditional high-definition maps, from how the data is harvested to the state-of-the-art algorithms that automate the map creation. He also discusses the company’s lidar ambitions, its RSS progress and the recent announcement of SuperVision™, Mobileye’s most advanced hands-free driving system.

More: Mobileye News | Autonomous Driving News | Intel at CES 2021

Live Blog: Follow along below for real-time updates of this virtual event.

10:00 a.m.: Hello and welcome! This is Jeremy Schultz, communications manager at Intel, and thank you for tuning in for Prof. Amnon Shashua’s one-hour master class in Mobileye’s unique and fascinating approach to bringing autonomous vehicles (AVs) to the world.

In person or virtual, Amnon’s CES presentation has been one of my favorite hours at the big show the last few years running. Let’s ride into 2021!

Coming to us from Mobileye HQ in Jerusalem, it’s Mobileye CEO and Intel Senior VP Amnon Shashua taking the podium.

Amnon shared some big news during yesterday’s news conference — catch up with the news release — and today Amnon promises “a topic or two to deep dive.”

But first a quick business update.

10:01 a.m.: Mobileye’s business is based on three intermingling pillars:

  1. Driving assist, “which goes from a simple front-facing camera up to a 360, multi-camera setting with very advanced functions”
  2. The data we collect from crowdsourcing” — now millions of miles per day ­— powering not only “our maps but also creating a new data business”
  3. The full-stack self-driving system: computing, algorithms, perception, driving policy, safety, hardware on up to mobility as a service.

10:02 a.m.: ‘Twas a stop-and-go 2020: “we finished 2020 with 10% year on year growth in shipping EyeQ chips,” Amnon says, “very impressive in my mind, given that three months we had a shutdown of auto production facilities.”

Mobileye earned 37 new design wins — to account for an additional 36 million lifetime units — joining 49 running production programs.

CES 2021: Intel Announces Four New Processor Families

Produits Intel - lun, 11/01/2021 - 22:30


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NEWS HIGHLIGHTS

  • At its CES news conference, Intel highlighted how it is driving technology leadership with the introduction of more than 50 processors, resulting in more than 500 new designs for laptops and desktops coming to market in 2021.
  • Intel launched the 11th Gen Intel® Core™ vPro® platform and Intel® Evo™ vPro® platform, delivering the highest performance and most comprehensive hardware-based security1.
  • Intel introduced the new N-series 10-nanometer Intel® Pentium® Silver and Intel® Celeron® processors that offer an unmatched balance of performance, media and collaboration for education systems.
  • Intel announced a new line of 11th Gen Intel® Core™ H-series mobile processors for gaming platforms that deliver an industry-leading balance of mobility and enthusiast-level gaming.
  • Intel also previewed products coming to market later in 2021, including 11th Gen Intel® Core™ S-series desktop processors (code-named “Rocket Lake-S”) and its next-generation processors (code-named “Alder Lake”).

SANTA CLARA, Calif., Jan. 11, 2021 – In a world where computing is pervasive and intelligence is distributed across every surface – from the cloud to the network to the intelligent edge – Intel today at CES 2021 highlighted how it is driving technology leadership to define the future of computing for people, business and society.

To help people navigate through this extraordinary time, Intel introduced new processors for business, education, mobile and gaming computing platforms – all designed to offer the premium PC experiences people deserve, with the most choices and no limits.

More: Intel at CES 2021 (Press Kit) | Mobileye Innovation Will Bring AVs to Everyone, Everywhere (News Release) |  2021 CES Keynote News Conference (Press/Analyst Deck) | 11th Gen Intel vPro Platform (Product Brief) | 11th Gen Intel Core H Series Processors (Product Brief) | 11th Gen Intel Core H Series Processors for Ultraportable Gaming (Press Deck)

“Only Intel has the breadth of products spanning multiple architectures; the large, open ecosystem; sheer scale of manufacturing footprint; and deep technical expertise customers need to unlock opportunities in this era of distributed intelligence,” said Intel Executive Vice President Gregory Bryant. “With an intense focus on execution for our core products and across our broader portfolio, we’re introducing a series of leadership products at CES with more following throughout the year.”

Introducing 11th Gen Intel® Core™ vPro®: The Best Platform for Business

For business, Intel introduced the 11th Gen Intel vPro platform, an unrivaled business platform delivering the industry’s highest performance and world’s most comprehensive hardware-based security2. The new 11th Gen Intel Core vPro processors unveiled today are based on the world’s best business processor for thin-and-light laptops2 and, when combined with the new Intel Core vPro platform, offer:

  • Intel® Hardware Shield, providing the world’s most comprehensive security deep in hardware for business3 and the industry’s first silicon-enabled artificial intelligence (AI) threat detection to help stop ransomware and crypto-mining attacks. It is also equipped with Intel® Control Flow Enforcement Technology, ground-breaking technology to help shut down an entire class of attacks that long evaded software-only solutions4.
  • Intel 10-nanometer (nm) SuperFin technology, delivering industry-leading performance, Intel® Iris® Xe graphics and the world’s biggest Wi-Fi improvement in 20 years – with integrated Intel® Wi-Fi 6/6E (Gig+) that enables up to six times faster uploads and downloads in the office and nearly three times faster speeds at home versus standard Wi-Fi 55.
  • Eight times6 better AI performance, enabling businesses new compute power to keep pace with the fast-changing software ecosystem, and up to 2.3 times faster7 creation and video editing compared to the previous generation.
  • Up to 23% faster productivity8 than the competition when using apps like Office 365 and the best business collaboration experience, enabling more than 50% faster9 office productivity compared to the competition while on a video conference call.

Intel also launched the Intel® Evo™ vPro® platform, the best laptop experience for business users10. Laptop designs verified on the Intel Evo vPro platform are stylish, thin and light and provide an amazing immersive visual experience. They also offer remarkable responsiveness, instant wake and real-world battery life. More than 60 new laptops from top manufacturers will be available this year, combining the security and manageability of vPro and the amazing on-the-go experiences of Intel Evo. Additionally, Intel announced Intel Evo Chromebooks, enabling a new class of premium Chromebooks.

New Processors and Partnerships for Best Education Platform

Use of the PC as an essential education tool has accelerated greatly worldwide over the past year. To meet the growing needs of students, Intel introduced new N-series Intel® Pentium® Silver and Celeron® processors with an unmatched balance of performance, media and collaboration for education systems. The processors are designed on Intel’s 10nm architecture, delivering up to 35%11 better overall application performance and up to 78% better graphics performance gen on gen. This enables smooth application performance and browsing while multitasking, plus advanced camera and connectivity features for an enriched video conferencing and viewing experience.

As critical as advancing technology for meeting students’ evolving needs is putting laptops in their hands. Even with accelerated adoption, up to 30% of U.S. school children still lack internet or laptops for learning, and the pandemic has only exacerbated those requirements. During the last 15 years, Intel has invested more than $1 billion globally in education, including training for more than 15 million teachers. Last April, Intel launched the Online Learning Initiative and has provided hundreds of thousands of devices, as well as connectivity and resources, to students worldwide. Intel will continue these efforts in 2021 along with partners from inside and outside the technology industry.

New Line of 11th Gen Intel® Core™ H-series Mobile Processors for the Best Gaming Platforms

Intel launched a new line of 11th Gen Intel Core H-series mobile processors for gaming that extends the 11th Gen mobile family of products and pushes the limits of what’s possible for enthusiast-level gaming in laptops as thin as 16 millimeters. Led by the Intel® Core™ i7 Special Edition 4-core processor with up to 5 gigahertz (GHz) Turbo, these H35 processors are specifically targeted for ultraportable gaming. They feature new Gen 4 PCIE architecture for connecting to latest discrete graphics and deliver amazingly low latency and immersive game play on the go. At CES, Acer, ASUS, MSI and Vaio announced new systems powered by the 11th Gen Intel Core H35-series processor for ultraportable gaming, with more than 40 designs from top manufacturing partners launching in the first half of 2021.

For mobile enthusiasts who want desktop-caliber gaming and creation performance, Intel also announced an 8-core processor that will start shipping later this quarter. This platform is unique in the industry with features that would normally only be found in high-end desktop systems – including up to 5GHz, 20 lanes of PCIe Gen 4.0 architecture for fastest storage and discrete graphics, and Intel® Killer™ Wi-fi 6E (Gig+).

Preview of Next-Generation “Rocket Lake” and “Alder Lake” Technologies for Leadership Desktop and Mobile Platforms

Intel also demonstrated next-generation desktop technology for gamers and enthusiasts coming to market in 11th Gen Intel® Core™ S-series desktop processors (“Rocket Lake-S”). Featuring 19% gen-over-gen instructions per cycle (IPC) improvement12 for the highest frequency cores and headlined by the Intel Core i9-11900K, these processors will bring even more performance to gamers and PC enthusiasts at launch in the first quarter of 2021.

Additionally, Intel demonstrated “Alder Lake,” the next-generation processor that represents a significant breakthrough in x86 architecture and Intel’s most power-scalable system-on-chip. Due in second half of 2021, Alder Lake will combine high-performance cores and high-efficiency cores into a single product. Alder Lake will also be Intel’s first processor built on a new, enhanced version of 10nm SuperFin and will serve as the foundation for leadership desktop and mobile processors that deliver smarter, faster and more efficient real-world computing.

1 In thin & light Windows-based devices, based on 1) unique features and performance testing on industry benchmarks and Representative Usage Guides across 3 key usages: productivity, creation, and collaboration, comparing Intel® Core™ vPro® i7-1185G7 to AMD Ryzen 7 PRO 4750U and 2) an IOActive study (commissioned by Intel) comparing Intel® Hardware Shield security capabilities on 11th Gen Intel Core vPro processors with corresponding competitor technologies. All testing as of December 2020. Visit www.Intel.com/11thgenvpro for details. Results may vary.

2 In thin & light Windows-based devices, based on unique features and performance testing (as of December 1, 2020) on industry benchmarks and Representative Usage Guides across 3 key usages: productivity, creation, and collaboration of Intel® Core™ vPro® i7-1185G7, including in comparison to AMD Ryzen 7 PRO 4750U. Visit www.Intel.com/11thgenvpro for details. Results may vary.

3 In thin & light Windows-based devices, based on unique features and testing by IOActive (commissioned by Intel; as of December 2020) comparing Intel® Hardware Shield security capabilities with corresponding technologies in an AMD Ryzen Pro 4750U-based system. Visit www.intel.com/11thgenvpro for details. Results may vary.

4 Intel Control-flow Enforcement Technology (CET) is designed to help protect against jump/call-oriented programming (JOP/COP) attack methods and return-oriented programming (ROP) attack methods, malware known as memory safety issues and which comprise over half of ZDI-disclosed vulnerabilities.  Visit www.intel.com/11thgenvpro for details.  Results may vary.

5 For more information about the data presented, visit www.intel.com/wifi6disclaimers.

6 As measured by MLPerf v0.7 Inference, Mobile Notebooks, Closed Division with Offline Scenario using OpenVINO 2021.1 Pre framework on MobileNetEdge model int8 GPU (Batch=16) on 11th Gen Intel® Core™ i7-1185G7 Processor vs highest attainable MLPerfv0.7 Inference, Mobile Notebooks, Closed Division with Offline Scenario using OpenVINO 2021.1 Pre framework on MobileNetEdge model int8 GPU (Batch=1) on 10th Gen Intel® Core™ vPro® i7-10810U processor

7 As measured by Video Editing workflow. 11th Gen Intel® Core™ vPro® i7-1185G7 Processor vs. 10th Gen Intel® Core™ vPro® i7-10610U Processor

8 As measured by Microsoft Office 365 workflow. 11th Gen Intel® Core™ vPro® i7-1185G7 Processor vs. MD Ryzen 7 PRO 4750U

9 As measured by Productivity and Collaboration Workflow. 11th Gen Intel® Core™ vPro® i7-1185G7 Processor vs. AMD Ryzen 7 PRO 4750U

10 In thin & light Windows-based devices, based on 1) unique features and performance testing on industry benchmarks and Representative Usage Guides across 3 key usages: productivity, creation, and collaboration, comparing Intel® Core™ vPro® i7-1185G7to AMD Ryzen 7 PRO 4750U and 2) an IOActive study (commissioned by Intel) comparing Intel® Hardware Shield security capabilities on 11th Gen Intel Core vPro processors with corresponding competitor technologies. All testing as of December 2020. Intel Evo vPro designs are co-engineered as part of Intel’s comprehensive laptop innovation program Project Athena then tested, measured, and verified against a premium specification and key experience indicators to ensure unparalleled user experiences. Visit www.Intel.com/11thgenvpro for details. Results may vary.

11 Source: Intel estimates as of January 2021. Based on measurements on Intel Pentium Silver and Celeron measured on platforms with Intel® Pentium® Silver N6000 Processor, PL1=6W TDP, PL2 = 20W 4C4T, Turbo up to 3.3GHz, Motherboard: JSL RVP, Graphics: Intel® UHD Graphics 605, Memory: 2x4GB DDR4- 3200, Storage: 512GB Intel SSD 660P, OS: Windows* 10 20 H1, OS Version 19041.546, BIOS : 2385.02_140 vs. Intel® Pentium® N5030 Processor, PL1=6W TDP, PL2 = 15W 4C4T, Turbo up to 3.1GHz, Motherboard: GLK RVP, Graphics: Intel® UHD Graphics 605, Memory: 2x4GB DDR4 -2400, Storage: 256GB Intel® SSD 540s Series, OS: Windows* 10 19H1, OS Version: 10.0.19041.630 BIOS : 0064_42

12 Source: Intel estimates as of January 2021. Based on measurements on Intel Internal reference platforms running SPEC CPU 2017 1-copy rate on 11th Gen Intel® Core™ i9-11900K vs 10th Gen Intel® Core™ i9-10900K (running each at the same fixed frequency).

Performance varies by use, configuration and other factors. Learn more at www.Intel.com/PerformanceIndex​.

Performance results are based on testing as of dates shown in configurations and may not reflect all publicly available ​updates.  See CES 2021 Claim Appendix on intel.com/PerformanceIndex for configuration details.  No product or component can be absolutely secure.

Your costs and results may vary.

Intel technologies may require enabled hardware, software or service activation.

The post CES 2021: Intel Announces Four New Processor Families appeared first on Intel Newsroom.

CES 2021: Intel News Conference – Gregory Bryant: Do More with the Power of Computing (Replay & Live Blog)

Produits Intel - lun, 11/01/2021 - 20:00


» Download video: “CES 2021: Intel News Conference – Gregory Bryant: Do More with the Power of Computing”

The transformative power of computing to help people do more is clear. At CES 2021, Intel Executive Vice President Gregory Bryant and other Intel executives highlight how Intel is executing and driving innovation in process technology, packaging and architecture to deliver that transformative computing experience for consumers and businesses alike.

As we enter the era of distributed intelligence, computing is pervasive and intelligence is distributed. Put simply: Everything looks like a computer, and everything is in the cloud. At CES 2021, Bryant and team expand on how Intel is delivering for its customers as the company embraces the incredible growth opportunity this data revolution has created. This includes Intel introducing more than 50 processors for business, education, mobile and gaming computing platforms – resulting in more than 500 new designs for laptops and desktops coming to market in 2021.

More: Intel at CES 2021 (Press Kit)

Live Blog: Follow along below for real-time updates of this virtual event.

1:00 p.m.: Welcome everyone to Intel at CES 2021. I’m Marcus Yam, technology evangelist at Intel, and I will be providing a play-by-play of our upcoming press conference “Do More With the Power of Computing.”

Like our previous launch of 11th Gen Core “Tiger Lake” processors, this is a virtual event. We miss seeing everyone in at CES Las Vegas, but fortunately we have lots of news to share with you today – get ready for new processors galore!

Kicking off the conference is Gregory Bryant, Intel Executive VP and Client Computing Group leader, whom we often call “GB” at Intel.

“While we can’t be together in person, I am grateful we can still connect through the power of technology,” says GB. “It’s this ability – to connect hundreds of thousands of us all over the globe – that truly demonstrates the essential role technology plays in our lives. … We live in a world where computing is now pervasive. Computers are no longer just a PC or a server.”

GB talks about how computers are interconnected, part of the network, the hospital, the car, etc. “And computing is the heart of everything we do at Intel – we’re a computing company”

1:02 p.m.: A couple recent examples: the major design win with Amazon Web Services for the Habana Gaudi AI accelerators and the news shared today by Mobileye, an Intel company creating autonomous vehicle technology.

GB announces that production shipments have started for next-generation Intel Xeon Scalable 10nm “Ice Lake” server processors with volume ramping throughout this quarter. ❄ Cloud, enterprise and networking businesses, brace yourselves!

1:04 p.m.: Since launching in September, there are now more than 120 11th Gen Core designs, with 50 Intel Evo designs with verified performance from Acer, Asus, Dell, HP, Lenovo, and Samsung, among others.

That’s a broad array of choice. “You won’t see a ‘one system fits all’ mentality from Intel and its partners,” says GB. “Only Intel can deliver this breadth and scale of designs, because we have deep technical partnerships with more than 150 companies around the world.”

1:05 p.m.: The news today: new processors for business; new family of processors for education, and two new lines of processors for “absolute performance leadership, as measured by real world performance.”

GB turns it over to Stephanie Hallford to talk business, but not before he teases that there will be a surprise at the end.

Hallford, VP and GM of Business Client Platforms, says that the impact of the global pandemic has businesses accelerating transformation, adapting to new cloud realities, and keeping their workers safe and productive by supporting remote work. “While we forecasted the need for remote security and manageability, COVID-19 greatly accelerated and complicated these requirements.”

Enter the Intel vPro platform that focuses on three key areas, Hallford explains.

  • Security: “vPro is the world’s most comprehensive hardware-based security available for businesses today. Software alone is not enough.”
  • Manageability: “vPro is the only solution with hardware-based remote manageability giving businesses the ability to reach – and if needed, patch – all their systems regardless of location.”
  • Performance: “Business-class performance to enable productivity, video collaboration and content creation – even in a remote work environment.”

Naturally, 11th Gen Core is getting suited up (or cozy WFH loungewear these days) with vPro.

1:07 p.m.: Hallford walks through a demo of two laptops, one with Intel vPro and the other running an AMD processor. The vPro system has an Intel-invented Control-Flow Enforcement Technology, while the other one does not.

“Both systems are open to the same webpage. As we scroll down the page, there is an advertisement that is hiding a control flow attack. Let’s click on it to see what happens on each system,” says Hallford. “On the non-Intel system, the attack begins completely undetected.”

“Now, on the Intel vPro system, let’s click the same link. As you can see, we detect and block the attack.”

1:08 p.m.: 11th Gen Intel vPro also means “Tiger Lake” performance.

CES 2021: Mobileye Innovation Will Bring AVs to Everyone, Everywhere

Produits Intel - lun, 11/01/2021 - 19:00


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NEWS HIGHLIGHTS

  • Automated, worldwide autonomous vehicle (AV) mapping capability allows Mobileye to expand its AV test fleets; new vehicles expected in Detroit, Tokyo, Shanghai, Paris and (pending regulation) New York City early this year.
  • Intel brings its XPU strategy, expertise and manufacturing capability in silicon photonics to develop a lidar system-on-chip (SoC) for Mobileye use in AVs starting in 2025.
  • Mobileye plans a software-defined radar customized to autonomous vehicles.
  • Mobileye reveals that cars using its existing technology have mapped nearly 1 billion kilometers globally, with more than 8 million kilometers mapped daily.

Jerusalem, Jan. 11, 2021 — Mobileye, an Intel Company, today previewed the strategy and technology that will enable autonomous vehicles (AV) to fulfill their lifesaving promise globally. During two sessions at this week’s Consumer Electronics Show, Mobileye president and chief executive officer Amnon Shashua will explain how Mobileye is set up to win globally in the AV industry.

“The backing of Intel and the trinity of our approach means that Mobileye can scale at an unprecedented manner,” Shashua said. “From the beginning, every part of our plan aims for rapid geographic and economic scalability – and today’s news shows how our innovations are enabling us to execute on that strategy.”

The Mobileye Trinity

In describing the trinity of the Mobileye approach, Shashua will explain the importance of delivering a sensing solution that is orders of magnitude more capable than human drivers. He will describe how Mobileye’s technology – including Road Experience Management™ (REM™) mapping technology, rules-based Responsibility-Sensitive Safety (RSS) driving policy and two separate, truly redundant sensing subsystems based on world-leading camera, radar and lidar technology – combine to deliver such a solution.

More: Intel News Conference – Amnon Shashua:  It’s Time to Go (Video) | Intel Announces Four New Processor Families | Intel at CES 2021 (Press Kit) | Mobileye News | Autonomous Driving News

Mobileye’s approach solves the scale challenge from both a technology and business perspective. Getting the technology down to an affordable cost in line with the market for future AVs is crucial to enabling global proliferation. Mobileye’s solution starts with the inexpensive camera as the primary sensor combined with a secondary, truly redundant sensing system enabling safety-critical performance that is at least three orders of magnitude safer than humans. Using True Redundancy™, Mobileye can validate this level of performance faster and at a lower cost than those who are doing so with a fused system.

New Radar and Lidar Technology

Shashua explained that the company envisions a future with AVs achieving enhanced radio- and light-based detection-and-ranging sensing, which is key to further raising the bar for road safety. Mobileye and Intel are introducing solutions that will innovatively deliver such advanced capabilities in radar and lidar for AVs while optimizing computing- and cost-efficiencies.

As described in Shashua’s “Under the Hood” session, Mobileye’s software-defined imaging radar technology with 2304 channels, 100DB dynamic range and 40 DBc side lobe level that together enable the radar to build a sensing state good enough for driving policy supporting autonomous driving. With fully digital and state-of-the-art signal processing, different scanning modes, rich raw detections and multi-frame tracking, Mobileye’s software-defined imaging radar represents a paradigm shift in architecture to enable a significant leap in performance.

Shashua also will explain how Intel’s specialized silicon photonics fab is able to put active and passive laser elements on a silicon chip. “This is really game-changing,” Shashua said of the lidar SoC expected in 2025. “And we call this a photonic integrated circuit, PIC. It has 184 vertical lines, and then those vertical lines are moved through optics. Having fabs that are able to do that, that’s very, very rare. So this gives Intel a significant advantage in building these lidars.”

» Click for full image

Worldwide Maps Bring AVs Everywhere

In Monday’s session, Shashua will explain the thinking behind Mobileye’s crowdsourced mapping technology. Mobileye’s unique and unprecedented technology can now map the world automatically with nearly 8 million kilometers tracked daily and nearly 1 billion kilometers completed to date. This mapping process differs from other approaches in its attention to semantic details that are crucial to an AV’s ability to understand and contextualize its environment.

For AVs to realize their life-saving promise, they must proliferate widely and be able to drive almost everywhere. Mobileye’s automated map-making process uses technology deployed on nearly 1 million vehicles already equipped with Mobileye advanced driver-assistance technology.

To demonstrate the scalable benefits of these automatic AV maps, Mobileye will start driving its AVs in four new countries without sending specialized engineers to those new locations. The company will instead send vehicles to local teams that support Mobileye customers. After appropriate training for safety, those vehicles will be able to drive. This approach was used in 2020 to enable AVs to start driving in Munich and Detroit within a few days.

Find out More  

Watch Mobileye’s day one press conference at 10 a.m. PST Monday, Jan. 11, and the deeper technology session at 10 a.m. PST Tuesday, Jan. 12. Both will be broadcast on the Intel Newsroom.

About Mobileye 

Mobileye is the global leader in the development of computer vision and machine learning, data analysis, localization and mapping for Advanced Driver Assistance Systems and autonomous driving. Mobileye’s technology helps keep passengers safer on the roads, reduces the risks of traffic accidents, saves lives and has the potential to revolutionize the driving experience by enabling autonomous driving. Mobileye’s proprietary software algorithms and EyeQ® chips perform detailed interpretations of the visual field in order to anticipate possible collisions with other vehicles, pedestrians, cyclists, animals, debris and other obstacles. Mobileye’s products are also able to detect roadway markings such as lanes, road boundaries, barriers and similar items; identify and read traffic signs, directional signs and traffic lights; create a Mobileye Roadbook™ of localized drivable paths and visual landmarks using REM™; and provide mapping for autonomous driving.

The post CES 2021: Mobileye Innovation Will Bring AVs to Everyone, Everywhere appeared first on Intel Newsroom.

CES 2021: Intel News Conference – Amnon Shashua:  It’s Time to Go (Replay)

Produits Intel - lun, 11/01/2021 - 17:00


» Download video: “CES 2021: Amnon Shashua Shares that Mobileye’s AVs are on the ‘Go’ Around the World”

Prof. Amnon Shashua, senior vice president of Intel and chief executive officer of Mobileye, explains what sets Mobileye’s autonomous driving ambitions apart from the pack. Joining him is Ed Niedermeyer, author, columnist and co-host of Autonocast, who provides his perspective on the significance of Mobileye’s news on the industry.

Shashua kicks off the virtual event with news on the company’s expanded global testing footprint before moving on to dissect the three core tenants of Mobileye’s ability to scale. During the 30-minute session, Shashua unpacks the Mobileye “trilogy:” a three-pronged differentiated growth strategy that encompasses the company’s automatically generated, crowdsourced high-definition maps; a driving policy based on Responsibility-Sensitive Safety (RSS); and the company’s camera-first mature sensing technology.

More: CES 2021: Mobileye Innovation Will Bring AVs to Everyone, Everywhere | Mobileye News | Autonomous Driving News | Intel at CES 2021

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Intel Unveils New Partner Alliance to Unify the Channel

Produits Intel - jeu, 07/01/2021 - 18:00

What’s New: Intel today announced the official launch of the new Intel® Partner Alliance, going live Jan. 11, 2021. The alliance unifies longstanding Intel® partner programs, such as Intel® Technology Provider, Intel® IOT Solutions Alliance and Intel® Cloud Insider, into a single, streamlined offering for the full partner ecosystem. The new program is designed to enhance Intel’s relationship with valued partners and together accelerate new market opportunities in an increasingly data-centric world.

“The new Intel Partner Alliance will better reflect the diversity of business models among partners and give them the opportunity to maximize program benefits. We appreciate each of our partners for their continued collaboration to bring new technologies to life for our customers across the world.”
–Eric Thompson, Intel general manager of Global Partner Enablement

What It Will Look Like: The launch is anchored by a redesigned portal that will incorporate Intel® Partner University and Intel® Solutions Marketplace into one seamless platform, making it easier for partners to find the content they need, skill up on key technologies and collaborate for new opportunities.

What You’ll See: These changes are driven by Intel’s commitment to partners to unify the Intel Partner Programs. The key elements of the new Intel Partner Alliance include:

  • New partner types: Expansion of the types of partner roles Intel engages with to increase collaboration across the ecosystem. New roles include field programmable gate array design services, cloud service provider, independent software vendor, distributor, manufacturer, solution provider, original equipment manufacturer and service integrator.
  • Intel Partner University: Deeper training for Intel’s partners to grow their expertise on a variety of topics, solutions and specialties.
  • Personalized experiences: More personalized content for customers through artificial intelligence, whether it be rewards, trainings or products.
  • Benefits: Expansion of the rewards system to simplify and maximize program benefits and rewards across all partner levels and roles.
  • Intel Solutions Marketplace: New opportunities for partner connections and matchmaking, lead generation and management, and storefront monitoring.

Why It’s Important: The new Intel Partner Alliance will focus on solutions and connecting Intel’s partners with each other and new customers. It will provide an improved customer experience by streamlining multiple programs and infrastructures into a more integrated, flexible and customized partner program framework. As the industry evolves and businesses adapt, Intel is focused on unifying partners into one powerful platform that enables collaboration and innovation.

What Partners Need to Do: Starting Jan. 11, partners can log in to the new Intel® Portal to activate their accounts and explore the updated interface and new offerings. Existing partners are invited to a webcast to celebrate the launch and to hear from leaders how Intel is supporting them in 2021. Partners can attend the webcast on Jan. 12 from 8 to 9 a.m. PST or from 7 to 8 p.m. PST. Registration for the webcast is on the Intel Partner Alliance website.

More Context: Intel Partner Alliance Program | Intel Announces 2020 US Partner of the Year Awards for Excellence in Accelerating Innovation | Intel Unveils New Programs to Help Partners Connect, Innovate and Grow in a Data-Centric World

Intel Partner Stories: Intel Customer Spotlight on Intel.com | Partner Stories on Intel Newsroom

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Turn a Touch Interface Touchless with Intel RealSense TCS

Produits Intel - jeu, 07/01/2021 - 17:30
Intel RealSense Touch Control Software (TCS) enables a safe, touchless way to interact with today’s touch-based public displays. (Credit: Intel Corporation)
» Click for full image

What’s New: Today, Intel announced Intel® RealSense™ Touchless Control Software (TCS), a simple solution for converting a touch-based kiosk or digital sign into a safer, touchless one while maintaining a familiar and intuitive user experience. With the pandemic affecting people worldwide, pay and check-in stations, automated teller machines and ordering kiosks could use the Intel RealSense software and camera to offer safer, touch-free options.

“Intel RealSense TCS leverages computer vision to seamlessly convert a touch interaction to a touchless one. TCS provides a smooth transition without changing existing user interfaces or writing a single line of code, creating a safer way of interacting with public displays.”
–Sagi Ben Moshe, Intel corporate vice president and general manager of Emerging Growth and Incubation

Why It’s Important: Intel RealSense TCS is a cost-effective solution that easily transforms touch-based interfaces to touchless for safer interactions, without the need to replace existing displays or their core software systems. Banks, malls, restaurant chains, retailers and more rely on interactive displays for business operations and the need for a touchless solution has never been greater.

Intel RealSense Touchless Control Software (TCS), when combined with an Intel RealSense Depth Camera D435, provides a seamless transition from touch to touchless, requiring no change to the core software, user interface or user experience. (Credit: Intel Corporation)
» Click for full image

How It Works: When combined with an Intel® RealSense™ Depth Camera D435, TCS provides a seamless conversion from touch to touchless, requiring no change to the core software, user interface or user experience. Designed to be easily incorporated into new and existing systems, TCS runs on top of current software to deliver a safer way to interact with public displays.

TCS supports a variety of kiosks and digital signs, ranging in size from 11 to 32 inches, in both landscape and portrait layouts. The Depth Camera D435 is mounted directly above a screen and enables touchless interaction with public displays, allowing users to interact just as they did before.

For more information on TCS, join the Intel RealSense virtual demo at CES on January 12-13, 2021.

More Context: Intel RealSense (Intel.com) | Intel RealSense (Press Kit)

The Small Print:
Intel is committed to respecting human rights and avoiding complicity in human rights abuses. See Intel’s Global Human Rights Principles.  Intel’s products and software are intended only to be used in applications that do not cause or contribute to a violation of an internationally recognized human right. 

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Introducing Intel RealSense ID Facial Authentication

Produits Intel - mer, 06/01/2021 - 17:30
Intel RealSense ID was designed with privacy as a top priority. Purpose-built for user protection, Intel RealSense ID processes all facial images locally and encrypts all user data. (Credit: Intel Corporation)
» Click for full image

What’s New: Today, Intel introduced Intel® RealSense™ ID, an on-device solution that combines an active depth sensor with a specialized neural network designed to deliver secure, accurate and user-aware facial authentication. Intel RealSense ID works with smart locks, access control, point-of-sale, ATMs, kiosks and more.

“Intel RealSense ID combines purpose-built hardware and software with a dedicated neural network designed to deliver a secure facial authentication platform that users can trust.”
–Sagi Ben Moshe, Intel corporate vice president and general manager of Emerging Growth and Incubation

How It Works: With an easy enrollment process and no network setup needed, Intel RealSense ID brings a highly accurate, natural solution that simplifies secure entry. Using only a glance, users are able to quickly unlock what’s important to them. Intel RealSense ID combines active depth with a specialized neural network, a dedicated system-on-chip and embedded secure element to encrypt and process user data quickly and safely.

Intel RealSense ID combines active depth with a specialized neural network, a dedicated system-on-chip and embedded secure element to encrypt and process user data quickly and safely. (Credit: Intel Corporation)
» Click for full image

To ensure continued ease of use, Intel RealSense ID also adapts to users over time as they change physical features, such as facial hair and glasses. The system works in various lighting conditions for people with a wide range of heights or complexions.

Why It’s Important: As traditional authentication methods leave users vulnerable to ID theft and security breaches, companies and individuals are turning to facial authentication technology to ensure the highest levels of security and privacy are met.

In industries such as finance, healthcare and smart access control, companies need technology they can trust. Intel RealSense ID has built-in anti-spoofing technology to protect against false entry attempts using photographs, videos or masks, and provides a one-in-1-million false acceptance rate.

Privacy driven and purpose built for user protection, Intel RealSense ID processes all facial images locally and encrypts all user data. The solution is also only activated through user awareness and will not authenticate unless prompted by a pre-registered user. As with all Intel technology, we are working to ensure the ethical application of RealSense and the protection of human rights.

More Context:  Intel RealSense (Intel.com) |  Intel RealSense (Press Kit)

The Small Print:
Intel is committed to respecting human rights and avoiding complicity in human rights abuses. See Intel’s Global Human Rights Principles. Intel’s products and software are intended only to be used in applications that do not cause or contribute to a violation of an internationally recognized human right.

The post Introducing Intel RealSense ID Facial Authentication appeared first on Intel Newsroom.

Intel Corporation Statement Regarding Third Point LLC Letter

Produits Intel - mar, 29/12/2020 - 19:07

SANTA CLARA, Calif., Dec. 29, 2020 – Intel Corporation welcomes input from all investors regarding enhanced shareholder value. In that spirit, we look forward to engaging with Third Point LLC on their ideas towards that goal.

The post Intel Corporation Statement Regarding Third Point LLC Letter appeared first on Intel Newsroom.

CDW and Intel Partner to Simplify the Complex for Customers

Produits Intel - lun, 28/12/2020 - 18:00

What’s New: As Intel looks to deliver its industry leading technology in 2021, the company is expanding its partnership with CDW to bring new solutions to market that solve customer’s business challenges. Combining Intel’s cutting-edge technology with CDW’s IT orchestration capabilities and services provides end-to-end solutions for customers.

“At Intel we rely on our trusted partners like CDW to bring world-class solutions to life. With technology from Intel and services from CDW, together we can maximize our individual strengths to help the entire ecosystem.”
–Greg Ernst, Intel vice president of the Sales and Marketing Group and general manager of U.S. Sales

Why It Matters: Technology is becoming increasingly complex as artificial intelligence (AI), edge and cloud all come together to transform businesses. It is important for companies to have access to products as well as services to ensure they can modernize their technology environment in easy and cost-effective ways.

Building on over a decade of partnership, Intel and CDW will help ensure technology is delivered to people and organizations transforming their operations. This includes everything from internet of things services available to help retailers screen for COVID-19 to 11th Gen Intel® Core™ vPro® processor-based systems coming in January 2021 to help businesses securely manage their remote workforces.

How Intel and CDW Work Together: As a top technology solutions provider, CDW is a critical piece of the technology ecosystem. Intel works with CDW to provide technology expertise, architectural insights, and sales and marketing capabilities. In return, CDW provides IT orchestration capabilities and services and a leading sales organization that reaches customers around the world. CDW recently recognized Intel as one of its 2020 partners of the year because of these capabilities and the close collaboration.

“Our partnership with Intel enables us to help our customers solve their business challenges,” said Aletha Noonan, senior vice president, product and partner management, CDW. “Intel’s world-class technology, platform-focused approach, and sales and marketing leadership is the foundation of our partnership and why Intel is such a valued partner for CDW.”

More Context: CDW Partner of the Year (Press Release) | Intel & CDW (Product support page) | Creating Learning Connections Initiative (News Byte)

Intel Partner Stories: Intel Customer Spotlight on Intel.com | Partner Stories on Intel Newsroom

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With Intel Tech, A Singapore Coffee Shop Builds a Robot Barista

Produits Intel - lun, 28/12/2020 - 17:00

At Crown Coffee, a small-yet-homey coffee bar in downtown Singapore, the barista never gets your order wrong. Ella is her name and with uncanny consistency she makes a perfect cup of coffee every time.

Ella is not human, but a fully autonomous robot barista. Named after the wife of Crown Coffee’s CEO and founder Keith Tan, Ella is a six-axis robot that runs on a constellation of Intel parts: an Intel® Movidius™ vision processing unit, the Intel® Distribution of OpenVINO™ toolkit, and Intel® Xeon® and Intel® Core™ processors. Intel tech powers everything Ella does: taking orders remotely via an online app, making your cup of coffee, notifying you when it’s ready, serving it, finalizing your bill and charging your credit card.

More: Internet of Things News

The idea behind Ella naturally started over coffee. Two years ago, Tan spotted a group of Intel Singapore employees having lunch in his shop. He greeted the group and pitched what he called at the time a “completely wild idea.” The group, part of Intel’s Sales and Marketing Group, connected Tan with the right Intel teams – and the rest is coffee history.

“I have plenty of gratitude to Intel, as they helped me realize this idea,” Tan said. “They listened to me, understood the problems I was trying to solve and partnered with me to design and develop prototypes.”

Ella the fully autonomous robot barista at Crown Coffee in Singapore runs on a constellation of Intel parts: Intel Movidius vision processing unit, the Intel Distribution of OpenVINO toolkit, and Intel Xeon and Intel Core processors. (Credit: Intel Corporation)

Ella solves many of Tan’s challenges. First, the compact unit takes up a fraction of the space required for a traditional coffee bar, which translates into a cheaper retail footprint. Next, Tan is able to guarantee quality and consistency in every cup served. And Ella frees up labor, allowing Tan to reassign his staff to other in-store tasks like greeting customers or cleaning. But perhaps most important during the COVID-19 pandemic, customers are assured of safety as Ella operates in a sealed chamber. No human interacts with the product from the moment it’s made to when it’s served hot.

“I had an Americano, and it was amazing,” said Santhosh Viswanathan, who works for Intel in Singapore. “Ella opens new possibilities to food retailers to enable contactless futuristic service and develop alternate revenue models with the data Ella gathers.”

Tan and his team are planning to scale the solution to 40 other locations across Singapore, then to Japan and the rest of the world. “What we are doing is transformational and will be part of the landscape of smart cities where AI-driven robots become deeply ingrained into our daily lives. Also, this is New Retail, which eases retail labor shortages while providing re-skilling employment opportunities for value-added technology and engineering people,” said Tan, citing location examples like kiosks at busy train stations.

Intel Partner Stories: Intel Customer Spotlight on Intel.com | Partner Stories on Intel Newsroom

Intel technologies may require enabled hardware, software or service activation. No product or component can be absolutely secure. Your costs and results may vary.

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10nm, Creative Improvements Expand Intel Manufacturing Capacity

Produits Intel - mer, 23/12/2020 - 16:00

In response to incredible customer demand, Intel has doubled its combined 14nm and 10nm manufacturing capacity over the past few years. To do this, the company found innovative ways to deliver more output within existing capacity through yield improvement projects and significant investments in capacity expansion. This video recounts that journey, which even included repurposing existing lab and office space for manufacturing.

“Over the last three years, we have doubled our wafer volume capacity, and that was a significant investment. Moving forward, we’re not stopping… We are continuing to invest into factory capacity to ensure we can keep up with the growing needs of our customers,” says Keyvan Esfarjani, senior vice president and general manager of Manufacturing and Operations at Intel.

The company also ramped its new 10nm process this year. Intel currently manufactures 10nm products in high volumes at its Oregon and Arizona sites in the U.S. and its site in Israel.

In 2020, Intel introduced an expanding lineup of 10nm products including 11th Gen Intel® CoreTM processors and the Intel Atom® P5900, a system-on-chip for wireless base stations. In addition, the company introduced 10nm SuperFin technology, which enables the largest single intranode enhancement in Intel’s history and delivers performance improvements comparable to a full-node transition.

Esfarjani explains: “10nm progress is coming along quite well. We have three high-volume manufacturing operations that are going full steam ahead to see how we can do more, better and faster, and continue to support our customers.”

NOTE: Intel’s capacity expansion program has been a multiyear journey. The factory and office footage in this video was captured prior to Covid-19 safety measures. Intel workers currently working on-site observe appropriate social distancing and mask measures in accordance with internal policies and local requirements.

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Intel’s 2020 Year in Review

Produits Intel - mer, 23/12/2020 - 15:00

2020 has been a year the world will never forget.

We say that every December as we introduce Intel’s yearbook. And it’s always true. But this year it’s especially appropriate. We’ve grappled in our personal and professional lives with a world turned topsy-turvy by the pandemic. Still, it’s been a year of achievements — large and small — as day after day we conceive and craft world-changing technologies that enrich the lives of every person.

Our lives in 2020 have indeed been dominated by COVID-19. But collectively, more than 110,000 of us at Intel have achieved a great deal this year — in spite of its challenges.

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2020 Intel Industry Analyst Summit Highlights

Produits Intel - lun, 21/12/2020 - 18:44

The 2020 Intel Industry Analyst Summit, which was presented virtually from Dec. 8-10, 2020. Highlights from the summit include presentations by Intel leaders:

Bob Swan, Intel chief executive officer, presents a welcome and opening remarks.

Saf Yeboah-Amankwah, Intel senior vice president and chief strategy officer, presents “Trends Shaping the Future of Compute.
» Jump to Saf Yeboah-Amankwah

Michelle Johnston Holthaus, executive vice president, chief revenue officer and general manager of the Sales, Marketing and Communications Group at Intel, presents “Delivering that Solutions Customers Need.”
» Jump to Michelle Johnston Holthaus

Sandra Rivera, Intel executive vice president and chief people officer, presents “Building a Compelling Culture to Fuel Growth.”
» Jump to Sandra Rivera

Raja Koduri, senior vice president, chief architect, and general manager of Architecture, Graphics, and Software at Intel, presents “XPUs and Software for the Next Era of Computing.”
» Jump to Raja Koduri

Josh Walden, Intel senior vice president and general manager of the Design Engineering Group, presents “Flexibility in Design.”
» Jump to Josh Walden

Ann Kelleher, Intel senior vice president and general manager of Technology Development, presents “Engineering for the Future.”
» Jump to Ann Kelleher

Lisa Spelman, Intel corporate vice president in the Data Platform Group and general manager of the Xeon and Memory Group, presents “Unlocking Data at Scale with the Data Center of the Future.”
» Jump to Lisa Spelman

Gregory Bryant, Intel executive vice president and general manager of the Client Computing Group, presents “Delivering Leadership Products.”
» Jump to Gregory Bryant

Professor Amnon Shashua, senior vice president at Intel Corporation and president and chief executive officer of Mobileye, an Intel company, presents “Redefining Our Position: Beyond the Core.”
» Jump to Amnon Shashua

Rich Uhlig, Intel Senior Fellow and director of Intel Labs, presents “Shaping the Future.”
» Jump to Rich Uhlig

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Real-Time Network Visibility is Critical for Data Centers

Produits Intel - sam, 19/12/2020 - 00:00
Changhoon Kim
Intel Fellow
Chief Technology Officer, Applications, Barefoot Switch Division

By Changhoon Kim

Getting stuck in traffic is not fun. Not knowing what’s going on or how long you’ll be there is even worse. But it is an apt metaphor for the challenges – and solutions – facing data center networking.

Before the internet, people relied on the radio for traffic alerts. If you heard about a traffic jam and had the option to take an alternate route, the system worked fine. However, if you heard the traffic report after it was too late to take an alternate route, the system failed because the tracking and reporting didn’t happen in real time. Meanwhile, without knowing the exact location of each car and where it was heading, the traffic control system offered limited optimality.

More: Interconnect Technologies

Today, nearly every car has a GPS tracking system that uses the driver’s speed input and location to compile a live view of traffic conditions. The system can then navigate you onto the best route at any moment in time. This is analogous to data center traffic: Without tracking systems to identify network congestion issues in real time, network owners will inevitably experience delays before they have an opportunity to troubleshoot problems.

At Intel, we solve this problem using In-Band Network Telemetry (INT). I discussed the power of INT and real-time telemetry in my recent Micron to Miles briefing. INT is an imperative technology we use to help accelerate network performance, improve network agility and increase network visibility.

Telemetry in Real Time

Unlike alternative telemetry solutions that produce the same lag we see with radio traffic reports, INT collects data on every packet in the network as it happens. This provides a comprehensive understanding of network bottlenecks and steers packets to the least congested paths. Consequently, INT provides unprecedented visibility into packet conditions and offers complete network transparency. In terms of real-time applications such as video conferencing, voice over IP calls and factory automation, INT helps to avoid any loss or delay that could degrade application performance and cause noticeable consequences.

For in-depth analysis of INT information, Intel® Deep Insight™ Network Analytics Software collects, compiles and reports on all telemetry data for a holistic view of the network. This tool processes packet reports in real time, implementing intelligent analytics and data correlation techniques to detect network anomalies. These reports can also be stored for deeper historical analysis to allow data flows to react to other throughput degradation issues. Decisions can be made autonomously at any INT-capable device as well, further reducing the reaction time to congestion issues.

Host-Based INT

In my Micron to Miles presentation, we demonstrated an exciting new mode called “hos-based INT.” This capability is designed to report on network conditions from a viewpoint outside the network. For example, internet game companies depend on reliable internet speeds for a positive customer experience. With host-enabled INT, they can gauge performance from one end of the network to the other and determine whether an issue is coming from the network or their software application.

Long-Term Impact

INT and Intel Deep Insight Network Analytics Software provide a huge leap in reducing network congestion and anticipate the fastest path for data packets to reach their destination. These technologies can empower our customers to gain an in-depth understanding of challenges facing their networks, which is, and will continue to be, ever so critical as the demand for data continues to grow.

Changhoon Kim is an Intel Fellow and chief technology officer of Applications in the Barefoot Switch Division of Intel Corporation.

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IEDM 2020 Marks Key Process and Packaging Innovations by Intel

Produits Intel - ven, 18/12/2020 - 21:00
Robert Chau
Intel Senior Fellow
Director, Components Research

By Robert Chau

The International Electron Devices Meeting (IEDM), hosted every year since 1954 by the Institute of Electrical and Electronics Engineers (IEEE), is undoubtably the world’s premier conference for breakthrough semiconductor technologies. Intel researchers made 19 presentations at this week’s IEDM 2020, demonstrating breakthroughs in various next-generation process and packaging technologies including transistor technologies that increasingly focus on 3D architectures, paving the way for future technology nodes over the course of the next decade.

At Intel, innovation is driven by the dedication of hundreds of researchers who are intent on advancing growth opportunities in artificial intelligence, 5G network transformation, and the intelligent, autonomous edge for our customers. A decade ago, Intel met challenges in scaling and power consumption with the introduction the FinFET transistor, HK metal gate and strained silicon as the building blocks for moving semiconductor technology forward. At IEDM 2020, Intel demonstrated that it has a full pipeline of innovation that will be needed to deliver the building blocks of future world-changing technologies.

While FinFETs still have plenty of life, the industry will transition to a new architecture: Gate-All-Around (GAA) FETs, in which the gate wraps around the channel on all sides. GAA FETs pack more high-performance transistors into a given area, reducing the width of the standard cell as compared to a traditional FinFET. Another way to drive cell area scaling is through 3D vertical stacking of transistor devices. Whether GAA or FinFET, the height of a standard cell can be significantly decreased through monolithic stacking of a n-channel metal-oxide semiconductor (NMOS) device on top of a p-channel metal-oxide semiconductor (PMOS) device, or vice versa, and research in this 3D stacking is well underway at Intel.

Intel is pioneering a “self-aligned” process for these stacked devices that we believe is capable of lower manufacturing costs, with no thermal budget constraints compared to other approaches. In our presentation “3-D Self-aligned Stacked NMOS-on-PMOS Nanoribbon Transistors for Continued Moore’s Law Scaling,” we detailed how a 50% area scaling benefit comes from combining stacked nanoribbon transistors and vertical interconnects between the two device layers. We believe it is the industry’s first practical demonstration of vertically stacked CMOS with multiple silicon nanoribbons.

We also described how strained transistor channels can be implemented into GAA transistors to improve their performance. Strained silicon is another industry breakthrough first brought into use by Intel, back during the 90-nanometer technology generation. Since then, pushing to higher strain levels has proven to be critical to keeping CMOS performance improvements on track. Our IEDM 2020 presentation details how strained channels can be implemented into GAA transistors with the use of high Ge-content silicon germanium technology to achieve high-performance PMOS devices.

Continuing to drive Moore’s Law scaling requires integrating new features from every aspect of the compute platform, not just at the silicon level. At IEDM ’19 we described research that extends our 3D stacked Foveros packaging technology. This year we demonstrated packaging innovations to support RF devices, critical for the 5G and 6G communications industry. At IEDM ’20 we introduced a method using lithography – rather than laser drilling – to create fine pitch vias in organic packages. Here, Intel has demonstrated the industry’s first low-loss multilayer organic package for integrated multiplexer and filter devices at sub-THz frequencies to further enable customers pursuing future 6G networks.

Following 2019’s IEDM, I wrote that Moore’s Law has been the guiding principle for the semiconductor industry for more than 50 years and its future is brighter than ever. A year later, following IEDM ’20, not only am I reassured about my previous statements, but now with more technology innovation in the pipeline than ever before, I am even more confident that Intel will lead the ecosystem to realize these innovations in our technologies.

Summary of Key Intel Innovations at IEDM 2020

  • Demonstration of a self-aligned 3D stacked multi-ribbon CMOS transistor architecture for increased density & continued Moore’s Law scaling.
  • Demonstration of high-performance short-channel Gate-All-Around (GAA) strained Si0.4Ge0.6 nanosheet PMOS transistor with a highly scaled Si-cap-free gate oxide for transistor performance enhancement.
  • Hafnia-based ferroelectric memory with industry-best endurance data demonstrated for future dense embedded memory applications.
  • Demonstration of integrated sub-THz devices on panel-level organic package substrate using a novel lithography defined vias process.
  • Demonstration of monolithic GaN NMOS/Si CMOS integration on 300mm Si wafer for single-chip fully integrated high-performance 5G/6G and power delivery applications.
  • Demonstration of an integrated on-die metal interconnect system with different metal aspect ratios, air gaps and geometries to boost interconnect RC performance.

Robert Chau is an Intel Senior Fellow and director of Components Research at Intel Corporation.

Photo: Robert Chau, Intel Senior Fellow in Technology Development, directs Intel’s Components Research team that invents and develops novel materials, devices, interconnects, patterning and packaging used in Intel technology. (Credit: Walden Kirsch/Intel Corporation)

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